A5100366258- 3D IC and TSV technologies
- Electromagnetic Compatibility and Noise Suppression
- 2D Materials and Applications
- Semiconductor materials and devices
- Graphene research and applications
- Electronic Packaging and Soldering Technologies
- Photonic and Optical Devices
- Conducting polymers and applications
- Semiconductor Lasers and Optical Devices
- Integrated Circuits and Semiconductor Failure Analysis
- Advanced Sensor and Energy Harvesting Materials
- Advanced Antenna and Metasurface Technologies
- Organic Electronics and Photovoltaics
- Organic Light-Emitting Diodes Research
- Catalytic Processes in Materials Science
- Gold and Silver Nanoparticles Synthesis and Applications
- Adaptive optics and wavefront sensing
- Advanced Thermoelectric Materials and Devices
- Optical Systems and Laser Technology
- Semiconductor Quantum Structures and Devices
- Chalcogenide Semiconductor Thin Films
- Luminescence and Fluorescent Materials
- Semiconductor materials and interfaces
- Advanced biosensing and bioanalysis techniques
- Quantum Dots Synthesis And Properties
Chosun University
2018-2024
LG (South Korea)
2021-2024
Daegu Gyeongbuk Institute of Science and Technology
2024
Kyungpook National University
2024
Kyonggi University
2021-2023
Korea University
2015-2023
Inha University
2020-2022
Korea Aerospace Research Institute
2022
Dongguk University
2022
Hanyang University
2022
One of the most questionable issues in wetting is force balance that includes vertical component liquid surface tension. On soft solids, leads to a microscopic protrusion contact line, is, 'wetting ridge'. The principle determining tip geometry ridge at heart over past half century. Here we reveal universal from tips directly visualized with high spatio-temporal resolution X-ray microscopy. We find cusp bent an asymmetric tip, whose invariant during growth or by softness. This singular...
In three-dimensional integrated circuit (3D-IC) systems that use through-silicon via (TSV) technology, a significant design consideration is the coupling noise to or from TSV. It important estimate TSV transfer function and manage noise-tolerance budget in of reliable 3D-IC system. this paper, model proposed based on transmission line matrix method (3D-TLM). Using model, functions active can be precisely estimated complicated 3D structures, including TSVs, circuits, shielding structures such...
The impedance of a power-distribution network (PDN) in three-dimensionally stacked chips with multiple through-silicon-via (TSV) connections (a 3D TSV IC) was modeled and analyzed using power/ground (P/G) array model based on separated P/G chip-PDN models at frequencies up to 20 GHz. proposed modeling analysis methods for the are fundamental estimating PDN impedances ICs because they composed several chip-PDNs thousands connections. Using model, we obtained very efficient analyses...
Abstract Poly(lactide) (PLA)‐coated paperboards (PB) were prepared, and the effect of coating for improving water resistance paperboard used corrugated box liners was tested. Surface became smoother through PLA coating, their thickness weight increased depending on concentration solution. Tensile strength decreased, while elongation at break (E) after coating. All barrier properties tested, such as vapour permeability (WVP), absorptiveness (WA) contact angle (CA) drop, indicated that...
Theoretical calculations based on density functional theory were performed to provide better understanding of the size dependent electronic properties InP quantum dots (QDs). Using a hybrid approach, we suggest reliable analytical equation describe change energy band gap as function size. Synthesizing colloidal QDs with 2-4 nm diameter and measuring their optical was also carried out. It found that theoretical gaps showed linear dependence inverse gave almost identical experimental values.
Thin film-based optical sensors have been attracting increasing interest for use in developing technologies such as biometrics. Multilayered dielectric thin films with different refractive indices utilized to modulate the properties specific wavelength bands spectral selectivity of Film Narrow Bandpass Filters (TFNBFs). Progress TFNBF design has made incorporation metallic films. Narrower bandwidths higher transmittance achieved bands. In this work, Ti/TiO2/SiO2 based multilayer were...
In this paper, we present a lumped element model for coupled interconnect structures of TSV, metal interconnects, and Redistribution Layer (RDL) in Through-Silicon-Via (TSV)-based 3D IC with silicon interposer. We also analyzed the electrical characteristic coupling between interposer interconnects. The equivalent is derived verified S-parameter measurement results. metal, RDL combined interconnects EM solver simulation from proposed shows good agreement result up to 20 GHz. shielding suppress
In this paper, we propose a model for 3-D stacked on-chip power distribution networks (PDNs) in through silicon via (TSV)-based memory ICs that includes the effects of power/ground TSVs (P/G TSVs), decoupling capacitors (on-chip decaps), and substrate. modeling procedure PDNs, distributed RLGC-lumped an PDN, including decaps substrate, is proposed. Additionally, P/G TSV pair introduced. The proposed PDN combines models PDNs with pairs hierarchical order segmentation method. are successfully...
In this paper, we propose a coupling model between through silicon via (TSV) and substrate based on 3-Dimensional transmission line matrix (3D-TLM), which utilizes equivalent lumped circuit of TSV. The proposed is verified by S-parameter simulations using 3D field solver analyzed with various structural parameters: TSV diameter, distance noise source, height. Based the model, timing jitter degradation phase locked loop (PLL) caused investigated. A shielding technique guard ring structure...
The effects of slow wave and dielectric quasi-TEM modes due to MIS (Metal-Insulator-Semiconductor) structure TSV (Through-Silicon-Via) are analyzed by using the proposed model measured results. Since has larger surface, longer length, smaller insulator thickness than those conventional on-chip metal lines, stronger on electrical performance appear. After obtaining with dimension variables based measurement 3D full simulation, two characteristics in aspects signal propagation power delivery.
We report a new Schiff base fluorescent probe which senses ferric ion, Fe(III), with significant fluorescence enhancement response. The showed high sensitivity (0.8 ppb), and fast response time (<10 s) of Fe(III) in aqueous media. In addition, the ability to sense HeLa cancer cell line, very low cytotoxicity. As bio-imaging for it gave bright images confocal laser scanning microscopy (CLSM).
We experimentally demonstrated the great advantages of a high dielectric constant thin film electromagnetic bandgap (EBG) power distribution network (PDN) for suppression power/ground noises and radiated emissions in high-performance multilayer digital printed circuit boards (PCBs). Five-layer test PCBs were fabricated their scattering parameters measured. The plane noise measured, investigated related to PDN impedance. This successfully that EBG was extended more than three times, covering...
Abstract We have implemented a 240Hz 55‐inch ultra definition (UD, or 3840times2160) resolution TV panel using amorphous IGZO TFT. As the and frame rate of increase, pixel charging time transmittance ratio decrease. Among various data driving architectures, single 1G1D renders cost benefit, process competitiveness design flexibility. To apply this architecture to high resolution, mobility TFT low RC delay are required. suggest a‐IGZO copper metallization technology as solution.
3D integration of photonic nanowire waveguides is demonstrated by a precise and versatile meniscus-guided nanoprinting method. By realizing direct linking nanophotonic elements with no substrate leakage and, moreover, excellent stretchable operations (>50%), functional components multiplexers splitters are finally. As service to our authors readers, this journal provides supporting information supplied the authors. Such materials peer reviewed may be re-organized for online delivery, but not...
A resistive and capacitive (RC) microwave absorber with a layer thickness less than quarter of wavelength is investigated based on closed-form design equations, which are derived from the equivalent circuit RC absorber. The shown to have theoretical 90% absorption bandwidth 93% when electrical <TEX>$57^{\circ}$</TEX> (about <TEX>${\lambda}_0/6$</TEX>). trade-offs between also elucidated. presented formulation validated by example at 3 GHz. realized using silver nanowire rectangular structure...
In this study, we investigate the electrochemical properties of a nickel oxide-carbon (NiO/C) material, synthesized in form highly porous carbon nanofibers through electrospinning polymers such as polyacrylonitrile (PAN) and polystyrene (PS) followed by carbonization process. The primary focus work is to determine optimal mixing ratio for hybrid material composed NiO carbon. While it widely acknowledged that supercapacitor materials benefit from having high specific surface area, our...