We propose a high-frequency scalable electrical model of through silicon via (TSV). The proposed includes not only the TSV, but also bump and redistribution layer (RDL), which are additional components when using TSVs for 3-D integrated circuit (IC) design. is developed with analytic <i xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">RLGC</i> equations derived from physical configuration. Each equation as function design parameters bump, RDL,...

In content-oriented networking, content files are typically cached in network nodes, and hence how to cache is crucial for the efficient delivery storage utilization. this paper, we propose a caching scheme, WAVE, which number of chunks be adjusted based on popularity content. an upstream node recommends at its downstream node, exponentially increased as request count increases. Simulation results reveal that average hop WAVE lower than other schemes, inter-ISP traffic volume second lowest...

In three-dimensional integrated circuit (3D-IC) systems that use through-silicon via (TSV) technology, a significant design consideration is the coupling noise to or from TSV. It important estimate TSV transfer function and manage noise-tolerance budget in of reliable 3D-IC system. this paper, model proposed based on transmission line matrix method (3D-TLM). Using model, functions active can be precisely estimated complicated 3D structures, including TSVs, circuits, shielding structures such...

The impedance of a power-distribution network (PDN) in three-dimensionally stacked chips with multiple through-silicon-via (TSV) connections (a 3D TSV IC) was modeled and analyzed using power/ground (P/G) array model based on separated P/G chip-PDN models at frequencies up to 20 GHz. proposed modeling analysis methods for the are fundamental estimating PDN impedances ICs because they composed several chip-PDNs thousands connections. Using model, we obtained very efficient analyses...

The ferroelectricity in ultrathin HfO2 offers a viable alternative to ferroelectric memory. A reliable switching behavior is required for commercial applications; however, many intriguing features of this material have not been resolved. Herein, we report an increase the remnant polarization after electric field cycling, known as "wake-up" effect, terms change polarization-switching dynamics Si-doped thin film. Compared with pristine specimen, film exhibited partial finite number behaviors....

The recent demand for analogue devices neuromorphic applications requires modulation of multiple nonvolatile states. Ferroelectricity with polarization states enables various architectures. However, deterministic control ferroelectric conventional materials has been met accessibility issues. Here, we report unprecedented stable robust stability in HfO2. Through the combination voltage measurements, hysteresis temperature dependence analysis, piezoelectric force microscopy, first-principles...

Abstract Investigations concerning oxygen deficiency will increase our understanding of those factors that govern the overall material properties. Various studies have examined relationship between and phase transformation from a nonpolar to polar in HfO 2 thin films. However, there are few reports on effects deficiencies switching dynamics ferroelectric itself. Herein, we report oxygen- induced enhancement properties Si-doped By controlling annealing conditions, controlled concentration...

Prospective consecutive case series.To identify the incidence of undetected vertebral artery groove and foramen violations arterial injuries during placement C1 lateral mass C2 pedicle screws.Although insertion screws has become increasingly common, we are unaware any report that specifically examined postoperative CT scans with angiography to determine neurovascular these screws.Twenty-three patients were after upper cervical screw fixation was performed under fluoroscopic guidance. In all...

An analytic scalable model of a differential signal through-silicon via (TSV) is proposed. This TSV ground-signal-signal-ground (GSSG)-type TSV. Each proposed analytical equation in the function structural and material design parameters bump, which scalable. The successfully validated with measurements up to 20 GHz for fabricated test vehicles. Additionally, scalability verified simulations by using Ansoft HFSS vary parameters, such as diameter, pitch between TSVs, oxide thickness. On basis...

Using high-speed through-silicon via (TSV) channels is a potential means of utilizing 3-D interconnections to realize considerable high-bandwidth throughput in vertically stacked and laterally distributed integrated circuits. However, although the TSV silicon interposer channel lead significant decrease interconnect length, received digital signal after transmission through still degraded at high data-rate due nonidealities channel. Therefore, an analysis integrity necessary. In this paper,...

Objective: The purpose of this study was to develop a lexicon for 3-D hand gestures common human–computer interaction (HCI) tasks by considering usability and effort ratings. Background: Recent technologies create an opportunity developing free-form gesture HCI. Method: Subjects ( N = 30) with prior experience using 2-D on touch screens performed their choice 34 HCI rated preference, match, ease, effort. Videos the 1,300 generated were analyzed popularity, order, response times. Gesture...

Government censorship—internet shutdowns, blockages, firewalls—impose significant barriers to the transnational flow of information despite connective power digital technologies. In this paper, we examine whether and how flows across borders government censorship. We develop a semi-automated system that combines deep learning human annotation find co-occurring content different social media platforms languages. use detect between Twitter Sina Weibo as Covid-19 spread globally, conduct...

In this paper, we present a lumped element model for coupled interconnect structures of TSV, metal interconnects, and Redistribution Layer (RDL) in Through-Silicon-Via (TSV)-based 3D IC with silicon interposer. We also analyzed the electrical characteristic coupling between interposer interconnects. The equivalent is derived verified S-parameter measurement results. metal, RDL combined interconnects EM solver simulation from proposed shows good agreement result up to 20 GHz. shielding suppress

A retrospective clinical study.To estimate the recurrence rate of lumbar disc herniation after open discectomy in active young men using survival analysis.There are few reports on adults, even though this age group shows a higher incidence than other groups. In addition, most studies have reported percentages without regard to effect time course.Medical records were retrospectively reviewed and phone call surveys undertaken for 241 patients aged from 20 39 who had undergone discectomies over...

Porous β-calcium pyrophosphate (β-CPP) was developed to improve the fusion success of posterolateral lumbar (PLF). The possibility accomplishing PLF using a mixture porous β-CPP and iliac bone studied. This paper reports radiologic results plus autograft for degenerative disease as graft extender.A prospective, case-matched, radiographic study evaluating short segment performed compare efficacy with that an alone fusion. Thirty one consecutive patients (46 levels) underwent pedicle screw...

Since Internet routers are not aware of the contents being forwarded, same content file is often delivered multiple times inefficiently. Similarly, users cannot exploit a nearby copy interest unless serviced by costly delivery networks. Prior studies on content-aware routing for efficient suffer from scalability problem due to large number contents. We propose scalable routing, dubbed SCAN, which can and copies delivery. SCAN exchanges information cached using Bloom filter. Compared with IP...

In this paper, we propose a model for 3-D stacked on-chip power distribution networks (PDNs) in through silicon via (TSV)-based memory ICs that includes the effects of power/ground TSVs (P/G TSVs), decoupling capacitors (on-chip decaps), and substrate. modeling procedure PDNs, distributed RLGC-lumped an PDN, including decaps substrate, is proposed. Additionally, P/G TSV pair introduced. The proposed PDN combines models PDNs with pairs hierarchical order segmentation method. are successfully...

Some news headlines mislead readers with overrated or false information, and identifying them in advance will better assist choosing proper stories to consume. This research introduces million-scale pairs of headline body text dataset incongruity label, which can uniquely be utilized for detecting misleading headlines. On this dataset, we develop two neural networks hierarchical architectures that model a complex textual representation articles measure the between text. We also present data...

As the world becomes more digitized and interconnected, information that was once considered to be private such as one's health status is now being shared publicly. To understand this new phenomenon better, it crucial study what types of are on social media why, well by whom. In paper, we traits users who share their personal fitness related analyzing updates MyFitnessPal have via Twitter. We investigate how certain features like user profile, activity, network in can potentially impact...

Visual social media have emerged as an essential brand communication channel for advertisers and brands. The active use of hashtags has enabled to identify customers interested in their brands better understand consumers. However, some users post brand-incongruent content—for example, posts composed brand-irrelevant images with brand-relevant hashtags. Such visual information mismatch can be problematic because it hinders other consumers' search processes advertisers' insight generation from...