Wei Huang

ORCID: 0009-0006-0371-0990
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About
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Research Areas
  • Electrostatic Discharge in Electronics
  • Electromagnetic Compatibility and Noise Suppression
  • Integrated Circuits and Semiconductor Failure Analysis
  • Solid State Laser Technologies
  • Advanced Fiber Laser Technologies
  • Photorefractive and Nonlinear Optics
  • Electronic Packaging and Soldering Technologies
  • Photonic and Optical Devices
  • Hydrogen Storage and Materials
  • Semiconductor materials and devices
  • Perovskite Materials and Applications
  • Electromagnetic Compatibility and Measurements
  • Silicon Carbide Semiconductor Technologies
  • Optical Systems and Laser Technology
  • 3D IC and TSV technologies
  • Ammonia Synthesis and Nitrogen Reduction
  • Parallel Computing and Optimization Techniques
  • Low-power high-performance VLSI design
  • Optical measurement and interference techniques
  • Noncommutative and Quantum Gravity Theories
  • Optical Coatings and Gratings
  • Semiconductor Lasers and Optical Devices
  • Spectroscopy and Laser Applications
  • Advanced Electrical Measurement Techniques
  • Embedded Systems Design Techniques

Chinese Academy of Sciences
2011-2024

Institute of Acoustics
2024

Inner Mongolia Agricultural University
2024

University of California, San Diego
2024

Institute of Chemistry
2023

University of Chinese Academy of Sciences
2016-2023

Institute of Microelectronics
2023

Qingdao Institute of Bioenergy and Bioprocess Technology
2022

Changchun Institute of Optics, Fine Mechanics and Physics
2020-2022

Chongqing University
2021

Ni nanocatalysts modified with a Mo dopant and graphene support have been used as low cost catalyst Pt-like activity robust durability for hydrogen evolution from the hydrolysis of ammonia borane under ambient atmosphere at room temperature.

10.1039/c6ta02004f article EN Journal of Materials Chemistry A 2016-01-01

Temperature-aware design techniques have an important role to play in addition traditional like power-aware and package- board-level thermal engineering. The authors define the of architecture describe hotspot, accurate yet fast model suitable for computer research.

10.1109/mm.2003.1261387 article EN IEEE Micro 2003-11-01

A huge prospect of lead halide perovskites can be found in the fields optoelectronics and photocatalysis. However, main obstacle to their photocatalytic application is toxicity. To shake off these issues, lead-free Cs3Sb2I9 perovskite microcrystals with different morphologies were synthesized via a simple hot-injection approach. Furthermore, as-prepared utilized for CO2 reduction, achieving total electron yield 14.2 μmol g–1 under visible-light irradiation (λ ≥ 420 nm, 300 W Xe lamp) within...

10.1021/acsaem.1c00722 article EN ACS Applied Energy Materials 2021-06-09

With power density and hence cooling costs rising exponentially, processor packaging can no longer be designed for the worst case, there is an urgent need runtime processor-level techniques that regulate operating temperature when package's capacity exceeded. Evaluating such techniques, however, requires a thermal model practical architectural studies.This paper describes HotSpot, accurate yet fast based on equivalent circuit of resistances capacitances correspond to microarchitecture blocks...

10.1109/isca.2003.1206984 article EN 2004-03-22

A family of thermally regulated molybdate-based ionic liquids has been developed for highly efficient synthesis various flavones, imines, and benzyl benzoates through one-pot oxidative cascade catalysis.

10.1039/c9gc03646f article EN Green Chemistry 2019-11-18

This paper presents a compact thermal modeling (CTM) approach, which is fully parameterized according to design geometries and material physical properties. While most approaches facilitate characterization of existing package designs, our method better suited for preliminary exploration the space at both silicon level level. We show that achieves reasonable boundary condition independence (BCI) by comparing CTM example with BCI model benchmark ball grid array single-chip under same standard...

10.1109/tcapt.2005.859737 article EN IEEE Transactions on Components and Packaging Technologies 2005-12-01

This paper introduces a methodology to simulate the currents and fields during an air discharge electrostatic (ESD) into product by combining linear description of behavior DUT with nonlinear arc resistance equation. The most commonly used test standard IEC 61000-4-2 requires using contact-mode discharges metallic surfaces air-discharge mode nonconducting surfaces. In contact mode, ESD generator is system. highly part current loop. proposes method that combines full-wave model in mode....

10.1109/temc.2010.2087025 article EN IEEE Transactions on Electromagnetic Compatibility 2010-11-23

Electrostatic discharge (ESD) can cause interference or damage in circuits many ways e.g., by E- H-field coupling via conduction paths. Although we roughly estimate the voltage and current at injection point during an ESD event, real offending parameter is mostly spreading throughout system. Those currents be simulated if great simplifications of system are accepted. However, even moderately complex systems ability to simulate limited lack models computational resources. Independent...

10.1109/isemc.2009.5284636 article EN IEEE International Symposium on Electromagnetic Compatibility 2009-08-01

The Exciplex Pumped Alkali Laser (XPAL) system, which is similar to DPAL (Diode vapor Laser), has been demonstrated in mixtures of Cs vapor, Ar, with and without ethane. Unlike DPAL, it uses the broadband absorption blue satellite alkali D2 line, created by naturally occuring collision pairs. For example, Cs-Ar pairs have an width as wide one commercial semiconductor diode lasers. A continuous wave XPAL four-level theoretical model presented this paper. More factors are considered, such...

10.1364/oe.23.031698 article EN cc-by Optics Express 2015-11-30

Lagrangian of the Einstein's special relativity with universal parameter $c$ ($\mathcal{SR}_c$) is invariant under Poincar\'e transformation which preserves Lorentz metric $\eta_{\mu\nu}$. The $\mathcal{SR}_c$ has been extended to be one de Sitter that so called Beltrami $B_{\mu\nu}$. There are two parameters and $R$ in this Special Relativity (denote it as $\mathcal{SR}_{cR}$). Lagrangian-Hamiltonian formulism $\mathcal{SR}_{cR}$ formulated paper. canonic energy, momenta, 10 Noether charges...

10.1088/0253-6102/48/1/007 article EN Communications in Theoretical Physics 2007-07-01

Only highly sensitive probe systems can detect the weak field strengths that cause radio-frequency-interference (RFI) problems typically found within cell phones. The sensitivity of depends on factor and noise floor. effect cooling by liquid nitrogen received signal strength floor three resonant has been investigated. They operate at GSM, GPS, WiFi frequency bands. Cooling increases Q-factor these probes, signal, lowers system, defined as which Signal-to-Noise Ratio is equal to 0 dB improves 3-6 dB.

10.1109/isemc.2013.6670396 article EN IEEE International Symposium on Electromagnetic Compatibility 2013-08-01

This paper presents a system for simultaneous wireless power and data transfer (SWPDT) over single inductive link. We design the frequency-splitting link to address trade-off between high efficiency (PTE) rate (DR). An active rectifier is designed conversion efficiency. Forward communication based on frequency-shift keying (FSK) modulation support DR transmission while delivering uninterrupted power. Moreover, we proposed low-power FSK demodulation circuits further improve energy of...

10.1109/access.2023.3298052 article EN cc-by IEEE Access 2023-01-01

The current IEC 61000-4-2 (2008) standard does not provide calibration specifications for electrostatic discharge (ESD) generators in the air-discharge mode. This is largely due to well-known fact of poor repeatability measurements. complicates identifying an acceptable tolerance range a reference waveform air discharge. variability waveforms caused by variations spark length. A novel method proposed, which avoids sparking. based on measuring step response ESD generator mode using...

10.1109/temc.2017.2776749 article EN publisher-specific-oa IEEE Transactions on Electromagnetic Compatibility 2017-12-06

When a charged cable is plugged into an Ethernet connector, discharge event (CDE) will occur. transceiver pins are often affected by CDE as they usually unshielded. The current couples via the transformer and common mode chokes to physical layer-integrated circuit may damage it. This paper describes methodology for system-level modeling in SPICE taking geometry account full-wave cross-sectional analysis. A model, nonlinear magnetics pin traces system combined create complete model. An...

10.1109/temc.2016.2581884 article EN publisher-specific-oa IEEE Transactions on Electromagnetic Compatibility 2016-07-18

previously a measurement technique for ESD current spreading on PCB using near field scanning was developed in order to connect the local sensitivity system level failures time and spatial domain. The concept of such methodology is proved several results were processed. However validation, precision weakness need be further investigated before application complex circuit or system. This article investigates reconstruction by methodology. It studies probe factors including coupling frequency...

10.1109/apemc.2010.5475504 article EN 2010-01-01

Near-field scanning systems are a tool for root-cause ESD, EMI, and immunity analysis of electronic systems, as well qualification methodology ICs modules. For emissions, they have developed into standardized method. Development universally accepted file formats data exchange is on-going. Four main types been implemented by this other authors: near-field EMI scanning, ESD radiated resonance scanning. This article concentrates on newly added method automated EMC system analysis.

10.1109/emceurope.2008.4786897 article EN 2022 International Symposium on Electromagnetic Compatibility – EMC Europe 2008-09-01

Cooling costs for notebook, desktop, and server computer systems are rising exponentially as power densities high-performance chips continue to double every three years. Research has led a range of advances in modeling design thermal packaging circuit boards. Yet major front that been absent is the architecture domain, where processor utilization, interleaving different computation processes, flow instructions through CPU controlled. The domain presents rich opportunity management...

10.1109/esime.2004.1304072 article EN 2004-06-30

A fully automated system is developed for the systematic characterization of soft failure robustness a DUT. The methodology founded on software-based detection methods and applied to USB3 interface. approach extendable other interfaces measurement-based methods.

10.23919/eos/esd.2018.8509693 article EN 2018-09-01

A Cable Discharge Event (CDE) is an electrostatic discharge between a cable and connector. CDEs occur on unshielded Ethernet based communication interfaces inject currents into the pins directly [1-3]. The charging processes are in general understood; however, complicated due to number of involved their connections system. Based understanding factors which determine severity CDE, this article describes how setup variety repeatable CDE tests analyze measurement results.

10.1109/isemc.2014.6898988 article EN 2014-08-01
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