- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Aluminum Alloys Composites Properties
- Aluminum Alloy Microstructure Properties
- Copper Interconnects and Reliability
- Ultrasonics and Acoustic Wave Propagation
- Surface Modification and Superhydrophobicity
- Advanced materials and composites
- Crystallography and molecular interactions
- Acoustic Wave Phenomena Research
- Perovskite Materials and Applications
- Supramolecular Self-Assembly in Materials
- Microstructure and mechanical properties
- Electromagnetic wave absorption materials
- Injection Molding Process and Properties
- MXene and MAX Phase Materials
- Crystallization and Solubility Studies
- Plasma Applications and Diagnostics
- 2D Materials and Applications
- Chemical Synthesis and Analysis
- Copper-based nanomaterials and applications
- Composite Material Mechanics
- Fiber-reinforced polymer composites
- Advanced Manufacturing and Logistics Optimization
- Solidification and crystal growth phenomena
Ningbo University
2024
Institute of High Pressure Physics
2024
Chongqing University of Arts and Sciences
2024
Shangqiu Normal University
2024
Dalian University of Technology
2005-2023
Dalian University
2011
Multilayer additive hot-compression bonding (MAHCB) was a new technology to prepare large-size homogeneous materials, the strain hardening at interface an urgent issue for its application. In this paper, effect of grain boundary migration on studied by MAHCB process pure copper. The results show that prolonging holding time can significantly promote both interfacial (IGBM) and matrix (MGBM). became tortuous due promotion IGBM, accompanied reduction in dislocation density gradual elimination...
First-principles calculations were conducted to investigate the structural, electronic and magnetic properties of single Fe atoms dimers on Cu2N/Cu(100). Upon adsorption an atom onto Cu2N/Cu(100), robust Fe-N bonds form, resulting in incorporation both within surface Cu2N layer. The partial occupancy Fe-3d orbitals lead large spin moments atoms. Interestingly, exhibit in-plane anisotropy, with anisotropy energy (MAE) dimer exceeding twice that a atom. This can be attributed predominant...
Abstract The layout design of a satellite module is complex mechanical problem. Its main difficulties lie in combinatorial explosion computational complexity, engineering and applicability practice. Inspired by the human-computer cooperation ideas, human–computer co-operative co-evolutionary method for optimising developed. This constructs diversity reference set using intelligence solutions (DIs) that are created operators differential evolution (DE) blend crossover operator (BLX-a). During...
High-intensity pulsed ion beam (HIPIB) irradiation at 300 A/cm2 with a shot number of 1, and 5 was performed on the coatings caused modification properties. Porosity rough surface EB-PVD (Electron Beam-Physical Vapor Deposition) deposited ZrO2-7%Y2O3 thickness 150 μm heat-resistant steel have been characterized using ultrasonic reflection coefficient phase spectrum. With increasing number, remelting ablating filled gaps caves between columns, induced more uniform compact structure. The...
In this study, we reported a plasma method to generate the cold pulsed glow discharge for large-area surface modifications of various polymers, such as polyethylene (PE), terephthalate (PET), polypropylene (PP), and polytetrafluoroethylene (PTFE). The plasmas consisting glow-like breakdowns with peak widths several microseconds may efficiently prevent heat-sensitive materials from being damaged greatly improve properties treated polymers. Analysis indicates that parameters, pressure gas...
The interfacial intermetallic compound (IMC) is a crucial factor for solder jointing reliability assessment and suitable IMC layer size guarantees the quality of joints. On one hand, grains keep growing with reaction time during soldering; other coming universal application 3D electronic packaging in modern electron industry, multiple reflows become common soldering technology at same time, which result much longer effective materials. In this case, IMCs solder/substrate interface should...
To overcome PLLA�s poor crystallization capability, using nucleating agent as improvement strategy was performed in this study. PPAPH an organic firstly synthesized, and then PLLA blended with different loading through melting blend method, the resulting influences of on performances were investigated relevant testing instruments. Melt-crystallization revealed that played important role promoting providing effective sites heterogeneous nucleation, effect melt-crystallization very poor,...
In this study, a benzoselenadiazole- and pyridine-bifunctionalized hydrogen-bonded arylamide foldamer was synthesized. A co-crystallization experiment with 1,4-diiodotetrafluorobenzene showed that new type of supramolecular double helices, which were induced by three orthogonal interactions, namely, three-center hydrogen bonding (O⋯H⋯O), I⋯N halogen Se⋯N chalcogen bonding, have been constructed in the solid state. This work presents novel instance multiple non-covalent interactions together...
Abstract Atomically-thin two-dimensional (2D) transition metal dichalcogenides (TMDs) have emerged as an ideal platform for both physics investigation and device applications. By stacking different layers into homo- or hetero-structures, extra degree of freedom is involved in further tuning their properties, thereby boosting scenarios twistronics, moiré photonics optoelectronics. However, interfacial imperfections such contaminations cracks, frequently occur during the layer sequence...
With KMnO4 as the oxidant and MnSO4 manganese source, chemically synthesised α-MnO2 powder was carried out to investigate effects of temperature time on microstructure microwave electromagnetic properties Ni doped α-MnO2. The obtained samples were characterised by XRD, SEM, vector network analysis. results showed that products would transmit from γ-MnO2 Mn3O4, when increased 100°C with 3 h reaction in certain conditions, morphologies did not change remarkably dielectric property had a big...
An layer of Cu <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">6</sub> Sn xmlns:xlink="http://www.w3.org/1999/xlink">5</sub> intermetallic compound (IMC) is formed during the interfacial reactions between lead-free solder and substrate, it plays a pivotal role in reliability joint. There are two different growth morphologies grains-scalloped grain prism grain. Scallop grains commonly at interface heating up isothermal heating. Its behavior can...
We show that two two-level atoms coupled simultaneously with a third dissipated atom would end up entangled states. The dissipation of the is supposed to come from its coupling noises adjustable intensity. Two kinds noise, white noise and squeezing are identified possess ability help preparation entanglement. confirm entanglement maximized for intermediate values intensity all in ground state, while it monotonic function spontaneous rates.