A5095373025- Injection Molding Process and Properties
- Epoxy Resin Curing Processes
- Polymer crystallization and properties
- Photopolymerization techniques and applications
- Thermal and Kinetic Analysis
Robert Bosch (Germany)
2024
Universität Ulm
2024
Monitoring of molding processes is one the most challenging future tasks in polymer processing. In this work, situ monitoring curing behavior highly filled EMCs (silica filler content ranging from 73 to 83 wt%) and effect load on kinetics are investigated. Kinetic modelling using Friedman approach was applied real-time process data obtained DEA measurements, these online kinetic models were compared with analysis offline DSC measurements. For an autocatalytic fast-reacting material be...
An epoxy compound’s polymer structure can be characterized by the glass transition temperature (Tg) which is often seen as primary morphological characteristic. Determining Tg after manufacturing thermoset-molded parts an important objective in material characterization. To characterize quantitatively dependence of on degree cure, DiBenedetto equation usually used. Monitoring network formation during molding processes therefore one most challenging tasks processing and achieved using...
The in-line control of curing during the molding process significantly improves product quality and ensures reliability packaging materials with required thermo-mechanical adhesion properties. choice morphological properties molded material, accuracy their determination through carefully selected thermo-analytical methods, play a crucial role in qualitative prediction trends as parameters are varied. This work aimed to verify models validation using highly filled resin an identical chemical...