A5106407617- Semiconductor materials and devices
- Additive Manufacturing and 3D Printing Technologies
- Advanced materials and composites
- Advanced biosensing and bioanalysis techniques
- Advancements in Photolithography Techniques
- Electrochemical sensors and biosensors
- Electronic and Structural Properties of Oxides
- Advanced Sensor and Energy Harvesting Materials
- Advanced Cellulose Research Studies
- Tactile and Sensory Interactions
- biodegradable polymer synthesis and properties
- Advanced Nanomaterials in Catalysis
- Catalytic Processes in Materials Science
- Nanocomposite Films for Food Packaging
Southern University of Science and Technology
2024-2025
Hangzhou Dianzi University
2018
Abstract Fully biodegradable packaging materials are demanded to resolve the issue of plastic pollution. However, fresh food storage performance is generally much lower than that plastics due their high permeability, microbial friendliness, and limited stretchability transparency. Here a material reported with based on an oil‐infused bacterial cellulose (OBC) porous film. The oil infusion significantly improved cellulose's food‐keeping by reducing its gas increasing transparency, enabling...
Abstract Stretchable electronics commonly assemble multiple material modules with varied bulk moduli and surface chemistry on one packaging substrate. Preventing the strain-induced delamination between module substrate has been a critical challenge. Here we develop that delivers mechanically stable module/substrate interfaces for broad range of stiff stretchable chemistries. The key design was to introduce module-specific stretchability universal adhesiveness by regionally tuning molecular...
Bottom-up microfabrication based on vapor-phase depositions (e.g., sputtering and atomic layer deposition) requires patterning resists that can endure the parasitic thermal treatment during deposition. Conventional polymeric encounter removability issues due to thermally induced carbonization at interface, while emerging molecular face challenges of hermeticity shape retention in bulk. Here, we introduce a paste-like resist with high interfacial bulk stability, which leads multifaceted...
Atomic layer deposition (ALD) is an essential thin film fabrication technique widely used in electronic and energy systems, but avoiding ALD untargeted areas has been a long-standing challenge that excludes the possibility of creating patterns through bottom-up processes. We present liquid sealing strategy to prevent unwanted by combining shadow masks with viscous perfluoropolyether oil conformally fulfills all gaps between mask substrate down molecular level. Due anti-adsorption...