A5103576600- Integrated Circuits and Semiconductor Failure Analysis
- Advanced Surface Polishing Techniques
- Surface Roughness and Optical Measurements
- Nuclear Engineering Thermal-Hydraulics
- Laser Material Processing Techniques
- Industrial Vision Systems and Defect Detection
- Advanced Optical Sensing Technologies
- Spectroscopy and Laser Applications
- Heat Transfer Mechanisms
- Nanomaterials and Printing Technologies
- Granular flow and fluidized beds
- Force Microscopy Techniques and Applications
- Semiconductor Lasers and Optical Devices
- Geographic Information Systems Studies
- Optical Systems and Laser Technology
- Advanced Fiber Laser Technologies
- Risk and Safety Analysis
- Advanced Sensor and Energy Harvesting Materials
- Nuclear Materials and Properties
- Geological Modeling and Analysis
- Terahertz technology and applications
- Laser-Matter Interactions and Applications
- Combustion and Detonation Processes
- Tactile and Sensory Interactions
- Photonic and Optical Devices
State Key Laboratory on Integrated Optoelectronics
2025
University of Shanghai for Science and Technology
2024
Argonne National Laboratory
1995-2007
Flexible electronic circuits are critical in biomedical devices, human–machine interfaces, and wearable sensing systems, which further require flexible conductive materials with high conductivity, stretchability, electrical stability. Liquid metal (LM) has attracted much attention due to its unique metallic conductivity room-temperature fluidic properties. However, LM's surface tension properties increase the difficulty of patterning processing. Here, we report a scalable simple fabrication...
Silicon wafers are used as the substrates upon which over 90% of semiconductor devices manufactured. A series processes needed to manufacture silicon wafers. Some will induce SubSurface Damage (SSD) that should be eliminated by subsequent processes. Therefore, assessment SSD is critically important optimise manufacturing and ensure high quality In this paper, a novel non-destructive method introduced for measuring in wafers, cross-polarisation confocal microscopy. This paper also presents...
As a nondestructive evaluation method, laser scattering has been applied for subsurface damage measurement in silicon wafers. Previous results showed that can detect and distinguish of different depths. However, quantitative correlation between scatter data depth not established. This paper presents an analysis on how to use the 'skin depth' correlate optical obtained at wavelengths with The clearly demonstrate wafers be quantitatively assessed by method.
Silicon is widely used in semiconductor industry. Over 90% of all devices are manufactured upon silicon substrates (wafers). Many manufacturing processes needed for the wafer preparation. In order to ensure high quality wafers, damaged layer induced by each process must be reduced or eliminated its subsequent processes. So, it critical assess subsurface damage (SSD). As a nondestructive measurement method, laser scattering preliminarily applied measure SSD wafers. Optical transmission...
As a nondestructive measurement method, laser scattering has been preliminarily applied to detect subsurface damage in silicon wafers, but the quantitative correlation between scatter images and depth not established yet. In order assess systematic study carried out. authors’ another paper, detailed experimental investigation on optical transmission percentage of wafers was presented. follow up, this paper will describe method calculate “skin depth” from data percentage. And also, how apply...
To construct an accurate 3D geological model of the grid engineering tower scene, we propose a method for modelling towers on basis borehole data.The generates more by improving Delaunay triangulation algorithm and combining it with Kriging interpolation to process data.Furthermore, detailed adjustment is achieved through introduction profiles.The constructed using operational area power survey as case study, thereby accurately reflecting conditions region.The results testing demonstrate...
Heat transfer coefficients for a surface continuously impacted by stream of falling particles in air and helium were measured as functions particle flux velocity. The purpose was to provide well-controlled data clarify the mechanisms heat suspension flows. spherical glass beads with mean diameters 0.5, 1.13, 2.6 mm. distribution impact on determined deconvolution from measurement total solid masses collected at both sides movable splitter plate. velocity calculated simple, well-established...