Advanced cooling solutions are needed to address the growing challenges posed by future generations of microprocessors. This paper outlines an optimization methodology for electronic system based thermoelectric (TE) cooling. study stresses that optimum TE should keep device below a critical junction temperature while utilizing smallest possible heat sink. The considers electric current and geometry will minimize temperature. A comparison is made between minimization scheme more conventional...

Due to its inherently favorable properties, doped single-crystal silicon has potential application as an on-chip thermoelectric microcooler for advanced integrated circuits. In this paper, analytical thermal model microcooler, which couples Peltier cooling with heat conduction and generation in the substrate, includes metal lead, is derived used study characteristics of microcoolers. The modeling results are shown be good agreement experimental data from electrothermal numerical simulations....

Forced convection cooling of a personal computer microprocessor, using power generated by thermoelectric (TE) conversion, has been modeled, analyzed, and demonstrated. This study was motivated the desire to meet demanding requirements notebook computers without consuming valuable battery power. The modest TE necessitated careful match between device fan/heat-sink sub-system. models methodology used maximize capability TE-powered are presented experimentally validated prototype. In...

A novel ldquoshunt attachrdquo configuration for chip-scale thermoelectric (TE) generation of electric power from microprocessor waste heat is described, modeled, and parametrically analyzed. The generated electricity used to drive a cooling fan that convectively cools the chip. prototype using heat-driven through off-the-shelf TE modules low-voltage was built successfully applied thermal management high-power mobile processor in portable equipment form factor.

Driven by shrinking feature sizes, microprocessor “hot-spots” — with their associated high heat flux and sharp temperature gradients have emerged as the primary “driver” for on-chip thermal management of today’s IC technology. Solid state thermoelectric micro-coolers offer great promise reducing severity “hot-spots”, but theoretical cooling potential these devices, fabricated on back silicon die in an package, has yet to be determined. The results a three-dimensional electro-thermal...

The characterization of thermal interface materials in electronic applications is necessary to ensure timely product launches. A tester has been developed at Intel screen grease, phase change, and elastomer type materials, without having go through the time expense completing package level measurements. was designed test controlled bond line thickness pressures, while being able directly measure thickness. capable evaluating an material impedance with a reproducibility 0.03/spl deg/C/sup...

It has been well established that thermal management of electronic equipment is critical for the continued success microelectronics industry. Portable devices, such as notebook computers and cellular telephones, require solution be small, light, energy efficient. Small-scale thermoelectric (TE) technology used to generate electricity from waste heat microprocessor provides an opportunity de-couple battery power. Suski proposed concept using a TE module in patent. The configuration shown...

Heat sinks are widely used for cooling electronic packages. Typically, a highly conductive thermal interface material is to enhance heat transfer from the package sink. One such grease, which has advantage of conforming sink and surfaces. This paper focuses on application grease Plastic Pin Grid Array (PPGA) packages modeling resulting between PPGA An experiment was performed obtain "bulk" "apparent" conductivity grease. It observed that apparent lower than bulk conductivity, particularly...

It is well established that the power dissipation for electronic components increasing. At same time, high performance portable equipment with volume, weight, and limitations are gaining widespread acceptance in marketplace. The combination of above conditions requires thermal solutions yet small, light, efficient. This paper explores possibility using thermoelectric (TE) refrigeration as an integrated solution accounting heat sink interface material resistances. current study shows TE can...

Thermal interface materials (TIMs) are commonly used to reduce the thermal resistance between an electronic device and its cooling solution. The performance of a TIM is very sensitive bond line thickness, hence, warpage profiles mating surfaces. contact surfaces usually never perfectly flat due manufacturing process induced in heat sinks packages. This paper focuses on simplified numeric approach simulate non-flat modeling uses "equivalent" conductivity rather than building actual surface...

Localized areas of high heat flux on microprocessors are currently being identified as a dominant challenge for the thermal management community. Heat values up to 1 kW/cm2 prevailing over fraction overall CPU surface area create local hot spots that need be cooled. However, solutions designed maximum overcool rest CPU, wasting resources and creating large on-die temperature gradients. Wasting obviously has negative economic thermodynamic impact. it been argued gradients reduce chip...

The electronics industry has traditionally cooled critical components using a simple fan/heat sink assembly. Each advance in IC fabrication technology resulted the need for higher performance thermal solution, stressing limits of conventional technology. A possible solution to relieve pressure being placed on future is incorporate thermoelectric (TE) cooling into configuration. It been established that when TE electronic applications entire system needs be optimized simultaneously. This...

Rapid expansion of the portable computing market segment coupled with ever increasing power dissipation and severe battery limitations are combining to bring new importance development minimum-energy thermal solutions for notebook-type computers. Passive cooling provides a very attractive management option such systems. Determination amount heat that can be passively dissipated from outer surfaces notebook computer designers well-defined performance target quantitative demarcation between...

The ITRS roadmap indicates the thermal solution for high performance and cost computers must improve by a factor of two over next decade to keep pace with development electronic equipment. However, does not address spatially non-uniform heating issues caused densely routed circuitry. localized heat fluxes that occur due require an even more aggressive ensure circuit temperature stays below specified value. An approach mitigating effect "hot spots" is spread some from flux areas lower on chip...

Thermal interface materials (TIM's) were widely used to reduce thermal resistance between the electronic device and cooling solution. One typical TLM is phase-change material (PCM) which melts after starts power up. A survey of commercially available PCMs was performed. characterization these conducted by using guarded heater based on ASTM D5470. The results are compared suppliers' data sheets. In addition, test vehicle with single edge contact (S.E.C.) cartridge form factor also as a...

Abstract Thermal interface material (TIM) between the die and heat spreader or sink in any electronic package plays a very important role thermal management of cooling. Due to increased power density high-performance TIMs are sought every day. Phase change materials (PCM) seem be good alternative traditionally used greases because various reasons. These phase also have advantage being reworked easily without damaging die. Typically these polymer based particle laden enhance their...

It has been well established that thermal management of electronic equipment is a critical need for the continued success microelectronics industry. Portable devices, such as notebook computers and cellular telephones, require solution be small, light, energy efficient. Small-scale thermoelectric (TE) modules can used to generate electricity from waste heat microprocessor. The then power solution. concept using TE module microprocessor in computer class device discussed by Solbrekken, et....

As part of the Global Threat Reduction Initiative (GTRI) Reactor Conversion program, fuel assembly at University Missouri Research (MURR) is undergoing a significant redesign. The proposed structure based on low-enriched uranium foils. aluminum-clad LEU foil plates for MURR core are significantly thinner than currently used plates. Further, monolithic fundamentally different current design powder metallurgy. Consequently, coolant flow reduction due to induced deformation concern. goal...

The electronics industry has relied heavily on air cooling to dissipate waste heat. Each new generation of technology is smaller and more powerful, pushing the limits air-cooled heat sinks. A competing constraint that thermal solutions need be lighter, particularly for portable devices. viable strategy extend sinks in a mass effective way thermoelectric (TE) cooling. In general, limiting COP currently available TE materials requires modules operated at near optimum conditions. conventional...

This paper considers a composite cylindrical structure, with low-enriched uranium (LEU) foil enclosed between two aluminum 6061-T6 cylinders. A recess is cut all around the outer circumference of inner tube to accommodate LEU open-cross section. To obtain perfect contact at interfaces and tubes, an internal pressure applied tube, thereby plastically elastically deforming it. The residual stresses resulting from assembly process are used along thermal stress model predict margins in cladding...