Somesh Kumar

ORCID: 0000-0001-8712-1646
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About
Contact & Profiles
Research Areas
  • Low-power high-performance VLSI design
  • Neural Networks and Applications
  • 3D IC and TSV technologies
  • Semiconductor materials and devices
  • Copper Interconnects and Reliability
  • Antenna Design and Analysis
  • Image Processing Techniques and Applications
  • Advancements in Semiconductor Devices and Circuit Design
  • Advanced Memory and Neural Computing
  • Graphene research and applications
  • Fuzzy Logic and Control Systems
  • Electromagnetic Compatibility and Noise Suppression
  • VLSI and FPGA Design Techniques
  • Microwave Engineering and Waveguides
  • Quantum-Dot Cellular Automata
  • Quantum Computing Algorithms and Architecture
  • Antenna Design and Optimization
  • Integrated Circuits and Semiconductor Failure Analysis
  • Advanced Fluorescence Microscopy Techniques
  • Quantum Information and Cryptography
  • COVID-19 diagnosis using AI
  • Electronic Packaging and Soldering Technologies
  • Energy Efficient Wireless Sensor Networks
  • Advanced Neural Network Applications
  • Electrostatic Discharge in Electronics

Atal Bihari Vajpayee Indian Institute of Information Technology and Management
2019-2025

Imperial College London
2021

The Francis Crick Institute
2021

Indian Institute of Technology Kharagpur
2004-2020

Indian Institute of Technology Ropar
2014-2018

Indian Institute of Information Technology, Nagpur
2018

Institute of Engineering
2016

Indian Institute of Technology Delhi
2015

Panjab University
2013

Sharda University
2013

The automatic detection of diseases in plants is necessary, as it reduces the tedious work monitoring large farms and will detect disease at an early stage its occurrence to minimize further degradation plants. Besides decline plant health, a country’s economy highly affected by this scenario due lower production. current approach identify expert slow non-optimal for farms. Our proposed model ensemble pre-trained DenseNet121, EfficientNetB7, EfficientNet NoisyStudent, which aims classify...

10.3390/agriculture11070617 article EN cc-by Agriculture 2021-06-30

Summary In this article, a two‐port multiple‐input multiple‐output (MIMO) hybrid rectangular dielectric resonator antenna (DRA) with machine learning (ML) approach for the n261 5G New Radio (NR) application is presented. The proposed designed on an RT/duroid 5880 (Ɛr = 2.2) substrate activated by 50 Ω, L‐shaped microstrip slot feeds beneath both DRAs. isolation more than 19 dB, and gain 10 dBi in operating frequency range. optimized through knowledge‐based neural networks (KBNN), artificial...

10.1002/dac.5898 article EN International Journal of Communication Systems 2024-07-08

AbstractThe integration of process planning and scheduling is considered as a critical component in manufacturing systems. In this paper, multi-objective approach used to solve the problem. Three different objectives work are minimisation makespan, machining cost idle time machines. To problem, we propose an improved controlled elitist non-dominated sorting genetic algorithm (NSGA) take into account computational intractability An illustrative example five test cases have been taken...

10.1080/00207543.2014.957872 article EN International Journal of Production Research 2014-09-18

In this article, an artificial neural network (ANN) is developed in order to predict the per-unit-length (p. u. l.) parameters of hybrid copper-graphene on-chip interconnects from a prior knowledge their structural geometry and layout. The salient feature proposed ANN that it combines p. l. extracted empirical models along with rigorous full-wave electromagnetic solver. As result, referred as knowledge-based (KBNN). KBNN has been found converge same accuracy conventional but at expense far...

10.1109/temc.2021.3091714 article EN IEEE Transactions on Electromagnetic Compatibility 2021-07-21

An integrated circuit (IC), or chip, is a set of electronic circuits and components placed on tiny planar silicon (Si) semiconductor substrate. These electronics are electrically connected to one another with the help vertical conductor elements known as <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">interconnects</i> . This article presents detailed overview evolution interconnects, highlighting technological milestones that have been...

10.1109/mmm.2021.3136268 article EN IEEE Microwave Magazine 2022-07-07

Planar copper interconnects suffer from surface roughness that results in performance degradation. This paper presents a novel analytical model for calculation effective resistivity and mean free path on-chip interconnects. The closed form expressions are obtained generalized grain boundary scattering approach is combined with Mandelbrot-Weierstrass (MW) fractal function. It observed increases while reduces significantly rough when compared of smooth lines. Current future technology nodes...

10.1109/tetc.2016.2597542 article EN IEEE Transactions on Emerging Topics in Computing 2016-08-03

Security is a mandatory issue in any network, where sensitive data are transferred safely the required direction. Wireless sensor networks (WSNs) formed hostile areas for different applications. Whatever application, WSNs must gather large amount of and send them to an authorized body, generally sink. WSN has integrated with Internet-of-Things (IoT) via internet access nodes along internet-connected devices. The gathered IoT enormous, which eventually collected by over Internet. Due several...

10.3390/electronics10192365 article EN Electronics 2021-09-28

10.1016/j.camwa.2010.03.061 article EN Computers & Mathematics with Applications 2010-04-26

In planar on-chip copper interconnects, conductor losses due to surface roughness demands explicit consideration for accurate modeling of their performance metrics. This is quite pertinent high-performance manycore processors/servers, where interconnects are increasingly emerging as one the key bottlenecks. paper presents a novel analytical model parameter extraction in current and future interconnects. Our proposed aids analyzing impact spatial vertical on electrical performance. analysis...

10.1109/tmscs.2017.2696941 article EN IEEE Transactions on Multi-Scale Computing Systems 2017-04-24

10.1016/j.cryogenics.2004.03.008 article EN Cryogenics 2004-05-11

In multigigahertz integrated circuit design, the extra delay and power losses due to surface roughness in copper (Cu) interconnects is more evident than ever before needs utmost consideration. This paper reports novel closed-form expressions for parameter extraction chip-tochip Cu at several gigahertz frequency ranges considering experimentally measured fractal roughness. Backplane (BP) printed board (PCB) links are considered here study effect of chip-to-chip interconnects. Our proposed...

10.1109/tcpmt.2017.2774252 article EN IEEE Transactions on Components Packaging and Manufacturing Technology 2017-12-13

Aggressive scaling of on-chip interconnects results in significantly higher coupling capacitance, which crosstalk effects as we enter the end-of-the-roadmap era. Moreover, surface roughness is seen a major contributor to conductor losses that further exacerbates these crosstalk-induced effects. This article reports an exhaustive analysis effects, considering interconnect at current and future technology nodes (i.e., 13 7 nm), for global copper interconnects. The role repeater insertion rough...

10.1109/tcpmt.2019.2941871 article EN IEEE Transactions on Components Packaging and Manufacturing Technology 2019-09-17

Humans have a remarkable ability to learn continuously from th e environment and inner experience. One of the grand goals robots is build an artificial "lifelong learning" agent that can shape cultivated understanding world current scene previous knowledge via autonomous lifelong development. It challenging for robot learning process retain earlier when encounter new tasks or information. Recent advances in computer vision deep -learning methods been impressive due large-scale data sets,...

10.1109/mra.2020.2987186 article EN IEEE Robotics & Automation Magazine 2020-06-01

Threat assessment is the continuous process of monitoring threats identified in network real-time informational environment an organisation and business companies. The sagacity security assurance for system company’s seem to need that information exercise unambiguously effectively handle threat agent’s attacks. How this unambiguous effective way present-day state practice working? Given prevalence modern environment, it essential guarantee national infrastructure. However, existing models...

10.3390/electronics10151849 article EN Electronics 2021-07-31

With the demand of 3G wireless network access is increasing, high performance Wide Band Code Division Multiple Access (WCDMA) transceivers are needed. Low Noise Amplifier (LNA) key component WCDMA transceivers. In this paper, we designed various configurations LNA (Single-ended LNA, Differential Current-reuse LNA) at 180nm technology and compared their metrics. The for low power, gain applications it provides a series good in Fig. (NF), Linearity, Power consumption merit (FOM). Our analysis...

10.1109/pcitc.2015.7438205 article EN 2015-10-01

We develop graph theoretic methods for analyzing maximally entangled pure states distributed between a number of different parties. introduce technique called bicolored merging, based on the monotonicity feature entanglement measures, determining combinatorial conditions that must be satisfied any two distinct multiparticle to comparable under local operations and classical communication. present several results possibility or impossibility comparability multipartite states. show there are...

10.1063/1.2142840 article EN Journal of Mathematical Physics 2005-12-01

In this article, a closed-form matrix rational approximation (MRA) model is presented for the reliability assessment of copper-graphene hybrid on-chip interconnect networks. The key feature MRA its capacity to predict how different values temperature and dielectric roughness affect signal integrity performance As result, proposed well suited very fast parametric sweeps worst case analysis networks, which has not been possible using existing models or even SPICE simulations. Numerical...

10.1109/tcpmt.2020.3004414 article EN IEEE Transactions on Components Packaging and Manufacturing Technology 2020-06-23

At sub-22nm technology nodes, size effects play a prominent role in the performance degradation of Cu interconnects. Several scattering mechanisms contribute to effects, including surface roughness and grain boundary as sizes decreases with reduced line widths. Due these phenomena, resistivity interconnects increases drastically, which leads electrical thermal reliability issues. To address limitations, researchers have proposed Cu-Graphene hybrid interconnects, where resistance due Graphene...

10.1109/ectc32862.2020.00254 article EN 2020-06-01
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