- Laser Material Processing Techniques
- Advanced Surface Polishing Techniques
- Optical Coherence Tomography Applications
- Advanced machining processes and optimization
- Advanced Measurement and Metrology Techniques
- Optical Systems and Laser Technology
- Photoacoustic and Ultrasonic Imaging
- Ocular and Laser Science Research
- Laser-induced spectroscopy and plasma
Aschaffenburg University of Applied Sciences
2022-2023
We report on a comprehensive study of laser percussion microvia drilling FR-4 printed circuit board material using ultrashort pulse lasers with emission in the green spectral region. Laser durations pico- and femtosecond regime, repetition rates up to 400 kHz fluences 11.5 J/cm2 are applied optimize quality microvias, as being evaluated by generated taper, extension glass fiber protrusions damage inner lying copper layers materialography. The results discussed terms ablation threshold for...
Abstract We report on the characterization of a hybrid laser scanning system using acousto-optical deflectors in combination with galvanometer scanners for ultra-short pulse material processing. The is characterized by roundness static pulsed ablations metal thin film transparent substrate within field at different scanner deflection angles and focal positions. An ablation more than 90% reached defocusing range 200 $$\upmu \text{m}$$ <mml:math xmlns:mml="http://www.w3.org/1998/Math/MathML">...
Abstract We report on a comprehensive study of laser percussion microvia drilling Ajinomoto build-up film (ABF) material using an ultrashort pulsed in MHz burst mode. After processing, quality is being evaluated by the fabricated diameter and taper scanning microscopy metallography. The influences incubation effect, heat accumulation shielding effects as result pulse to interactions are discussed ablation threshold, penetration depth quality. find that increasing mode processing responsible...
We report for the first time on realization, characterization and application of an ultrashort pulsed laser robot system flexible large-area 2D 3D micromachining with 6 articulated axes. To characterize dynamic positioning beam during after axes movement, CMOS image sensors were integrated into path. A method introduced alignment optical allows a reduction deviations in to less than 141.8 ± 92.9 μm within 110° rotation range axis 4. In addition, high repeatability 102.2 is demonstrated over...
We demonstrate an innovative beam stabilization concept consisting of complementary metal-oxide semiconductor cameras and piezo actuators for a six-axis articulated ultrashort pulsed laser robot system. The system is fixed on axes 4 5. Moving axis 5 in angular range between 0° 90°, the position coupled to actual monitored by two integrated used characterization model generation. A mathematical description models generated with machine learning methods, namely, linear regression neural...