A5084253238- Microstructure and mechanical properties
- Aluminum Alloy Microstructure Properties
- Metallurgy and Material Forming
- Material Properties and Applications
- Advanced materials and composites
- Microstructure and Mechanical Properties of Steels
- Advanced Materials Characterization Techniques
- Material Properties and Failure Mechanisms
- Metal Forming Simulation Techniques
- Aluminum Alloys Composites Properties
- Metal Alloys Wear and Properties
- Polymer Science and Applications
- High-Velocity Impact and Material Behavior
- High Temperature Alloys and Creep
- Surface Treatment and Residual Stress
- Metal and Thin Film Mechanics
- Metallurgical and Alloy Processes
- nanoparticles nucleation surface interactions
- Intermetallics and Advanced Alloy Properties
- Structural Health Monitoring Techniques
- Semiconductor materials and interfaces
- Geotechnical and Geomechanical Engineering
- Quasicrystal Structures and Properties
- High-pressure geophysics and materials
- Thermodynamic and Structural Properties of Metals and Alloys
Tomsk State University of Architecture and Building
2016-2025
University of Architecture, Civil Engineering and Geodesy
2013
The present work is devoted to the investigation of influence grain size on main mechanical characteristics nanopolycrystals different metals. Hall-Petch parameter behaviour for Al, Cu, Ni, Ti and Fe was examined in wide interval. stages plastic deformation parameters hardening nanocrystalline copper were analysed detail. mechanisms critical sizes accounting transition from dislocation slip boundary sliding described.
The transmission electron microscopy was used to investigate the dislocation structure and accumulation of dislocations during plastic deformation in Cu-Al Cu-Mn polycrystalline FCC solid solutions. Al content alloys varied from 0.5 14 at.%, Mn 0.4 25 аt.%. alloy samples with grain size ranging 20 240 μm were studied., They subjected tensile at strain rate 2 · 10–2 s–1 temperatures 293 – 673 K. Observations on thin foils carried out microscopes 125 kV accelerating voltage. For different...
The paper presents the TEM investigations of defect substructure alloys and its modification with increasing distance from fracture area. Cu-Mn polycrystalline FCC solid solutions are investigated in this study. Mn content is 0.4 25аt.% average grain size 100m. test machine INSTRON used experiment to measure tensile flexural strengths at a room temperature 2•10-2s-1 deformation rate. Within fractured areas specimens, localized measured each 2•10-3m, as well types dislocation (DSS) their...
The dislocation structure during deformation of polycrystalline FCC solid solutions the Cu-Al and Cu-Mn systems was studied using transmission electron diffraction microscopy. Al content in alloys varied from 0.5 to 14 at.%, while Mn within 0.4 ... 25 at.%. Types forming substructures were determined by analyzing microscopic patterns obtained for thin foils deformed different degrees. Microbands densities, widths, distances between microbands defect structures measured each sample. There...
The study covers dilute Cu-Mn alloys with a cellular dislocation substructure formed during deformation. contribution to the flow stress caused by is evaluated, and relative roles of various deformation resistance mechanisms are determined. analysis electron microscopic images thin foils deformed low-alloy shows parameters. Such parameters scalar density, densities in cell walls, boundaries disoriented cells, ragged sub-boundaries, band fragmented substructures, grain boundaries. It found...