A5051451877- Industrial Vision Systems and Defect Detection
- Integrated Circuits and Semiconductor Failure Analysis
- Electronic Packaging and Soldering Technologies
- Thermography and Photoacoustic Techniques
- Ultrasonics and Acoustic Wave Propagation
- Manufacturing Process and Optimization
- Additive Manufacturing and 3D Printing Technologies
- Injection Molding Process and Properties
- Image Processing Techniques and Applications
- 3D IC and TSV technologies
- Infrared Target Detection Methodologies
- Advanced machining processes and optimization
- Image and Signal Denoising Methods
- Advanced Measurement and Detection Methods
- Industrial Technology and Control Systems
- Laser and Thermal Forming Techniques
- Machine Fault Diagnosis Techniques
- Structural Health Monitoring Techniques
- Gear and Bearing Dynamics Analysis
- Welding Techniques and Residual Stresses
- Non-Destructive Testing Techniques
- Hydraulic and Pneumatic Systems
- Silicon Carbide Semiconductor Technologies
- Additive Manufacturing Materials and Processes
- Advanced Measurement and Metrology Techniques
Jiangsu Normal University
2014-2024
Aerospace Information Research Institute
2024
Chinese Academy of Sciences
2024
Huazhong University of Science and Technology
2011-2023
Georgia Institute of Technology
2014-2015
Singapore Institute of Manufacturing Technology
1999
Solar-driven seawater desalination is considered a promising method for alleviating the water crisis worldwide. In recent years, significant efforts have been undertaken to optimize heat management and minimize salt blockage during solar-driven desalination. However, it remains challenging achieve an efficient stable evaporator simply practically. Here, we designed prepared novel three-dimensional (3D) channel (3D WCE) equipped with Janus CNT@PBAT fabric (JCPF). The as-prepared has...
Solder bump/ball technology has been extensively applied in microelectronic packaging industry. However, the size of solder balls/bumps as well pitch are getting smaller and smaller, conventional inspection techniques insufficient for diagnosis defect. It is indispensable to explore new methods joint inspection. In this paper, a nondestructive system based on active thermography was proposed. The test vehicles, named SFA1 SFA2, were excited by laser pulse, consequent thermal response...
The miniaturized electronic products require not only high density, but also reliability. Defect inspection for the high-density package becomes challenging gradually. In this article, active thermography technology is used to detect solder balls in flip-chip (FC) packages. A single-layer FC model constructed and heat conduction simulated by using finite-element analysis code of COMSOL. Experimental investigation carried out inspect defects laser excitation test system. Infrared images SFA1...
Flexible pressure sensors with high sensitivity and outstanding mechanical reliability are crucial for human motion detection. In this work, we fabricated a flexible sensor bilayer conductive structure using PDMS/MWCNTs@polypyrrol@melamine foam (PMPM). Typically, the construction of extra routes is facilitated by porous to achieve 117.61 kPa–1 in low detection limit constant gauge factor (GF) 6.39 over linear compression strain range. Furthermore, polypyrrole particles covering surface...
Focusing on the problem of identifying and classifying aero-engine models, this paper measures infrared spectrum data hot jets using a telemetry Fourier transform spectrometer. Simultaneously, spectral sets with six different types aero-engines were created. For purpose data, CNN architecture based continuous wavelet peak-seeking attention mechanism (CWT-AM-CNN) is suggested. This method calculates peak value middle wave band by transform, are extracted statistics number locations high...
Flip-chips have been widely used in microelectronic packaging. As the dimension and pitch of chip solder bump getting smaller smaller, defect inspection becomes more challenging. In this paper, scanning acoustic microscope (SAM) was to detect flip packages. However, detection accuracy is limited by low resolution SAM image. Therefore, image super-resolution (SR) method employed enhance quality. The modified Very-Deep Super-Resolution (VDSR) algorithm, based on convolutional neural network...
Surface mount technology has spurred a rapid decrease in the size of electronic packages, where solder bump inspection surface packages is crucial electronics manufacturing industry. In this study we demonstrate feasibility using 230 MHz ultrasonic transducer for nondestructive flip chip testing. The reflected time domain signal was captured when scanning chip, and image generated by acoustic microscopy. Normalized cross-correlation used to locate center bumps segmenting image. Then five...