Micro- and nano-scale devices are used in electronics, micro-electro- mechanical, bio-analytical medical components. An essential step for the fabrication of such small scale is photolithography. Photolithography requires a master mask to transfer micrometre or sub-micrometre patterns onto substrate. The requirement physical, rigid can impede progress applications which require rapid prototyping, flexible substrates, multiple alignment 3D fabrication. Alternative technologies, do not use...

The stability of citrate electrolytes for the electrodeposition copper‐nickel alloys and multilayers has been investigated. It was found that operating at pH 4 are unstable due to formation an insoluble complex. This complex had previously thought be copper dihydrate, , but elemental analysis precipitate revealed it a heteronuclear Calculations distribution species in typical plating solution undertaken identify experimental conditions under which is not formed. These studies indicate...

Copper and nickel are codeposited by pulse reverse‐pulse plating on a rotating cylinder cathode from citrate bath. Polarization data for copper as well potential transients during current experiments show that displacement reactions may occur the off‐time or pulse‐reversal time. A mathematical model which includes this effect is developed to predict composition of electrodeposited alloys. The shows deposits at mass‐transfer limiting throughout pulse‐cycle while alternately deposited...

This work reports an investigation on mass transfer by ultrasound agitation during electrodeposition electrodes separated a narrow inter-electrode gap. Polarisation experiments were performed to identify the limiting current. The current density was used calculate boundary layer thicknesses which develop correlations. Experiments carried out using cell with parallel copper discs positioned at gaps of 1, 0.5 and 0.15 cm. distance between ultrasonic probe varied 3 1.5 polarisation data showed...

The forthcoming era of industrialization is marked by intelligent production, with the manufacturing industry and Industrial Internet Things (IIoT) driving creation innovation new concepts systems. One innovative solution addressing demands industrial settings time-slotted channel hopping (TSCH) protocol, known for its ultra-low power consumption reliable communication. However, scheduling mechanism at core TSCH requires substantial time every node. In this study, we propose a sustainable...

Electroplated soft gold is widely used in the growing fields of micro- and opto-electronics as a conducting material for interconnects devices. Due to problems related resist compatibility, safety disposal concerns, cyanide-free plating baths are now strongly demand. The interest developing non-toxic electrolytes, such those based on sulfite complexes, has grown rapidly recent years. most common non-cyanide electrolyte gold-sulfite complex, which stability compatibility. Recently, novel that...

The feasibility of using a thiosulfate-sulfite bath to electrodeposit soft gold for microelectronic applications has been investigated. This is stable at near-neutral pH, shows good compatibility with positive photoresists, and does not contain any additives. It was found that the produced bumps straight sidewalls, flat top surfaces, reproduction resist pattern achieved. thickness uniformity, roughness, stress, hardness, adhesion, shape plated structures were be compatible requirements wide...

An Exigency Vehicle (EV) has to go more quickly increase the likelihood that someone in danger would survive. Construction projects, strikes, and accidents may all be avoided with an effective vehicle routing solution. The Internet of Things (IoT) network simulation for is proposed this research utilizing a linguistic interval type 2 fuzzy logic system (LIT2FLS) based data fusion approach. predicted effectiveness our model intelligent city applications, including emergency routing, well...

In previous studies, the comprehensive scaling-up of nickel electroforming on a lab-scale rotating disk electrode (RDE) suggested that secondary current distribution could adequately simulate such forming process. this work, use 3-D, time-dependent, model, developed in COMSOL Multiphysics®, was examined to validate an industrial mechanical vane, low-tolerance part with demanding thickness profile great interest aerospace industry. A set experiments were carried out pilot tank computations...

Abstract In the past 20 years there has been a considerable interest in application of deep eutectic solvents (DESs) for metal finishing applications and large amount academic studies have performed related to electrodeposition, electroless deposition electropolishing. These DES materials possess number unique characteristics it was predicted that they would replace hazardous toxic associated with many aqueous-based processes make them inherently greener more sustainable. They also...

The limit of applicability a previously developed mathematical model for the prediction pulse‐plated Cu‐Ni alloys in presence mass‐transport controlled corrosion reaction has been investigated. growth Cu‐rich layer on alloy surface, which suppresses further dissolution nickel, theoretically analyzed. This is used to compute , maximum value off‐time when nickel governed by mass‐transfer‐controlled Cu2+deposition reaction. Experimentally, shift composition from observed at long pulse‐off...

An analysis of the speciation gold plating solutions containing sulfite and thiosulfate as complexing agents has been performed. In case baths, it was found that observed stability electrochemical behavior were inconsistent with commonly assumed constants for species. The data are, however, consistent a much larger constant . baths ligands, model predicts dominant species at neutral or basic are mixed complexes form complex is only under acidic conditions. It shown electrodeposition...

A concept of maskless electrochemical microfabrication has been presented. In this method, a substrate, which is the anode, placed in an reactor close proximity to tool carrying micropattern, cathode. Although anode etched over its entire surface, it etches at higher rate on areas opposing exposed regions cathode, hence, reproducing pattern anode. This paper describes process that enables transfer micropatterns from cathode investigation involved development mathematical model for anodic...