A5042095681- Advanced Fiber Optic Sensors
- Photonic and Optical Devices
- 3D IC and TSV technologies
- Advancements in Photolithography Techniques
- Advanced Fiber Laser Technologies
- Semiconductor Lasers and Optical Devices
- Industrial Vision Systems and Defect Detection
- Advanced Photonic Communication Systems
- Heavy metals in environment
- Semiconductor materials and devices
- Adsorption and biosorption for pollutant removal
- Scheduling and Optimization Algorithms
- Integrated Circuits and Semiconductor Failure Analysis
- Advanced Statistical Process Monitoring
- Surface Roughness and Optical Measurements
- Clay minerals and soil interactions
- Advanced Optical Sensing Technologies
- Advanced Surface Polishing Techniques
- Optical Systems and Laser Technology
- Advanced Data Storage Technologies
Henan University
2021
Chinese Academy of Sciences
2007-2010
Shanghai Institute of Optics and Fine Mechanics
2007-2010
Donghua University
2008
As 3D NAND advanced technology moves to increasingly denser storage capacity, the film stacks required create these devices correspondingly increase in quantity and height, creating additional manufacturing yield challenges. This is especially true for photolithography specifically on-product overlay (OPO) control.[1] Multiple sources of process variation impacting need be considered, controlled, optimized functional products: complex alignment schemes, etch tilt effect deep, high aspect...
Statistical Process Control (SPC) plays a critical role in semiconductor manufacturing, ensuring product quality and yield by monitoring key performance indicators (KPIs) of processes equipment. As nodes continue to shrink, the challenges process control increases, often requiring combination traditional KPIs or creation new ones identify root causes effectively. However, existing SPC systems - both commercially available those developed in-house may lack necessary flexibility functionality...
On Product Overlay (OPO) challenges are known to be the yield limiters in semiconductor manufacturing processes, as process control performance highly depends on design and quality of overlay (OVL) metrology targets. Innovative target designs needed for OPO reduction, accuracy improvement measurement robustness enhancement. The Metrology Target Designer (MTD) tool is widely used an integral simulation method design, by co-optimizing lithography performance. Using this approach, one can...
Metrology target quality highly impacts overlay measurement accuracy and robustness. Factors that can affect include pattern symmetry, uniformity over one target, variation within wafer, wafer to lot lot. Historically, multiple studies have revealed how metrology asymmetry causes inaccuracy issues. Target design address induced error, some extent, by providing a process compatible design. targets synchronously consider compatibility, system capability basic rule. In cases, the minimum rule...
In recent years, the pursuit of high storage capacity in 3D-NAND flash devices has driven addition more layers to increase stack height. Challenges arise when etching aspect ratio memory holes. Due existence a thick and opaque hard mask layer, overlay control faces significant lot-to-lot variation difficulty run-to-run feedback control. this paper, fundamental study on channel hole is revealed by collecting analyzing step-by step overlay, etch tilt stress data. The strong correlation between...
A low-cost but multi-functional fiber grating sensor with self-demodulation and discrimination capabilities is presented. The can measure strain, vibration, normal temperature (-10-100°C), high (100-800°C) pressure. There are three Bragg gratings (FBGs) one long period (LPG) in the system. measurands of temperature, vibration pressure, arbitrary two them be measured simultaneously, by using FBG1 FBG2 as sensing head. LPG used a linear response edge filter to convert wavelength into...
In recent years, the 3D NAND stack has continued to expand rapidly in Z direction with tighter process windows, while deck-to-deck overlay faces increasing measurability and accuracy challenges. Meanwhile, thick opaque hard mask (HM) been utilized several layers, thus downgrades a lot of mark contrast introduces large variation (PV). To meet tightened requirements, KLA's Metrology Target Design (MTD) assisted by simulation analysis become an important part holistic improvement solution set....