Firms heavily emphasise reducing carbon footprint, an area warranting further improvement. This study examines footprint within the context of production scheduling. Two multi-objective scheduling problems involving economic- and environmental-related criteria are studied: (1) a batch-processing machine problem to minimise total weighted tardiness simultaneously; (2) triple-criteria hybrid flow shop consisting followed by two parallel-processing machines, in which attempts tardiness, peak...

Abstract The theory of attractive quality (the Kano model) can offer a better understanding how customers evaluate products, and helps practitioners to focus on the most important attributes improve. However, in practice, users model usually cannot find an or one-dimensional element due improperly-designed questionnaire, poorly-defined lifecycle attributes. also indicated that creation bring must-be product back is tough task. To solve these issues, this study proposed novel Creativity-based...

The quantity of carbon dioxide (CO2) emissions is one the most widely recognised measures environmental sustainability. Given mounting concern about climate change and global warming, managers are facing growing pressure to reduce CO2 emissions. In practice, other than emissions, may be concerned with objectives when making a scheduling decision. This work develops ε-archived genetic algorithm (ε-AGA) examine two batch problems goal minimising traditional due date-based objective total...

Carbon dioxide (CO2) in particular is by far the primary driver of global warming. One most effective ways to reduce CO2 emissions increase amount power from renewable energy. A key challenge utilising energies, such as wind and solar, their uncertainty terms when what degree force energies will become available next time. This study uses interval number theory for energy modelling proposes two novel single-machine scheduling problems, . solution procedure formulated optimise these problems...

Recently, the independent component analysis (ICA) has been widely used for non-Gaussian multivariate process monitoring. An elliptical type measure is traditionally ICA-based However, it will not work appropriately since extracted ICA components exhibit skewed distribution. Thus, this study aims to develop a novel monitoring scheme ICA. The basic idea of proposed method first screen out outliers in order describe well majority training dataset. Hereafter, rectangular applied monitor...

The original purpose of the Re-Distribution Layers(RDL) was to assist in adaption metal bumping and flip chip packaging technologies, by addition dielectric layers onto wafer surface re-route legacy designed irregular peripheral I/O layout, into a new area array bond pads layout facilitate balanced bumps bonding. redistribution layer technology required polymeric/organic thin film (e.g. BCB, Polyimide, PBO) as insulator with semi-additive metallization scheme (often Cu pattern plating) serve...

This paper investigates a new scheduling problem of multiple orders per job (MOJ) in three-machine flowshop consisting an item-processing machine, lot-processing machine and batch-processing for semiconductor manufacturing operation that must form layer on the wafers. The MOJ deals with sequencing customer orders, assigning to jobs, then combining formed jobs into batches. Genetic algorithms are presented this minimise total weighted tardiness (TWT), presence non-zero order ready times,...

Abstract The main issue in lot streaming (LS) is determining the means by which to split jobs into sub-jobs improve makespan (or some other criterion). However, LS has been overlooked most studies dealing with scheduling problems associated specific kinds of job shops, where value exponentially deteriorates over time. current study attempts determine whether expected benefits would be evident job-shop problem (JSP) objective maximising total jobs. This comprised two stages. In first stage,...

Environmental concerns and rising energy prices put great pressure on the manufacturing industry to reduce pollution save energy. Electricity is one of main machinery sources in a plant; thus, reducing consumption both saves costs protects our planet. This paper proposes novel method called variable neighborhood strategy adaptive search (VaNSAS) order minimize while also considering job priority makespan control for parallel-machine scheduling problems. The newly presented strategies (1)...

Through Silicon Via (TSV) was original proposed for the three-dimensional (3D) IC packaging and now is realized in high band width DRAM (HBM) application. TSV also utilized a passive silicon interposer insertion of such into flip chip created another platform commonly known as 2.5DIC density multiple ICs integration. However, since 1st product announcement FPGAs 2011, GPU integration with HBM other until recently. High cost ownership has been named main cause 2.5D IC's slow adoptions, lack...

Environmental and economic considerations create a challenge for manufacturers. The main priorities production planning in environmentally friendly manufacturing industries are reducing energy consumption improving productivity by balancing machine load. This paper focuses on parallel scheduling to minimize (PMS_ENER), which is an indicator of environmental sustainability when considering machine-load balance problems. A mathematical model was formulated solve the proposed problem tested...

We learn from nature to mimic, the viewpoint of controlling Reynolds number variations, odor-molecule capturing function lobsters' tiny hairs on their antennules for finding food, a suitable mate or avoid predators capture molecules surrounding fluid. The engineering implementation this lobster-hair-like device, which is actuated by electrostatic force, reported in paper. device actuates and drives biological objects via disturbing fluid field manipulating achieve micro-object manipulation....

Traditional IC packaging requires chips to be assembled at the same level, while recently thrived 2.5D/3D utilizes skyscraper approach stack various types of with diverse functions occupying similarfootprint, and this not only can reduce overall package size, but also improve electrical interconnection performance. The primary difference between lies in implementation medium wafer Through Silicon Vias (TSV), called Interposer (TSI). Although 2.5D possesses advantages low power consumption,...

Wafer-Level Packaging (WLP) has emerged in modern years and played a prominent role both semiconductor Integrated Circuit (IC) field, as well Micro-ElectroMechanical Systems (MEMS) applications fields for their distinguishing operating mechanism adaptive design variety. In this study, numerous kinds of mature packaging technologies combined with innovation integration WLP techniques were proposed, including low temperature Wafer to (W2W) bonding using glass frit, wafer sawing grinding novel...

Periodic deliveries are typical in a number of real-life applications. Minimising the vehicles required to make set customers with known delivery frequencies is called problem vehicle minimisation for periodic (VMPD). Catering welfare drivers has now become very important. Consequently, this work integrates load balance factor into VMPD by considering both and between vehicles. This presents integer programming formulations applies lexicographic method bi-objective problem. also examines...