Liping Yu

ORCID: 0000-0002-6638-9747
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About
Contact & Profiles
Research Areas
  • Advanced Vision and Imaging
  • Optical measurement and interference techniques
  • Photovoltaic System Optimization Techniques
  • Image Processing Techniques and Applications
  • solar cell performance optimization
  • Nanowire Synthesis and Applications
  • Advanced Measurement and Metrology Techniques

Beihang University
2022-2025

Flexible solar cells have a lot of market potential for application in photovoltaics integrated into buildings and wearable electronics because they are lightweight, shockproof self-powered. Silicon been successfully used large power plants. However, despite the efforts made more than 50 years, there has no notable progress development flexible silicon their rigidity1-4. Here we provide strategy fabricating large-scale, foldable wafers manufacturing cells. A textured crystalline wafer always...

10.1038/s41586-023-05921-z article EN cc-by Nature 2023-05-24

Abstract Existing three-dimensional digital image correlation (3D-DIC) for surface 3D shape and deformation measurement requires the users to input key calculation parameters (e.g. subset size) proceed with stereo temporal matching. However, lack of clear guidelines optimal parameter selection often leads ambiguity uncertainty in final measurements. To eliminate realize full-automatic, user-independent, accurate precise 3D-DIC measurements, we present a simple yet effective Smart DIC-3D. By...

10.1088/1361-6501/adb5ad article EN Measurement Science and Technology 2025-02-27

Bi-prism-based single-bilateral-telecentric-camera stereo-digital image correlation (SBTC stereo-DIC) is a recently developed variant of single-camera stereo-DIC technique, featuring attractive advantages easy implementation, calibration-free imaging model, and high accuracy. However, the effects key structural parameters (e.g., prism angle location bi-prism) on metrological performance system, e.g., field view (FOV), system compactness, working distance measurement precision, how to design...

10.1109/tim.2022.3211567 article EN IEEE Transactions on Instrumentation and Measurement 2022-01-01
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