A5082603159- Thermal properties of materials
- Composite Material Mechanics
- Dielectric materials and actuators
- Natural Fiber Reinforced Composites
- Thermal Radiation and Cooling Technologies
- Innovations in Concrete and Construction Materials
- Heat Transfer and Optimization
- Nanofluid Flow and Heat Transfer
- Advanced Cellulose Research Studies
- Additive Manufacturing and 3D Printing Technologies
- Tribology and Wear Analysis
- Advanced Thermoelectric Materials and Devices
- Solar Thermal and Photovoltaic Systems
- Electromagnetic wave absorption materials
- Flame retardant materials and properties
- Phase Change Materials Research
- Recycling and Waste Management Techniques
- Ferroelectric and Piezoelectric Materials
- Aluminum Alloys Composites Properties
- Heat Transfer Mechanisms
- Heat Transfer and Boiling Studies
- Advanced Sensor and Energy Harvesting Materials
- Polymer Foaming and Composites
- Fiber-reinforced polymer composites
Sichuan University
2020-2024
Southern University of Science and Technology
2023-2024
Polymer Research Institute
2021
Chengdu University
2021
Southwest Petroleum University
2016-2018
Abstract The miniaturization, integration, and high data throughput of electronic chips present challenging demands on thermal management, especially concerning heat dissipation at interfaces, which is a fundamental scientific question as well an engineering problem—a death problem called in semiconductor industry. A comprehensive examination interfacial resistance has been given from physics perspective 2022 Review Modern Physics . Here, we provide detailed overview materials perspective,...
Thermally conductive and insulation polymer composites were constructed with a 3D aluminum flake framework by using sponge template.
Polymer–metal composite materials have been extensively employed for thermal management in the electronic field. However, their application is hindered by limited conductivity and inadequate electrical insulation. In this study, we present a novel strategy to prepare advanced polymer–metal films incorporating cellulose nanofibers (CNFs) with orientated polydopamine (PDA) modified aluminum (Al) flakes, employing straightforward process involving vacuum-assisted filtration hot-pressing. The...
Abstract The rapid growth of flexible electronics has led to significant demand for relevant accessories, particularly highly efficient heat dissipators. fluidity liquid metal (LM) makes it a candidate realizing thermal interface materials (TIMs). However, is still challenging combine LM with conductive network achieve the synchronous improvement conductivity and flexibility. In this work, LM@GN/ANF films are made by coating nano‐droplets graphene nanosheets (GN) via sonication, then they...
Abstract Aluminum‐plastic packaging is a multilayer material composed of polymer and aluminum, which has been applied in food, medical, other fields, due to the excellent fresh‐keeping barrier performance. However, it difficult recycle aluminum‐plastic waste (APPW) complicated components low value reclaim products. This paper reports green way APPW by solid‐state shear milling (S 3 M) technology then fabricate APPW/expandable graphite (EG) composite parts with high thermal conductivity fused...
“Heat death”, namely, overheating, which will deteriorate the function of chips and eventually burn device has become an obstacle in roadmap semiconductor industry. Therefore, heat dissipation becomes a key issue further developing semiconductor. Heat conduction encompasses intricate dynamics phonon within one-dimensional, two-dimensional materials, as well transport through interfaces. In this paper, research progress complexities on nano nanoscale recent three years, especially size...
Abstract Aramid fiber is widely used in aerospace, machinery, construction, and other fields for its high strength, elastic modulus, lightweight, superior comprehensive performance. However, because aramid difficult to be melted reprocessed, efficient environmentally friendly recycling of waste (AFW) an urgent challenging issue. In this work, we reported a facile way recycle AFW the preparation friction‐resistant polyoxymethylene (POM)/AFW composites. The ultrafine powder with 64.69 μm size...
The application of paper–aluminum–plastic packaging has been widely adopted in various fields such as the food and medical industries, owing to its exceptional preservation obstruction properties. Nonetheless, recycling process for paper aluminum from this type typically involves water pulping solvent separation. resulting residual waste, commonly known multi-plastic waste (PMW), poses significant challenges terms separation recycling. In research article, we propose a solution PMW using...
The combination of polymer and copper (Cu) is common economical in thermal interface materials (TIMs). However, it hard for traditional polymer-Cu composites to obtain high conductivity (TC) due the poor filler contact, amorphous structure insulating property most polymers. Here, significantly enhance heat transport achieve their efficient utilization, we present a strategy by introducing small amount 2D-structured graphite nanoplatelets (GNPs) into bulk Cu flakes/epoxy via molding method,...