About
Contact & Profiles
Research Areas
- High voltage insulation and dielectric phenomena
- Thermal Analysis in Power Transmission
- Lightning and Electromagnetic Phenomena
- Electrical Fault Detection and Protection
- Surface Modification and Superhydrophobicity
- Aerosol Filtration and Electrostatic Precipitation
- Industrial Vision Systems and Defect Detection
- Electrostatic Discharge in Electronics
- Epoxy Resin Curing Processes
- Electromagnetic Compatibility and Noise Suppression
- Power Line Inspection Robots
- Material Properties and Processing
Zhejiang University
2022-2025
10.1109/tdei.2025.3530376
article
EN
IEEE Transactions on Dielectrics and Electrical Insulation
2025-01-01
10.1109/tdei.2025.3527419
article
EN
IEEE Transactions on Dielectrics and Electrical Insulation
2025-01-01
10.1109/tpwrd.2025.3569307
article
EN
IEEE Transactions on Power Delivery
2025-01-01
10.1109/tim.2024.3441024
article
EN
IEEE Transactions on Instrumentation and Measurement
2024-01-01
10.1109/tdei.2024.3447619
article
EN
IEEE Transactions on Dielectrics and Electrical Insulation
2024-01-01
10.1109/hvdc62448.2024.10723025
article
EN
2024-08-08
10.1109/ciced63421.2024.10754025
article
EN
2022 China International Conference on Electricity Distribution (CICED)
2024-09-12
10.1109/ei264398.2024.10990417
article
EN
2021 IEEE 5th Conference on Energy Internet and Energy System Integration (EI2)
2024-11-29
10.1109/ei264398.2024.10991393
article
EN
2021 IEEE 5th Conference on Energy Internet and Energy System Integration (EI2)
2024-11-29
Epoxy resin insulations are considered as a potential candidate for various applications like transformers, cable terminations, power electronic device packaging, and bushings. This has promoted great interest in their use high voltage insulation materials frequency applications. work presents the effect of different curing agent concentrations on electrical thermal properties epoxy DC Differential scanning calorimetry is used to characterize performance materials. The such breakdown...
10.1049/icp.2022.0035
article
EN
IET conference proceedings.
2022-03-29
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