Angular color uniformity (ACU) is a key optical property of white light-emitting diodes (WLEDs) and high ACU strongly demanded in illumination applications. In this paper, multilayer phosphor-in-glass (PiG), which can be produced by the screen-printing method, proposed to improve LED packages. The method provides feasible scheme produce multilayer, various-shaped PiG with controllable pattern. correlated temperature (CCT) distributions packages are simulated numerically measured...

Three-layer structures of the dried letters into Huazhong University Science and Technology “H, U, S T” shapes.

Cu and Ag nanoparticle (NP) paste has emerged as a promising choice for high-power devices because of its excellent thermal electrical properties. However, easy oxidation, high sintering temperature NPs, cost, porosity NPs restrict the practical application. Although Cu–Ag composite can improve bonding reliability, there have been no reports fabricating stable reliable joints. In this work, we reported novel method nano with dispersibility relatively uniform particle size distribution via...

Laser-driven white lighting has been considered as a next-generation high-brightness source. Thermally stable color converter is an essential down-conversion material for phosphor-converted laser diodes (pc-wLDs), which inevitably endures high-density excitation and huge heat shock from conversion loss. In this work, we proposed thermally self-managing phosphor-in-glass (PiG) to enhance the dissipation of reflective pc-wLDs. The PiG was prepared by printing sintering phosphor glass film on...

Light-emitting diodes (LEDs) are considered as a next-generation lighting due to their high luminous efficiency, low power consumption, and long lifetime. However, the heat dissipation of LEDs is an inevitable roadblock. Here, heat-conducting Cu nanoparticle (NP) paste was prepared demonstrated for high-power LEDs. The effects sintering temperature on electrical thermal properties NP were investigated. junction change resistance measured compared with traditional die-attach materials....

In this letter, an all-inorganic and hermetic packaging technology was proposed for deep-ultraviolet light-emitting diodes (DUV-LEDs). The package fabricated by bonding the quartz cap on three-dimensional (3D) ceramic substrate at low temperature. layer formed inorganic adhesive presented a reliable dense state. average air leakage rate of structure 3.79 × 10 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">-8</sup> Pa.m...

To enhance the light efficiency of deep ultraviolet light-emitting diodes (DUV-LEDs), a novel method was proposed through introducing tailored nanostructures on surfaces silica glass in packaging process. The were fabricated by using self-assembled gold nanoparticles rapid thermal annealing (RTA) and additional dry etching. temperature dwelling time RTA process investigated to obtain with optimized feature sizes ~100 nm for DUV application. By utilizing dual-side nanostructures, average...

Deep ultraviolet light-emitting diodes (DUV-LEDs) have become a promising UV light source for sterilization, disinfection, and purification. However, the challenge in practical application of DUV-LEDs still remains their low efficiency. In this paper, we propose an optimized aluminum (Al) reflector extraction enhancement DUV-LEDs. The optical model was established, simulations were performed to achieve reflector. exhibit highest efficiency when has feature sizes with angle 60°, height 2.0...

Quantum dots (QDs) are considered as promising color converters in the next-generation white light-emitting diodes (WLEDs) due to their tunable wavelength, high quantum yield, and excellent rendering. However, practical applications of QDs QD composite films severely hindered by intrinsical drawbacks thermal quenching degradation. In this paper, we proposed an efficient heat dissipation approach solve issue stacking a film on heat-conducting phosphor-sapphire (PSC) plate. The PSC plate was...

Thick printed ceramic substrate (TPC) is a promising technique for the packaging of high-power light-emitting diode (LED). Nevertheless, incorporation glass phase and voids in sintered Ag layer decrease electrical conductivity heat dissipation TPC substrate, which contributes to an increase junction temperature LED. This article demonstrates novel design plate copper on was applied enhance optical–thermal performances After plating, layers are well bonded with sheet resistance decreases...

Advancement in high heat thermal management technology and its successful integration into emerging GaN-based amplifiers is imperative to meet the long-term requirement of future X-band radar systems. It also known that efficiency reliability light emitting diode (LED) strongly rely on due inherit low junction temperature LED chip. In this paper, a new cooling solution for GaN based power radars (XBR) high-brightness LEDs, by closed microjet array system, proposed investigated experiments....

Phosphor-in-glass film (PiGF)-based phosphor-converted white laser diode (pc-WLD) is regarded as a potential high-brightness lighting source. For reflective PiGF converters, the optothermal performances are particularly related to heat dissipation efficiency, mainly depend on heat-conducting substrate and extra method. In this article, we prepared PiGF-Al2O3 (PiGF-AS) converters by coating sintering LSN:Ce phosphor glass directly Al2O3 substrates slash thermal conduction resistance. The...

High power light emitting diodes (LEDs) have begun to play an important role in many illumination applications due their excellent performance terms of high efficiency, low consumption, reliability and long life. With the rapid development LED industry, is becoming essential for large scale devices, modules systems. Generally thermal cycling shock test are conducted validation exposure potential design problems during new packaging development. In this paper, typically package evaluated by...

In order to improve the luminous properties and thermal reliability of white light-emitting diodes (WLEDs), we proposed a promising phosphor-in-glass (PiG) converter, which was prepared by screen-printing patterned phosphor glass layer on microstructured plate. The achieves four-quadrant geometry based separated yellow Y3Al5O12:Ce3+ (YAG:Ce3+) red CaAlSiN3:Eu2+ (CASN:Eu2+) parts. Comparison experiments between PiG with without microstructure array (MSA) were conducted at different...

AlGaN based deep ultraviolet light-emitting diodes (DUV LEDs) have wide applications in many fields, such as air and water purification, disinfection, biochemical inspection. However, the wall plug efficiency (WPE) of DUV LEDs is relatively low for these applications, which due to light extraction (LEE) yielding limited output from LED package. In this work, we proposed a quartz lens with three-dimensional (3D) structure enhance LEDs. The optical models were established performances...

In this work, phosphor-converted white laser diodes (pc-WLDs) with high color quality were fabricated by combining blue lasers and bicolor phosphor-in-glass (PiG) converters. The PiGs prepared printing sintering green/red phosphor glass films on sapphire substrates, then applied in the transmission type of pc-WLDs. PiG-based (WLDs) display broadband emission their optical performances adjusted varying PiG film thickness. When thickness increases from 80 to <inline-formula...