A5101902024- Dielectric materials and actuators
- High voltage insulation and dielectric phenomena
- Aerosol Filtration and Electrostatic Precipitation
- High-Voltage Power Transmission Systems
- Advanced Sensor and Energy Harvesting Materials
- Synthesis and properties of polymers
- Polymer composites and self-healing
- Lightning and Electromagnetic Phenomena
- Thermal Analysis in Power Transmission
- Icing and De-icing Technologies
- Ferroelectric and Piezoelectric Materials
- Power Line Inspection Robots
- Power Transformer Diagnostics and Insulation
- Silicone and Siloxane Chemistry
- HVDC Systems and Fault Protection
- Thermal properties of materials
- Electromagnetic Fields and Biological Effects
- Power Line Communications and Noise
- Conducting polymers and applications
- Magnetic Properties and Applications
- Heavy Metal Exposure and Toxicity
- Noise Effects and Management
- Smart Grid and Power Systems
- Speech and Audio Processing
- Geoscience and Mining Technology
University of Science and Technology Beijing
2021-2024
Tsinghua University
2024
China Electric Power Research Institute
2016-2024
North China Electric Power University
2014-2023
Shunde Polytechnic
2023
State Grid Corporation of China (China)
2021-2022
Inner Mongolia University of Science and Technology
2019-2020
Mongolian University of Science and Technology
2019
Zhejiang Metallurgical Research Institute
2015
Electric Power Research Institute
2010
Abstract To match the increasing miniaturization and integration of electronic devices, higher requirements are put on dielectric thermal properties dielectrics to overcome problems delayed signal transmission heat accumulation. Here, a 3D porous conductivity network is successfully constructed inside polyimide (PI) matrix by combination ionic liquids (IL) calcium fluoride (CaF 2 ) nanofillers, motivated bubble‐hole forming orientation force. Benefiting from formed IL as porogenic template...
Dielectric polyimides (PIs) are ubiquitous as insulation in electrical power systems and electronic devices. Generally, dynamic polyimide is required to solve irreversible failure processes of or mechanical damage, for example, under high temperature, pressure, field strength. The challenge lies the design molecular structure rigid achieve reversibility. Herein, a low-molecular-weight gene unit designed crosslink with ligase prepare smart film. Interestingly, due variability combinations,...
Recyclability and self‐healing are two most critical factors in developing sustainable polymers to deal with environmental pollution resource waste. In this work, a dynamic cross‐linked polyimide insulation film full closed‐loop recyclability is successfully prepared, which also possesses good ability after being mechanical/electrical damaged depending on the Schiff base covalent bonds. The recycled self‐healed still maintain its tensile strength ( σ t ) >60 MPa Young's modulus E >4...
Elastomers are widely used in traditional industries and new intelligent fields. However, they inevitably damaged by electricity, heat, force,
Abstract Polyimides (PIs) used in advanced electrical and electronic devices can be electrically/mechanically damaged, resulting a significant waste of resources. Closed‐loop chemical recycling may prolong the service life synthetic polymers. However, design dynamic covalent bonds for preparing chemically recyclable crosslinked PIs remains challenging task. Herein, new PI films containing oligomer, chain extender, crosslinker are reported. They exhibit superior recyclability excellent...
Abstract Polymer dielectrics with combined thermal stability and self‐healing properties are specifically desired for high‐temperature film capacitors. The high of conventional polymers benefits from the abundance aromatic rings in molecule backbone, but carbon content sacrifices their properties. Here, analicyclic polyimide a glass transition temperature (256 °C) wide energy bandgap (4.58 eV) is designed, which exhibits electric conductivity more than an order magnitude lower that classical...
Abstract Polyimide (PI) has excellent resistance to high or low temperatures due its unique molecular structure, and is widely used in advanced electronics power systems extreme environments. In recent years, a small amount of studies have been published modulate the dynamic behavior PI such as self‐healable, recyclable, degradable abilities by adjusting structure chains composition monomers. However, conceptual design, formation conditions, application prospects are still unclear. this...
Polydimethylsiloxane (PDMS) elastomers with high mechanical and healing properties are developed as smart materials for electrical power systems electronic devices to address or damage. However, the challenge is reconcile conflicting molecular mechanisms of in development PDMS elastomers. This study adopts "rigid-while-flexible" mutual network structure by copolymerizing rigid polyimide (PI) flexible segments dynamic reversible crosslinking designed on backbones. elastomer (designated PSiPI)...
A copolyimide (CPI) was prepared by a simple copolymerization process. The film possesses good self-healing ability based on disulfide bond exchange after mechanical/electrical damage and maintains high thermal stability insulation property.
Abstract The corona onset field strength is a critical factor for discharge in transmission lines, and accurately discriminating it crucial studying the effect electromagnetic environment characteristics. In this paper, cage tests were conducted to determine of conductors. relationship between radio interference (RI), audible noise (AN), applied voltage was analyzed, method based on RI AN sound pressure proposed. For smooth fine copper wires tested laboratory, regression coefficients R 2...
In this work, reduced BaTiO3 (rBT) particles with a large number of defects sintered in reducing atmosphere (95N2/5H2) were introduced into polyimide (PI) matrix without using any modifier or surfactant components. The rBT/PI composite films fabricated by an situ polymerization method showed significantly enhanced dielectric constant and energy storage density. the 30 wt% rBT reached up to 31.6, while maintaining lower loss (tg δ = 0.031@1000 kHz) compared pure PI (ε r 4.1). Its density (9.7...