A5064600663- 3D IC and TSV technologies
- Laser Material Processing Techniques
- Electronic Packaging and Soldering Technologies
- Additive Manufacturing and 3D Printing Technologies
- Manufacturing Process and Optimization
- Advanced Sensor and Energy Harvesting Materials
- Photopolymerization techniques and applications
- Semiconductor materials and devices
- Tactile and Sensory Interactions
- Nanofabrication and Lithography Techniques
- Synthesis and properties of polymers
- Thin-Film Transistor Technologies
- Integrated Circuits and Semiconductor Failure Analysis
- Optical Coatings and Gratings
- Advanced Materials and Mechanics
- Nonlinear Optical Materials Studies
- Laser-Ablation Synthesis of Nanoparticles
- Advanced optical system design
Shenzhen Institutes of Advanced Technology
2022-2024
Chinese Academy of Sciences
2022-2024
University of Macau
2024
Abstract Recent development of wearable devices is revolutionizing the way artificial electronic skins (E‐skin), physiological health monitoring and human‐machine interactions (HMI). However, challenge remains to fit flexible human skin with conformal deformation identifiable electrical feedback according mechanical stimuli. Herein, an adhesive E‐skin developed that can firmly attach on for stimuli perception. The laser‐induced layer serves as essential component ensure attachment curved...
Abstract Due to the advantages of non‐contact processing, high efficiency, precision, and superior controllability, laser lift‐off (LLO) technologies exhibit excellent material applicability process compatibility in ultra‐thin electronic devices. This brings new opportunities for large‐scale manufacturing emerging electronics that meet ultra‐thin, fragile, poor high‐temperature resistance. However, this opportunity also comes with formidable challenges from complex mechanisms laser‐matter...
With the development of semiconductor end products toward miniaturization, digitization and intellectualization, advancement Moore’s Law is approaching its physical limit little by little. To resolve this issue, advanced packaging has been perceived as optimal strategy, leading to an increasing performance requirement for temporary bonding material (TBM), such sufficient thermal resistance, chemical resistance lower TTV (total thickness variation) value. Herein, a new high temperature...
Herein, a temporary bonding system consisting of photopolymer release materials UDP 801 and WLP TB150 has been successfully developed (UDP as UV layer, adhesive layer), which can be debonding by lamp irradiation, unlike the costly laser in technology. The results show that not only excellent absorption, transmittance 365nm band is less than 7%, but also good thermal stability, 5% weight loss temperature more 270°C nitrogen atmosphere. Thin wafer pairs separated at room temperature, quickly...
Recently, advanced packaging technology has continued to develop towards the miniaturization and heterogeneous integration of devices in post-Moore era [1]. In order be suitable for requirement ultrathin packaging, smaller form factor, more comprehensive functions lower cost, temporary bonding debonding (TBDB) as a significant handling wafers been contributed many sections semiconductor industry. Several researchers have shown solutions TBDB which focus on various design materials, including...
The rapid development of high-end communications, artificial intelligence, internet things and wearable devices has greatly facilitated the application advanced packaging technology in chip industry to achieve miniaturisation, high density, multi-functionality, low power consumption cost chips. Faced with continuous device wafers direction large size, thinner three-dimensional stacking, field proposed temporary bonding debonding (TBDB) processes reduce breakage rate ultra-thin wafers. Among...
In this paper, a newly developed thermal resistant temporary bonding material (TBM) without any solvents incorporating was introduced. Due to the well-designed molecular structure features, chemical cross-linking can be initiated through dual-curing methods: heating and UV irradiation, it has been confirmed that irradiation approximately 10 times faster than one by real-time (RT) FTIR spectroscopy, both time energy saving could simultaneously achieved. Once cured, will no longer soften or...
In this work, a photosensitive polymer material GT3 that can be used for laser debonded has been successfully developed. The the properties of not only release layer but also an adhesive layer, thereby realizing temporary bonding system constructed single-layer materials. results show materials significant ultraviolet absorption, with its transmission rate below 3% at 355 nm. It exhibits excellent thermal stability, temperatures greater than 270 ℃ 5% mass loss in nitrogen atmosphere. By...