A5056451424- Thermography and Photoacoustic Techniques
- Industrial Vision Systems and Defect Detection
- Silicon Carbide Semiconductor Technologies
- Thermal properties of materials
- Integrated Circuits and Semiconductor Failure Analysis
- Electronic Packaging and Soldering Technologies
- Low-power high-performance VLSI design
- Fault Detection and Control Systems
- Copper Interconnects and Reliability
- Analog and Mixed-Signal Circuit Design
- Electrostatic Discharge in Electronics
- Force Microscopy Techniques and Applications
- VLSI and Analog Circuit Testing
- Advanced Sensor Technologies Research
- Advanced machining processes and optimization
- Metal and Thin Film Mechanics
- Infrared Target Detection Methodologies
- Silicon and Solar Cell Technologies
- Calibration and Measurement Techniques
Chemnitz University of Technology
2018-2024
Berliner Nanotest und Design
2020-2024
Abstract The vision of a deep learning-empowered non-destructive evaluation technique aligns perfectly with the goal zero-defect manufacturing, enabling manufacturers to detect and repair defects actively. However, dearth data in manufacturing is one biggest obstacles realizing an intelligent defect detection system. This work presents framework for bridging gap using potential synthetic datasets generated finite element method-based digital twin. under consideration pulse infrared...
The paper establishes foundational work for lock-in thermography as an in-line quality inspection tool during the production of power electronic devices. It focuses thereby on fast, reliable, and unequivocal detection defects, which reveal themselves through a characteristic transient thermal signature analysis phase amplitude images. experimental finite element analyses were performed at several excitation frequencies different numbers cycles excitation. A model was used to make...
For the calculation of correct structure function, getting time constant spectrum is an important prerequisite. The time-constant result deconvolution derivative unit step response and weight function. However, ill-posed problem which needs utmost care. literature on function proposes two prominent solutions for step, namely Inverse Filtering Bayesian deconvolution. This research work implements both methods in algorithm compares obtained with analytical solution. On one hand, inverse...
One of the biggest hurdles in developing an innovative, intelligent failure analysis system that caters to needs manufacturing industry, is lack data train a deep learning driven system. The Finite Element Method (FEM) has potential bridge this gap by simulations encapsulate underlying physical phenomena form complex differential equations and solve them numerically. This work presents detailed study comparing results obtained for pulse thermography experiments FEM. Samples with artificially...
Thin metal layers, especially those made of copper, are omnipresent in today's packaging applications as e.g. RDL structures, conductor traces on flexible and stretchable substrates, chip finishes or terminal metallisation, serving electrical, thermal mechanical purposes. During operation, thermo-mechanical stress will cause failures the Cu layers interfaces over time. As is very process size dependent, its resistance to fatigue failure needs be characterised with samples which have...
The miniaturization of electronic devices with enhanced performance comes at the cost thermal challenges. When a device fails, it is necessary to analyze and isolate failure in device. A non-destructive analysis always preferred over destructive one. Apart from being cost-effective, also helps us perform more than one technique on same verify our conclusion regarding device.A well-established suitable method investigate active like MOSFETs transient analysis. Here, step response system...
Electronic components of which reliability cannot be quantified are unacceptable and potentially hazardous, especially in safety-relevant areas such as driver assistance system medical technology where the zero-error principle applies. Reliability a quality criterion has its origin production, i.e. process variations have negative influence on structural integrity contact elements packaging interconnect and, thus device performance field under thermo-mechanical load (temperature changes,...
In this work, a Thermal Test Vehicle (TTV) is developed to demonstrate the thermal characterization utilities for large die area packages. The TTV consists of silicon Chip (TTC) on organic interposer assembled with lid and thermally conductive adhesive as interface material. setup mimics system-level application use transient method studying local impedance heat path signature Rth(x,y) achieving spatial resolution high granularity in location dissipation.To obtain more comprehensive...