A5059944044- Advanced Thermoelectric Materials and Devices
- Thermal Radiation and Cooling Technologies
- Thermal properties of materials
- Heat Transfer and Optimization
- Building Energy and Comfort Optimization
- Solar Energy Systems and Technologies
- Wind and Air Flow Studies
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Solar Thermal and Photovoltaic Systems
- Silicon Carbide Semiconductor Technologies
- Urban Heat Island Mitigation
- Heat Transfer and Boiling Studies
- Solar-Powered Water Purification Methods
- Greenhouse Technology and Climate Control
- Climate Change and Health Impacts
- Indoor Air Quality and Microbial Exposure
- Air Quality and Health Impacts
- Advanced Thermodynamics and Statistical Mechanics
- Aerodynamics and Fluid Dynamics Research
- Aluminum Alloys Composites Properties
- Innovative Energy Harvesting Technologies
- Fire dynamics and safety research
- Parallel Computing and Optimization Techniques
- Atmospheric chemistry and aerosols
China Academy of Engineering Physics
2017-2025
Huazhong University of Science and Technology
2015-2017
Magnetron-sputtered thermoelectric thin films have the potential for reproducibility and scalability. However, lattice mismatch during sputtering can lead to increased defects in epitaxial layer, which poses a significant challenge improving their performance. In this work, nanocrystalline n-type Bi
The thermoelectric cooler (TEC) operating under the transient mode showed a stronger short term cooling effect than that of steady state mode. In this study, chip experimental setup with modeled by ceramic heater was constructed using commercial Bi2Te3-based TEC. A three-dimensional numerical model established for system optimization. impacts pulse voltage amplitude, trigger time, time span, and power magnitude on peak temperature were analyzed in detail. results simulations high agreement...
A thermoelectric generator (TEG) device which uses solar energy as heat source would achieve higher efficiency if there is a temperature difference between the hot-cold ends. However, or flux being imposed upon hot end will cause strong thermal stress, have negative influence on life cycle of module. Meanwhile, in order to get high flux, Fresnel lens required concentrate energy, non-uniformity TEG and further stress device. This phenomenon very common devices but seldom research work has...
The development of high-performance thin-film thermoelectric coolers (TFTECs) that are compatible with standard integrated circuit processes and can reduce power consumption is critical to achieving large-scale applications. In this work, we fabricate a planar TFTEC based on nanocrystalline p-type Bi0.5Sb1.5Te3 n-type Bi2Te3 thin films using magnetron sputtering, lithography, postannealing processes. factors the reach 3.63 4.28 mW/mK2, respectively, ZT values 0.82 0.93, which comparable...
Combined processes of ambient crosswind and vehicle-induced turbulence have a very significant effect on the distribution pollutants emitted by vehicles in street canyon. So purpose this study is to analyze process dispersion when moving pass urban streets based basic theory hydromechanics. The air flow canyon presence vehicle dynamic mesh approach using computational fluid dynamics (CFD) investigated. standard k-epsilon model enhanced wall functions are employed establish airflow field,...
The thermoelements of the traditional thin-film thermoelectric cooler (TEC) are connected electrically in series, thus performance TEC reduces sharply when there is something wrong with any thermoelement. On account this deficiency, we proposed a novel couple parallel and then series to next thermoelements. reliability compared TEC. maximum cooling capacity, temperature, coefficient systematically studied 0, 2, 4 disabled, respectively. results show that superior TEC, while optimal electric...
With the advancement of 3D electronic packaging integration and power density, chip hotspot has increasingly become a technical bottleneck restricting its development. The thin-film thermoelectric cooler (TFTEC) is highly integrated lightweight solid-state cooling technology, which considered to be potential optimal solution for on-chip thermal management electronics. In this paper, an in-plane TFTEC with radial planar structure proposed optimized by using finite element method. influences...