Liang He

ORCID: 0000-0003-2678-1637
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About
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Research Areas
  • Synthesis and properties of polymers
  • Dielectric materials and actuators
  • Epoxy Resin Curing Processes
  • Thermal properties of materials
  • Polymer Nanocomposites and Properties
  • Tribology and Wear Analysis
  • Silicone and Siloxane Chemistry
  • Natural Fiber Reinforced Composites
  • Aerogels and thermal insulation
  • Advanced Battery Technologies Research
  • Graphene research and applications
  • Advanced Battery Materials and Technologies
  • Advancements in Battery Materials
  • Graphene and Nanomaterials Applications
  • Electromagnetic wave absorption materials
  • Advanced Sensor and Energy Harvesting Materials
  • Membrane Separation Technologies
  • Microwave Dielectric Ceramics Synthesis
  • Photopolymerization techniques and applications
  • Polymer Nanocomposite Synthesis and Irradiation
  • Fiber-reinforced polymer composites
  • Magnesium Oxide Properties and Applications
  • Advanced Antenna and Metasurface Technologies
  • Lubricants and Their Additives
  • Ferroelectric and Piezoelectric Materials

Sichuan Research Center of New Materials
2022-2025

University of Electronic Science and Technology of China
2022-2025

Quzhou University
2023

Chengdu University
2023

Changzhou Institute of Technology
2021

Abstract Thermal conductive polymer‐based composites synchronously with stable dielectric and excellent mechanical properties are urgently needed for high‐temperature‐resistant electronic devices. Here, a significant improvement in the thermal conductivity (TC), stability, dielectric, performance was simultaneously achieved polyarylene ether nitrile (PEN)/divinyl siloxane‐bisbenzocyclobutene (BCB) matrix through incorporation of boron nitride nanosheets (BNNS) combined together post‐solid...

10.1002/pc.27915 article EN Polymer Composites 2023-11-20

Abstract A series of Polyarylene ether nitriles (PENs) with different molecular weights were synthesized and studied the effect weight size on performance PEN PEN‐based flexible copper clad laminate (FCCL). It shows that these PENs have excellent thermal properties T g > 200°C, 5% 500°C, a long service life at 200°C (2.64 × 10 3 min, 95 wt% residual weight). The tensile mechanical increase gradually as increases, water absorption decreases increasing PENs. However, peer strength FCCL...

10.1002/app.53947 article EN Journal of Applied Polymer Science 2023-05-01

ABSTRACT This study presents an approach to enhancing dielectric properties, energy storage performance, and thermal stability of polymer composite. A composite film based on polyarylene ether nitrile (PEN) was prepared, in which SiC acted as fillers. PEI PDA layers were co‐deposited the surface particles improve dispersion filler PEN resin. Benefiting from SiC's rigidity, composites exhibit good conductivity low coefficient expansion. Besides, introduction SiC@PDA‐PEI enables have superior...

10.1002/app.56860 article EN Journal of Applied Polymer Science 2025-03-02

Abstract The localized heat accumulation in electronic components not only restricts the further miniaturization and integration of devices but also severely impacts their performance longevity. This thesis develops a high‐temperature‐resistant, insulating, thermally conductive composite material, which can be applied fields such as encapsulation materials flexible copper clad laminate substrate materials. Boron nitride nanosheets (BNNS) are utilized both nucleating agents thermal additives....

10.1002/pc.29799 article EN Polymer Composites 2025-04-01

Abstract Here, we report a polymer dielectric film with great thermal conductive ability and mechanical performance. The has good stability due to the use of polyarylene ether nitrile (PEN) engineering plastic matrix resin. Besides, hybrid filler (Ag-BNNS@PDAPEI) multidimensional structure was prepared in co-deposition way. Then PEN/Ag-BNNS@PDA-PEI composite films were by casting solution method, which could effectively reduce phono scattering effect interfacial resistance (ITR) structural...

10.1088/1742-6596/3008/1/012008 article EN Journal of Physics Conference Series 2025-05-01

Searching for outstanding films with high temperature resistance has sparked fierce interests in the electronics industry. In this study, a novel high-temperature-resistance phthalonitrile end-capped polyarylene ether nitrile (HTR-PEN-Ph) film was fabricated via cross-linking reaction, applying two different curing programs as contrast. The HTR-PEN-Ph were verified through FTIR, gel content test to be confirmed reaction. Then thermal results elucidated that PEN-Ph treated two-stage program...

10.1177/09540083221078930 article EN High Performance Polymers 2022-03-26

Abstract The synergistic effects of carbon fiber (CF) and polytetrafluoroethylene (PTFE) on the friction wear behavior polyarylene ether nitrile (PEN) under dry lubrication condition were studied. According to scanning electron microscopy (SEM) composites' surface after wear, mechanism composites sliding was analyzed. research results show that addition solid lubricants PTFE fibers PEN helps enhance properties wear. specific rate is decreased 5.7 × 10 −7 mm 3 /N m at a composition 5 wt%,...

10.1002/app.54299 article EN Journal of Applied Polymer Science 2023-07-03

Abstract The proliferation of electronic devices and the widespread adoption microwave-based technologies have resulted in a notable rise electromagnetic radiation pollution. In present work, novel flexible lightweight polyarylene ether nitrile (PEN)-based composite for efficient interference (EMI) shielding was prepared by introducing dual-loss hybrid material (PKMWCNT@Fe 3 O 4 ) into PEN via non-solvent induce phase separation method assembling it layer-by-layer with carbon fiber (CF)...

10.1515/ntrev-2023-0167 article EN cc-by Nanotechnology Reviews 2023-01-01
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