A5035400674- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Copper Interconnects and Reliability
- Advanced Welding Techniques Analysis
- Intermetallics and Advanced Alloy Properties
- Aluminum Alloys Composites Properties
- Electrodeposition and Electroless Coatings
- Metallurgical and Alloy Processes
- Aluminum Alloy Microstructure Properties
- Antenna Design and Analysis
- Semiconductor materials and interfaces
- Advanced Antenna and Metasurface Technologies
- Conducting polymers and applications
- Antenna Design and Optimization
- Microwave Engineering and Waveguides
- Lightning and Electromagnetic Phenomena
- Integrated Circuits and Semiconductor Failure Analysis
- Semiconductor materials and devices
- X-ray Diffraction in Crystallography
- Crystallization and Solubility Studies
- Electromagnetic Compatibility and Noise Suppression
- Power Transformer Diagnostics and Insulation
- Solidification and crystal growth phenomena
- Electrostatic Discharge in Electronics
- Advanced battery technologies research
Dalian University of Technology
2015-2024
Wuhan Ship Development & Design Institute
2013-2023
Sun Yat-sen Memorial Hospital
2022-2023
Sun Yat-sen University
2022-2023
Bridge University
2023
Dalian University
2022
Shenzhen University
2019
Foshan University
2019
Zhejiang University
2014
State Key Laboratory of Silicon Materials
2014
Abstract The growth behavior of intermetallic compounds (IMCs) at the liquid-solid interfaces in Cu/Sn/Cu interconnects during reflow 250 °C and 280 on a hot plate was investigated. Being different from symmetrical isothermal aging, interfacial IMCs showed clearly asymmetrical reflow, i.e., Cu 6 Sn 5 IMC cold end significantly enhanced while that 3 hindered especially end. It found temperature gradient had caused mass migration atoms toward end, resulting sufficient atomic flux for reaction...
The downsizing of solder balls results in larger interfacial intermetallic compound (IMC) grains and less Cu substrate consumption lead-free soldering on substrates. This size effect the reaction is experimentally demonstrated theoretically analyzed using Sn-3.0Ag-0.5Cu Sn-3.5Ag balls. between Sn-xAg-yCu solders substrates a dynamic response to combination effects IMC growth, composition variation interface zone. A concentration gradient controlled (CGC) kinetics model proposed explain...
The focus of this study is on the role Cu content in dissolution kinetics high-Sn solders during solid/liquid reaction accompanied by interfacial intermetallic compound formation. Small additions (0.7%, 1.5%) dramatically decrease rate at low temperatures. Sn-3.5Ag, as expected, has a similar to that pure Sn. difference various molten explained terms solubility limit based Cu-Sn phase diagram. correlation between metallurgical aspects η(Cu6Sn5) formation and leads an understanding mechanism...
Polyaniline doped with hydrochloride acid was prepared via a chemical oxidative polymerization between APS oxidant and aniline monomer in hydrochloric solution different concentrations. The diameter of each PANI wormlike nanorod is fairly uniform, the decreases increase concentration HCl. For degradation stage polymeric backbone, rate increases decrease HCl concentration, which means samples synthesized higher possess more stable structures. highest conductivity 1.04 S/cm achieved when 1.0...
Although cationic epoxy was optimized for low-melting SnBi58 solder ACF joints with the lowest coefficient of thermal expansion (CTE) in terms reliability, also showed a faster curing property than any other types adhesives. In fact, joint shapes at 250 °C bonding are very different from those 200 bonding. this paper, four adhesive film were investigated Sn-3Ag-0.5Cu on electrical performances and reliability pressure cooker test (PCT). Thermal stability films tested to be first. Resin...