About
Contact & Profiles
A5069457791
Research Areas
- Advanced Surface Polishing Techniques
- Diamond and Carbon-based Materials Research
- Corrosion Behavior and Inhibition
- Advanced machining processes and optimization
- Copper Interconnects and Reliability
- Semiconductor materials and devices
- Hydrogen embrittlement and corrosion behaviors in metals
- Metal and Thin Film Mechanics
- Electrodeposition and Electroless Coatings
- Advanced materials and composites
- Advanced ceramic materials synthesis
- Integrated Circuits and Semiconductor Failure Analysis
- Advanced Machining and Optimization Techniques
- Concrete Corrosion and Durability
Hebei University of Technology
2020-2022
Tianjin University of Technology
2021-2022
10.1016/j.jmatprotec.2021.117150
article
EN
Journal of Materials Processing Technology
2021-03-24
10.1016/j.apsusc.2021.151676
article
EN
Applied Surface Science
2021-10-28
10.1016/j.colsurfa.2020.124872
article
EN
Colloids and Surfaces A Physicochemical and Engineering Aspects
2020-04-20
10.1016/j.molliq.2022.118792
article
EN
Journal of Molecular Liquids
2022-02-22
10.1016/j.mseb.2021.115330
article
EN
Materials Science and Engineering B
2021-07-01
10.1016/j.triboint.2020.106576
article
EN
Tribology International
2020-07-27
10.1007/s10800-021-01587-5
article
EN
Journal of Applied Electrochemistry
2021-06-18
10.1007/s12633-021-01448-y
article
EN
Silicon
2021-11-02
10.1016/j.mssp.2021.106321
article
EN
Materials Science in Semiconductor Processing
2021-11-25
10.1016/j.mssp.2022.107176
article
EN
Materials Science in Semiconductor Processing
2022-10-21
Abstract The colloidal silica is usually used as the abrasive for copper CMP polishing slurry in integrated circuit multilayer wiring. aggregation of slurries tend to aggregate spontaneously, resulting continuous changes effect, such scratch defects, removal rate, etc. This situation can lead potential instability slurry, which should be avoided industrial production. In this paper, and dispersion properties were systematically studied, an improved scheme was proposed improve prevent...
10.21203/rs.3.rs-739722/v1
preprint
EN
cc-by
Research Square (Research Square)
2021-07-28
Coming Soon ...