A5055648505- Copper Interconnects and Reliability
- Advanced Surface Polishing Techniques
- Electronic Packaging and Soldering Technologies
- Agricultural Engineering and Mechanization
- Soil Mechanics and Vehicle Dynamics
- Aluminum Alloy Microstructure Properties
- Anodic Oxide Films and Nanostructures
- Solidification and crystal growth phenomena
- Polymer-Based Agricultural Enhancements
- Rice Cultivation and Yield Improvement
- Congenital Anomalies and Fetal Surgery
- Nutrition and Health in Aging
- Vibration and Dynamic Analysis
- Metal and Thin Film Mechanics
- Esophageal and GI Pathology
- Advanced Sensor and Control Systems
Nanjing University of Aeronautics and Astronautics
2018-2023
Mongolian University of Science and Technology
2013
This study is aimed at determining the preoperative nutritional status of patients with hepatic alveolar echinococcosis (HAE), and subsequently establish a concise reasonable evaluation indicator. The established method could be used for clinical risk assessment prediction post-operation recovery.The basic patient information on height, body weight, BMI encephalopathy 93 HAE were examined. Subsequently, abdominal ultrasonography, blood coagulation liver function tests done patients. Liver...
Electromigration and stress migration induced failure of thin-film metal interconnects is one the most challenging material reliability issues for microelectronic circuits toward ultra-large-scale integrated circuits. Based on theory anisotropic interface diffusion, a modified Cahn–Hilliard phase field model established to elucidate instability splitting processes elliptical inclusions under multi-physics field. The verified by comparing numerical theoretical solutions evolution circular...