About
Contact & Profiles
A5098444651
Research Areas
- Heat Transfer and Optimization
- Electronic Packaging and Soldering Technologies
- Heat Transfer Mechanisms
- Heat Transfer and Boiling Studies
- 3D IC and TSV technologies
Budapest University of Technology and Economics
2023
In this article, an innovative approach to enhance heat transfer mechanisms in 2.5-D heterogeneous packages by integrating microchannels into the silicon interposer is presented. An analytical model introduced determine main thermal properties of cooling system. To demonstrate performance device, a 3-D created, and total 12 cases for four scenarios are investigated numerically. The results compared with classical applying 10–100 cm3/min water flow microchannels. It demonstrated that case...
10.1109/tcpmt.2023.3298378
article
EN
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IEEE Transactions on Components Packaging and Manufacturing Technology
2023-07-24
10.1016/j.csite.2024.105468
article
EN
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Case Studies in Thermal Engineering
2024-11-12
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