A5033924088- Advanced Surface Polishing Techniques
- Advanced machining processes and optimization
- Advanced Machining and Optimization Techniques
- Diamond and Carbon-based Materials Research
- Integrated Circuits and Semiconductor Failure Analysis
- Adhesion, Friction, and Surface Interactions
- Tunneling and Rock Mechanics
- Advanced Fiber Optic Sensors
- Metal and Thin Film Mechanics
- Advanced ceramic materials synthesis
- Additive Manufacturing and 3D Printing Technologies
- Electronic Packaging and Soldering Technologies
- Laser Material Processing Techniques
- Mechanical Behavior of Composites
- Particle Dynamics in Fluid Flows
- Total Knee Arthroplasty Outcomes
- Copper Interconnects and Reliability
- Advanced materials and composites
- Coagulation and Flocculation Studies
- Particle Detector Development and Performance
- Surface Modification and Superhydrophobicity
- Surface Roughness and Optical Measurements
- Orthopaedic implants and arthroplasty
- Image and Signal Denoising Methods
- Metallurgy and Material Forming
Dong-A University
2021-2024
Tongmyong University
2014-2020
Pusan National University
2005-2020
Korea University
2018-2020
Life Cycle Engineering (United States)
2019
University of Maryland, College Park
2016-2019
University of California, Berkeley
2012
University of California System
2012
Catholic University of America
2010
Catholic University of Daegu
2009
Sapphire (alpha-Al2O3) is an important ceramic material that widely used in substrate for electronics. We investigate the chemical reaction layer on a sapphire wafer using X-ray photoelectron microscopy (XPS) and atomic force (AFM). The frictional characteristics of mechanical polishing (CMP) was studied in-situ friction monitoring system. From XPS analysis AFM experiment, chemically-reacted verified surface through between chemicals slurry. During CMP, mainly depended applied pressure....
After the development of 3D printing, post-processing 3D-printed materials has been continuously studied, and with recent expansion application interest in it is increasing. Among various surface-machining processes, chemical mechanical polishing (CMP) a technology that can effectively provide fine surface via reactions material removal. In this study, two methods were evaluated for reduction roughness glossiness stereolithography apparatus (SLA) ABS (acrylonitrile butadiene styrene)-like...
Silicon carbide (SiC) is widely used as a power semiconductor substrate material, even if it takes large amount of processing time to secure an appropriate surface wafer for devices after chemical mechanical polishing (CMP). Therefore, studies on SiC CMP have focused shortening the by increasing material removal efficiency. Among methods that been studied recently, photocatalysis-assisted (PCMP) method known efficiently increase rate (MRR) under UV light and photocatalysts. However, limited...