Hyunseop Lee

ORCID: 0000-0003-4717-3147
Publications
Citations
Views
---
Saved
---
About
Contact & Profiles
Research Areas
  • Advanced Surface Polishing Techniques
  • Advanced machining processes and optimization
  • Advanced Machining and Optimization Techniques
  • Diamond and Carbon-based Materials Research
  • Integrated Circuits and Semiconductor Failure Analysis
  • Adhesion, Friction, and Surface Interactions
  • Tunneling and Rock Mechanics
  • Advanced Fiber Optic Sensors
  • Metal and Thin Film Mechanics
  • Advanced ceramic materials synthesis
  • Additive Manufacturing and 3D Printing Technologies
  • Electronic Packaging and Soldering Technologies
  • Laser Material Processing Techniques
  • Mechanical Behavior of Composites
  • Particle Dynamics in Fluid Flows
  • Total Knee Arthroplasty Outcomes
  • Copper Interconnects and Reliability
  • Advanced materials and composites
  • Coagulation and Flocculation Studies
  • Particle Detector Development and Performance
  • Surface Modification and Superhydrophobicity
  • Surface Roughness and Optical Measurements
  • Orthopaedic implants and arthroplasty
  • Image and Signal Denoising Methods
  • Metallurgy and Material Forming

Dong-A University
2021-2024

Tongmyong University
2014-2020

Pusan National University
2005-2020

Korea University
2018-2020

Life Cycle Engineering (United States)
2019

University of Maryland, College Park
2016-2019

University of California, Berkeley
2012

University of California System
2012

Catholic University of America
2010

Catholic University of Daegu
2009

10.1016/j.ijmachtools.2011.01.007 article EN International Journal of Machine Tools and Manufacture 2011-01-27

10.1016/j.jmatprotec.2009.05.027 article EN Journal of Materials Processing Technology 2009-05-31

Sapphire (alpha-Al2O3) is an important ceramic material that widely used in substrate for electronics. We investigate the chemical reaction layer on a sapphire wafer using X-ray photoelectron microscopy (XPS) and atomic force (AFM). The frictional characteristics of mechanical polishing (CMP) was studied in-situ friction monitoring system. From XPS analysis AFM experiment, chemically-reacted verified surface through between chemicals slurry. During CMP, mainly depended applied pressure....

10.1166/jnn.2012.4679 article EN Journal of Nanoscience and Nanotechnology 2012-02-01

10.1007/s40684-014-0002-7 article EN International Journal of Precision Engineering and Manufacturing-Green Technology 2014-01-01

After the development of 3D printing, post-processing 3D-printed materials has been continuously studied, and with recent expansion application interest in it is increasing. Among various surface-machining processes, chemical mechanical polishing (CMP) a technology that can effectively provide fine surface via reactions material removal. In this study, two methods were evaluated for reduction roughness glossiness stereolithography apparatus (SLA) ABS (acrylonitrile butadiene styrene)-like...

10.3390/mi11090843 article EN cc-by Micromachines 2020-09-08

Silicon carbide (SiC) is widely used as a power semiconductor substrate material, even if it takes large amount of processing time to secure an appropriate surface wafer for devices after chemical mechanical polishing (CMP). Therefore, studies on SiC CMP have focused shortening the by increasing material removal efficiency. Among methods that been studied recently, photocatalysis-assisted (PCMP) method known efficiently increase rate (MRR) under UV light and photocatalysts. However, limited...

10.3390/lubricants11050229 article EN cc-by Lubricants 2023-05-18

10.1007/s12541-012-0038-y article EN International Journal of Precision Engineering and Manufacturing 2012-02-01

10.1007/s40684-015-0041-8 article EN International Journal of Precision Engineering and Manufacturing-Green Technology 2015-10-01

10.1007/s12541-019-00161-6 article EN International Journal of Precision Engineering and Manufacturing 2019-05-27
Coming Soon ...