A5100462972- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Aluminum Alloys Composites Properties
- High-Temperature Coating Behaviors
- Intermetallics and Advanced Alloy Properties
- High Entropy Alloys Studies
- Concrete and Cement Materials Research
- Metal and Thin Film Mechanics
- Advanced materials and composites
- Advanced Welding Techniques Analysis
- Geomechanics and Mining Engineering
- Grouting, Rheology, and Soil Mechanics
- Smart Materials for Construction
- Layered Double Hydroxides Synthesis and Applications
- Advanced Sensor and Energy Harvesting Materials
- Concrete Properties and Behavior
- Endometriosis Research and Treatment
- High-Voltage Power Transmission Systems
- Surface Treatment and Residual Stress
- Aerogels and thermal insulation
- Aluminum Alloy Microstructure Properties
- Concrete Corrosion and Durability
- RFID technology advancements
- Chalcogenide Semiconductor Thin Films
- Engineering Applied Research
Hebei University of Technology
2025
Institute of Microelectronics
2025
China Three Gorges University
2024
Northwestern Polytechnical University
2024
Osaka University
2019-2023
Huaiyin Institute of Technology
2022
Lanzhou University of Technology
2022
Shanghai Traditional Chinese Medicine Hospital
2021
Tampere University
2020
City University of Hong Kong
2019
Abstract High-entropy alloys (HEAs) are promising materials for next-generation applications because of their mechanical properties, excellent high-temperature stability, and resistance against oxidation corrosion. Although many researchers have investigated HEA applications, few considered low-temperature applications. Here we demonstrate an unprecedented intermetallic compound (Fe, Cr, Co, Ni, Cu)Sn 2 at the interface between Sn-3.0Ag-0.5Cu (SAC) solder FeCoNiCrCu 0.5 substrate after...
Package-on-Package (PoP) is a popular technology for fabricating chipsets of accelerated processing units. However, the coefficient thermal expansion mismatch between Si chips and polymer substrates induces warpage during reflow process. As such, temperature reliability solder joints are critical aspects PoP. Although Sn58Bi good candidate low-temperature processes, its brittleness causes other issues. In this study, an in-situ observation was performed on composite solders (CSs) made...
Thermomigration (TM) has become a critical reliability issue in advanced electronic packaging because of Joule heating. A temperature gradient is required to conduct heat away, and only 1 °C difference across 10 μm thick microbump produces 1000 °C/cm, which can cause TM, especially low melting eutectic Sn-Bi solder interconnects. We report here that Bi atoms moving from the hot end cold gradient, are dominant diffusing species. Under assumption constant volume, Sn squeezed by at have...
Abstract Objective Thymopentin (5TP) significantly improved typical murine premature ovarian failure (POF) symptoms induced by a high‐fat and high‐sugar (HFHS) diet. However, its effect mechanism remain unclear. Materials methods RNA‐Seq was used to detect the differentially expressed genes among each group. HFHS‐induced POF mouse model generated injected with siRNA using Poly (lactic‐co‐glycolic acid) (PLGA) as carrier. Results suggested that 5TP promoted expression of Yin Yang 2 (YY2) in...
Formic acid (FA) atmosphere is promising to achieve chemical reduction at the oxidized surfaces of solder and matrix material during soldering, replacing flux being challenging as continuous decrease in pitch bump a three-dimensional integrated circuit. Although previous study observed effect Sn steaming on wettability FA it has not been understood yet by adequate studies. This demonstrates fluxless soldering behavior Sn-3.0Ag-0.5Cu (SAC) solder/Cu under atmosphere. Resembling vulcanian...
Sintered silver paste is a popular material for die attachment technology in power electronics. However, using traditional nano-silver when fabricating sintered joints has intrinsic problems that cannot be overcome, such as the high cost of particles and their potential health hazards. In this study, novel micro-silver was utilized sintering bonding to overcome limitations paste. Although an excellent candidate replace processes reduce harm humans, oxidation at copper substrates on both...
Converter transformer plays an important role in the HVDC transmission system. The valve side insulation converter withstands AC superimposed DC electric field during operation. In order to investigate flow electrification characteristics of oil-paper under field, tube model with concentric cylindrical electrode geometry was built laboratory. Experiment study on carried using closed oil circulating system, and influence rule mechanism amplitude component ratio velocity analyzed. experiment...
Abstract High-entropy alloys (HEAs) are well known for their excellent high-temperature stability, mechanical properties, and promising resistance against oxidation corrosion. However, low-temperature applications rarely studied, particularly in electronic packaging. In this study, the interfacial reaction between a Sn-3.0Ag-0.5Cu solder FeCoNiCrCu 0.5 HEA substrate was investigated. (Cu 0.76 , Ni 0.24 ) 6 Sn 5 intermetallic compound formed at interface substrate. The average grain size on...
Many power semiconductor devices now require high tolerance of current density and reliability at temperature, therefore Cu-Cu bonding using an insert material has raised the level concerns for its great thermal stability conductivity. In this study, a low-pressure process was developed to achieve preoxidized Cu microparticles under formic acid atmosphere. The were generate oxide films nanostructures, which then reduced bonded 300 °C atmosphere bonding. Shear strength bondings tested...
In this paper, the manufacturing parameters of a passive ultra-high frequency (UHF) radio identification (RFID)-based air humidity sensor were studied and optimized to reach highest sensing ability. The is fabricated by 3D printing combined with embroidering technology. high environment, tag permanently changes its shape from flat curved, which has significant effect on read range received signal strength indicator (RSSI) value. By modifying infill percentage 3D-printed pattern stretching...
To have a better understanding of the wetting behavior Sn-based solders on aluminum substrate, s series comparative experiments with Sn, Sn-3.5Ag (SA), and Sn-3.0Ag-0.5Cu (SAC305) were performed by direct heating hot plate normal flux in air. The morphology was measured cross-section images using scanning electron microscope (SEM), intermetallic compounds, at interface after heating, identified phase diagram calculated FactSage, confirmed energy dispersive X-ray spectroscopy (EDS) equipped...
Thermomigration has become a critical reliability issue in consumer electronic products because of Joule heating. To conduct heat away, it requires temperature gradient. Just 1°C difference across microbump 10 μm diameter produces gradient 1000 °C/cm, which can cause thermomigration, especially low melting eutectic SnBi solder joints. However, the study thermomigration soler joints is hardly seen, not to mention effect and details. In this study, Cu/Sn-58Bi/Cu joint with 42 height, bonded by...
Fatigue failure is one of the main reasons for engineering application components. It then necessary to propose a novel model predicting fatigue strength expensive and time-consuming, could be predicted by tensile based on proposed model. In present study, four intensity levels 304 stainless steel (SS) were prepared rolling, in order explore relationship between strength, which, increase gradually with grain refinement. A prediction established that affected work-hardening strength....