Flora Wu

ORCID: 0009-0002-5100-2009
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  • Recycling and Waste Management Techniques

Abstract The ability to fabricate electronics by printing has enabled an array of technologies that can create intelligent or smart packaging; however, this come at the cost recyclability. Selection materials compatible with recycling streams is possible, such as paperboard and carbon inks, but there a trade-off in terms performance, flexibility reliability. A major challenge for use delamination deformation when subject small bend radii. substrate tendency crease bent beyond critical...

10.1088/2058-8585/ad8935 article EN cc-by Flexible and Printed Electronics 2024-10-21
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