Y.W. Chen

ORCID: 0009-0003-9465-3562
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About
Contact & Profiles
Research Areas
  • Muon and positron interactions and applications
  • Graphene research and applications
  • Cooperative Communication and Network Coding
  • Copper Interconnects and Reliability
  • Semiconductor materials and devices
  • Membrane Separation and Gas Transport
  • Aerodynamics and Acoustics in Jet Flows
  • Time Series Analysis and Forecasting
  • Particle Detector Development and Performance
  • Fluid Dynamics and Turbulent Flows
  • Wind and Air Flow Studies
  • Caching and Content Delivery
  • Plasma Diagnostics and Applications
  • Advanced Text Analysis Techniques
  • Membrane Separation Technologies
  • Music and Audio Processing
  • Semiconductor materials and interfaces
  • Advanced Data Storage Technologies

University of Science and Technology of China
2024-2025

University of British Columbia
2025

Hefei National Center for Physical Sciences at Nanoscale
2024

Semiconductor Manufacturing International (Italy)
2006

The migration trajectories of spanwise vortex structures were investigated to reveal their variation patterns and distribution characteristics, explicitly focusing on correlation with the characteristic quantities uniform momentum zones (UMZs). This approach is crucial for deepening understanding wall turbulence. Using a three-camera array particle image velocimetry experiment, dataset stream-normal flow field was acquired over region extending 8δ. space-time cross algorithm then employed...

10.1063/5.0260522 article EN Physics of Fluids 2025-04-01

10.1007/s11548-025-03414-0 article EN International Journal of Computer Assisted Radiology and Surgery 2025-05-22

10.1016/j.nima.2024.169609 article EN Nuclear Instruments and Methods in Physics Research Section A Accelerators Spectrometers Detectors and Associated Equipment 2024-07-11

10.1016/j.nima.2024.169286 article EN Nuclear Instruments and Methods in Physics Research Section A Accelerators Spectrometers Detectors and Associated Equipment 2024-03-26

In this paper, inter layer dielectric characteristic ramped voltage breakdown (VBD) performance of multiplayer Cu/SiOC interconnect was studied. The results showed that the reliability is highly process-related. Some dominating factors, such as via etching process, integration scheme used and Cu/dielectric interface etc., were discussed proposed to improve

10.1109/ipfa.2006.251009 article EN 2006-07-01
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