A5113276399- Photonic and Optical Devices
- Semiconductor Lasers and Optical Devices
- Advanced optical system design
- Optical Network Technologies
- Antenna Design and Optimization
- Soil Moisture and Remote Sensing
- Advanced Surface Polishing Techniques
- Space Satellite Systems and Control
- Advanced Measurement and Metrology Techniques
- Speech and Audio Processing
University of Michigan
2024
Sandia National Laboratories California
1995-2002
GTx (United States)
1996
Sandia National Laboratories
1995
Abstract To enhance the accuracy of robotic drilling in aircraft structures, numerous methods for detecting reference holes have been proposed. However, these are often ineffective presence occlusions or high noise levels. In this paper, we propose a coarse-to-fine method multiple types holes. At coarse localization stage, gradient-based template matching is used to efficiently and accurately identify candidate regions. For precise detection hybrid proposed extract contours within regions by...
The fabrication and performance of a vertical cavity surface emitting laser array integrated with microlenses are reported. lasers emit at 967 nm through the substrate integral polyimide microlenses. This design reduces beam divergence provides an device that emits nearly collimated for applications such as optical interconnects.
New applications of photonic interconnects will involve the insertion parallel-channel links into Multi-Chip Modules (MCMs). Such drive link components more compact forms that consume far less power than traditional telecommunication data links. MCM-based also require simplified circuitry, lower cost, and higher reliability has been demonstrated currently in optoelectronic technologies. The work described is a parallel array, designed for vertical (Z-Axis) interconnection layers signal...
As Multi-Chip Modules (MCMs) grow in chip count and complexity, increasingly large numbers of Input/Output (I/O) channels will be required for connection to other MCMs or printed wiring boards. In applications such as digital signal processing, increases processing density (number operations a given volume) can obtained stacked MCM arrangements. The potential pin counts I/O densities these architectures require technology beyond the limits present day capabilities. This problem is...
Vertical-cavity surface-emitting lasers (VCSELs) are very desirable sources for a variety of optical system applications. In particular, the inherent planarity arrays VCSELs makes them ideal compact 3-dimensional interconnect systems 1 . Despite smaller beam divergence than edge emitting lasers, spreading emerging perpendicular to surface VCSEL limits range free space transmission, reduces device density in an array and can introduce cross-talk. Although external using separate lens is...