A5090570032- Silicon Carbide Semiconductor Technologies
- Aluminum Alloys Composites Properties
- Advanced DC-DC Converters
- Corrosion Behavior and Inhibition
- Advanced ceramic materials synthesis
- Semiconductor materials and devices
- Multilevel Inverters and Converters
- Fiber-reinforced polymer composites
- MRI in cancer diagnosis
- Nanomaterials and Printing Technologies
- Radiomics and Machine Learning in Medical Imaging
- Electronic Packaging and Soldering Technologies
- Epoxy Resin Curing Processes
- Data Analysis with R
- Advanced materials and composites
- Surface Modification and Superhydrophobicity
- Optical Network Technologies
- Plant Gene Expression Analysis
- Nanofabrication and Lithography Techniques
- High voltage insulation and dielectric phenomena
- Conducting polymers and applications
- Electric Vehicles and Infrastructure
- Wireless Power Transfer Systems
- Plant Stress Responses and Tolerance
- Polymer composites and self-healing
Huazhong University of Science and Technology
2024-2025
Sungkyunkwan University
2025
Hebei University of Science and Technology
2024
Jiangsu University of Science and Technology
2024
Wuhan University of Science and Technology
2019
Cu and Ag nanoparticles are widely encouraged to be regarded as the die-attach material for power device packaging due small size effects excellent physical properties. However, prone oxidation during sintering process, high porosity easy electromigration of after sintering, which seriously affect reliability interconnection joints. Cu-Ag composite gradually considered most promising material. Unfortunately, there is a lack study into atomic diffusion mechanism heterogeneous sintering. The...
The V-myb myeloblastosis viral oncogene homolog (MYB) family participate in various bioprocesses including development and abiotic stress responses. In the present study, we first report a 1R SHAQKYF-class MYB, MaMYBR30, mulberry. Subcellular localization sequence analysis indicated MaMYBR30 is located nucleus belongs to CCA-like subgroup with conserved SHAQKYF motif. Expression profile showed that expressed leaves can be induced by drought salt stress. down-regulation of using virus-induced...
The use of bionic structures for the efficient and passive directional transportation liquid droplets is crucial in numerous industrial applications. Compared with conventional fluids, metals are stable under a wide range environmental conditions owing to their excellent physicochemical properties. However, remains challenging. Herein, inspired by pecking feeding mode shorebirds, we performed series systematic molecular dynamics simulations study transport lithium (Li) between non-parallel...
To explore the preparation of nano-silver acupuncture needles and evaluate appearance, structure properties. Stainless steel were pretreated by polishing with sandpaper cleaning ultrapure water absolute ethanol. As working electrodes, placed in an electrolyte solution contained silver nitrate (AgNO3), potassium (KNO3), polyvinylpyrrolidone (PVP); nanoparticles deposited at a constant voltage -0.2 V for 1 200 s. The heat-treatment was conducted 600 ℃ 15 min argon atmosphere to strengthen...
Abstract In this paper, graphene oxide (GO) is used as a matrix, and it modified with silane coupling agent (KH550) to prepare GO. The GO/waterborne polyurethane composite coatings different contents are prepared by chemical grafting, their structural characterization tests carried out. results show that the can effectively modify GO, surface of GO has more oxygen-containing functional groups. added enhance corrosion resistance coating, coating was optimal when mass fraction 0.03%, 5% occurs...
Abstract An environmentally friendly chromium-free insulating coating suitable for oriented silicon steel was prepared by using aluminium dihydrogen phosphate, silica sol, water-based resin, sodium tetraborate and graphene aqueous dispersion as main raw materials. The morphology of the characterized scanning electron microscopy. Corrosion resistance investigated neutral salt spray test electrochemical test. Magnetic properties surface were measured. results showed that flat; addition could...
In multichip SiC power modules, unbalanced dynamic currents between the paralleled dies can induce switching losses and junction temperatures, reducing device's lifetime. Existing current sharing methods face challenges of low integration or insufficient effectiveness. This article presents a highly integrated balancing method with full-coupled inductors in gate branches. Compared to existing methods, presented does not change simple circuit layout module area. Thus, it is easier implement....
To leverage the outstanding high-temperature resistance of silicon carbide (SiC), theoretically up to 500 °C, conventional packaging materials, and structures have become inadequate meet requirements. The double-sided cooling (DSC) package structure can eliminate power bond wires, which are reliability weak points in package, has low parasitic inductance thermal resistance. However, it still faces severe stress, hinders its applications. Hence, this study proposes a resistant DSC...