A5102940855- Plasma Diagnostics and Applications
- Millimeter-Wave Propagation and Modeling
- Antenna Design and Analysis
- Microwave Engineering and Waveguides
- Semiconductor materials and devices
- Thin-Film Transistor Technologies
- Molecular Junctions and Nanostructures
- Copper Interconnects and Reliability
- Graphene research and applications
- Advanced Data Storage Technologies
- Vanadium and Halogenation Chemistry
- Ferroelectric and Negative Capacitance Devices
- Optical Systems and Laser Technology
- High voltage insulation and dielectric phenomena
- Silicone and Siloxane Chemistry
- Piezoelectric Actuators and Control
- Aerosol Filtration and Electrostatic Precipitation
- Polymer composites and self-healing
- Building Energy and Comfort Optimization
- Plasma Applications and Diagnostics
- Advanced Fluorescence Microscopy Techniques
- Chemical Synthesis and Reactions
- Advanced Optical Sensing Technologies
- Protein Degradation and Inhibitors
- Sulfur-Based Synthesis Techniques
Samsung (South Korea)
2015-2023
Pusan National University
1995-2019
Pohang University of Science and Technology
2002-2007
Seoul National University
2003
Sungkyunkwan University
2003
For the first time, 20nm DRAM has been developed and fabricated successfully without extreme ultraviolet (EUV) lithography using honeycomb structure (HCS) air-spacer technology. The cell capacitance (Cs) can be increased by 21% at same size a novel low-cost HCS technology with one argon fluoride immersion (ArF-i) layer. parasitic bit-line (BL) is reduced 34% an whose breakdown voltage 30% better than that of conventional
Inhibitors of histone deacetylases (HDACs) have been shown to induce differentiation and/or apoptosis human tumor cells. Novel 3-(4-substituted-phenyl)-N-hydroxy-2-propenamides prepared as a new class HDAC inhibitors and evaluated for their antiproliferative activity inhibitory activity. Incorporation 1,4-phenylene carboxamide linker, by 5, 4-(dimethylamino)phenyl or 4-(pyrrolidin-1-yl)phenyl group cap substructure generated highly potent hydroxamic acid-based 5a 5b.
This paper presents the novel design techniques for terahertz (THz) antenna-in-package (AiP) to overcome issues resulting from multilayer PCB-based antenna array integration, fabrication, and measurement. We propose a wideband dual-polarized stub-loaded proximity-coupled stacked patch vertical power divider as solutions. Circuit analysis is performed provide equivalent circuit model its validity. designed, simulated, measured 4×1 subarray, which ultimately builds THz 8×8 AiP next generation...
Fully reliable lean-free stacked capacitor, with the meshes of supporter made Si/sub 3/N/sub 4/, has been successfully developed on 80nm COB DRAM application. This novel process terminates persistent problems caused by mechanical instability storage node high aspect ratio. With Mechanically Enhanced Storage for virtually unlimited Height (MESH), cell capacitance over 30fF/cell obtained using conventional MIS dielectric an equivalent 2.3nm oxide thickness. inherently capacitor makes it...
This paper presents a wideband dual-fed/dual-polarized sub-terahertz (THz) array antenna design and D-band measurement system setup. The designed is <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$4\times 1$</tex> linear operating from 136 to 148 GHz. fed by vertically constructed corporate feeding network, it fabricated through printed circuit board (PCB) using modified semi-additive process (mSAP). For impedance matching of the element,...
This letter proposes an architecture for antenna-in-package (AiP) operating at sub-terahertz (sub-THz) frequencies to improve the isolation between two ports in a dual-polarized stacked patch antenna. The design features orthogonal fan-out lines that extend from vertical via probe feeding, each covered by grounded shielding geometry. proposed structure improves of single element up 10 dB polarization. performance was verified through simulated and measured results using 4 × 1 subarray....
Polyurethane nanocomposites reinforced with organoclay or nanosilica were prepared by dispersing the filler during polymerization. The modulus and thermal stability of polyurethane enhanced addition fillers effect was more pronounced than nanosilica. crystallization damping behaviors showed that mobility chain is restricted filler, evident organoclay.
This paper introduces new impedance matching technique for via transition of multi-layer PCB based sub-THz antenna-in-package (AiP). In the proposed design, multiple resonating stubs are cascaded in vertical direction along to create multi-stage wideband network. The stub employs rectangular ring reduce length by increasing parasitic capacitance around ring. presented this is demonstrated through fabrication, and measurement subarray next generation's 6G AiP operating from 136 148 GHz. four...
Abstract ChemInform is a weekly Abstracting Service, delivering concise information at glance that was extracted from about 100 leading journals. To access of an article which published elsewhere, please select “Full Text” option. The original trackable via the “References”
Abstract ChemInform is a weekly Abstracting Service, delivering concise information at glance that was extracted from about 100 leading journals. To access of an article which published elsewhere, please select “Full Text” option. The original trackable via the “References”