The effect of pad surface characteristics on the thermal, tribological and kinetic attributes copper CMP was investigated. Three CMC D100 pads with very different micro-textures were generated using three CVD-coated diamond conditioning discs. Pad samples collected after polishing analyzed for their contact area topography confocal microscopy. area, density, asperity height increased increasing conditioner aggressiveness. Copper removal rates temperatures pressure sliding velocity all albeit...

This study investigated the effect of different pad surface micro-textures on tribological, thermal and kinetic attributes during copper chemical mechanical planarization (CMP). Different were generated by two vapor deposited (CVD) diamond-coated conditioner discs (i.e. Disc A B). Results showed that while temperature removal rate increased with polishing pressure sliding velocity both discs, B consistently lower rates coefficients friction (COF) than A. To fundamentally elucidate cause(s)...

In chemical mechanical planarization (CMP), Stribeck curves are normally constructed by plotting average coefficient of frictions (COF) against the Sommerfeld number. Consequently, traditional fail to provide a full explanation lubrication phenomena simply because COF and polishing downforce can fluctuate significantly due stick-slip transient instabilities caused kinematics consumables. This study introduces new method for rapidly generating an "improved" curve (i.e. Stribeck+ curve) that...

The Stribeck+ curve was successfully applied to silicon dioxide chemical mechanical planarization processes characterize the tribology of such under different process conditions and consumables. Results showed that capable rapidly determining differentiating tribological mechanism among all cases studied in this manuscript. could indicate stability as shown by spread COF vertical clusters. also confirmed a previously known effect greater ratio pad's up-features total pad area, probability...

Understanding the tribology of polishing processes using an improved Stribeck curve (i.e. referred as Stribeck+ curve) elucidates essential factors governing mechanical aspects chemical planarization. This study investigated tribological and thermal copper tungsten blanket wafer on Politex soft pad with a multitude gradual yet continuous changes in pressure sliding velocity. work also attempted to understand frictional transients associated such dynamic processes. Results showed that...

In this study, slurry availability and the extent of mixing (i.e., among fresh slurry, spent residual rinse-water) were varied via three different injection schemes. An ultraviolet enhanced fluorescence technique was employed to qualitatively indicate its flow on pad during polishing. This study investigated standard center area application a system (SIS) that covered only outer half wafer track. Results indicated radial position alteration fluid mechanics by SIS played important roles in...

This study investigates the effect of various retaining ring slot designs, conditioning schemes and disc types on width slurry bow wave formed at leading edge during polishing. A method using high-speed videography is employed for visualizing quantifying width. In contrast to many limitations associated with previous techniques, this new allows use a concentrically grooved pad its natural white color commonly used in industrial applications. general, results show that polishing having...

In this study, the silicon dioxide removal rate using a "reverse" ceria-based slurry was investigated under four different combinations of conditioning modes and application methods. slurry, addition water acts to promote material removal. Overall, process ex-situ with injection system (SIS) resulted highest rate, while in-situ conventional point (PA) generated lowest rate. This study is aimed explain differences in based on variations actual dilution ratio top pad associated The frictional...

The effect of two different commercially-available CVD-coated diamond conditioning discs on copper CMP was investigated tribologically and kinetically with the intent correlating pad surface micro-texture to polish performance. Data analyses were particularly focused in-situ shear normal force measurements taken during polishing at several pressures (P) sliding velocities (V), including Fast Fourier Transform (FFT) analysis data. One consistently resulted in greater variances increasing P V...

In this work, the position of novel slurry injection system (SIS) was optimized to achieve a more cost-effective and environmentally benign chemical mechanical planarization process using widely-adopted ceria-based "reverse slurry". SIS configured with different angles in order investigate dilution characteristics caused by residual pad rinsing ultrapure water (UPW) that affected silicon dioxide removal rates. UPW effect on rate, coefficient friction surface temperature explained maintaining...

In this study, silicon dioxide wafers were polished as part of a cobalt "buff step" CMP using novel and state-of-the-art application-specific slurry pad combination to study the thermal, tribological, kinetic attributes process. Removal rate mean temperature showed increases with higher polishing pressures sliding velocities, while coefficient friction stayed relatively constant across all investigated conditions. Under conditions, process was tribologically robust it remained in "boundary...

A method using high-speed videography is developed for visualizing and quantifying the width of slurry bow wave formed at leading edge a retaining ring during polishing. This new overcomes many limitations previous techniques as it employs an inert dye thereby bypassing any photobleaching issues encountered in past. allows use pads all types colors normally-lit environment. Image analysis used to quantify classify pixel brightness regions interest on CMP pad. By employing suitable baselines,...

This study investigates the effects of a novel slurry injection system on thermal, tribological, and kinetic aspects new middle line cobalt "buff step" CMP process. The mean pad temperature, coefficient friction (COF) removal rate were higher when applying using compared to standard point application method. By system, overall consumption could be reduced by 25 33% consumed method, while still achieving similar rates. Our well-established modified two-step Langmuir-Hinshelwood model...

In this study, the effects of ultrapure (UPW) water dilution a ceria-based slurry on silicon dioxide removal rates were investigated. Results indicated that increased with up to UPW ratio 1:7.5 before reaching plateau in pre-mix case. The concentration Ce3+ was thought increase 1:7.5. Further resulted reduced friction and temperature which halted any further increases rate. Mixing at point-of-use similar rate trend pre-mixing, but higher each due particle agglomeration. A novel injection...