Daniel Aguinaga

ORCID: 0000-0001-6229-361X
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About
Contact & Profiles
Research Areas
  • Manufacturing Process and Optimization
  • Industrial Vision Systems and Defect Detection
  • IoT and Edge/Fog Computing
  • Augmented Reality Applications
  • Recycling and Waste Management Techniques
  • Elevator Systems and Control
  • IoT Networks and Protocols
  • Spacecraft Design and Technology
  • Anatomy and Medical Technology
  • Tactile and Sensory Interactions
  • Radio, Podcasts, and Digital Media
  • 3D Surveying and Cultural Heritage
  • Digital Transformation in Industry
  • Linguistic Studies and Language Acquisition
  • Music and Audio Processing
  • Context-Aware Activity Recognition Systems

Prospektiker (Spain)
2024

The Industry 4.0 paradigm introduced several technologies in the industrial manufacturing landscape, highlighting Cyber Physical Systems, Internet of Things and Visual Computing as some key enabling technologies. fast paced evolution technology has to be reflected common ground between machines operators. introduction advanced, flexible adaptable Human Machine Interfaces (HMI) will empower operators with information custom tools more productive a safer way. This work presents totally...

10.1080/00207543.2019.1572932 article EN International Journal of Production Research 2019-02-06

10.1007/s00170-025-15460-8 article EN cc-by The International Journal of Advanced Manufacturing Technology 2025-04-02

Personalized production is moving the progress of industrial automation forward, and demanding new tools for improving decision-making operators. This paper presents a new, projection-based augmented reality system assisting operators during electronic component assembly processes. The describes both hardware software solutions, depicts results obtained usability test with system.

10.3390/app10030796 article EN cc-by Applied Sciences 2020-01-22

Sencio has been involved in an EU-funding H2020 project called PAMPA that was finalized last year. The goal of the to develop a plastic QFN-packaging solution for RF-components Space application (Satellites). Today hermetic sealed ceramic and metal can packages are main assembly technologies applied space. Besides consortium consisted following companies; Thales Alenia (F), UMS Ikor Technology Centre (ES), IMEC (B).The besides cost also advantage with respect weight. restraint apply...

10.23919/nordpac.2018.8423851 article EN 2018-06-01
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