Geng Li

ORCID: 0000-0001-6395-0327
Publications
Citations
Views
---
Saved
---
About
Contact & Profiles
Research Areas
  • Electronic Packaging and Soldering Technologies
  • Nanomaterials and Printing Technologies
  • Conducting polymers and applications
  • Microwave Engineering and Waveguides
  • Particle Dynamics in Fluid Flows
  • Electrohydrodynamics and Fluid Dynamics
  • 3D IC and TSV technologies
  • Advanced Sensor and Energy Harvesting Materials
  • Gas Sensing Nanomaterials and Sensors
  • Advanced Surface Polishing Techniques
  • Advanced materials and composites
  • Aerosol Filtration and Electrostatic Precipitation
  • Analytical Chemistry and Sensors

Harbin Institute of Technology
2023-2025

An overview of nanostructured PANI gas sensors and chemiresistive or heterojunction-based composite sensors.

10.1039/d3ta07687c article EN Journal of Materials Chemistry A 2024-01-01

Abstract Aerosol jet printing (AJP) is a cutting‐edge additive manufacturing technique, ideal for fabricating conformal electronics due to its extended working distance, simplicity, and environmental sustainability. However, achieving optimal resolution hindered by complex interactions between aerosol droplets substrates, as well the influence of various process parameters. This study focuses on precise AJP control enable high‐resolution fabrication. Through randomized single‐factor...

10.1002/admt.202402114 article EN Advanced Materials Technologies 2025-01-06

To meet the demand for higher performance and wearability, integrated circuits are developing towards having multilayered structures greater flexibility. However, traditional circuit fabrication methods using etching lamination processes not compatible with flexible substrates. As a non-contact printing method in additive manufacturing, electrohydrodynamic possesses advantages such as environmental friendliness, sub-micron capability interconnection insulation of different conductive layers...

10.3390/coatings14050625 article EN Coatings 2024-05-15

New diamond chip resistors have been used in high-power devices widely due to excellent heat dissipation and high-frequency performance. However, systematic research about their solder joint reliability is rare. In this paper, a related study was conducted by combining methods between numerical analysis laboratory tests. detail, the shape simulation thermal cycling finite element for joints with different volumes were carried out. The optimized volume 0.05 mm3, maximum stress under 38.9 MPa....

10.3390/coatings13040748 article EN Coatings 2023-04-07
Coming Soon ...