A5101487890- Silicon and Solar Cell Technologies
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Photovoltaic Systems and Sustainability
- solar cell performance optimization
- Thin-Film Transistor Technologies
- Silicon Nanostructures and Photoluminescence
- Advanced Welding Techniques Analysis
- Solidification and crystal growth phenomena
- Technology Assessment and Management
- Simulation and Modeling Applications
- Manufacturing Process and Optimization
- Material Properties and Applications
- Semiconductor materials and devices
- Risk and Safety Analysis
- Engineering Applied Research
- Advancements in Battery Materials
- Electrochemical Analysis and Applications
- Combustion and Detonation Processes
- Engineering Technology and Methodologies
- Radio Frequency Integrated Circuit Design
Korea Institute of Energy Research
2013-2021
Chungnam National University
2013-2015
The advanced electron beam melting (EBM) system with the combination of vacuum refining and directional solidification (DS) performed purification large amounts metallurgical grade silicon (MG-Si). In order to increase grain size or align columnar grains being parallel DS pulling direction in Si ingots, non-irradiated inner diameters an EB pattern process were varied at a range 5–35 mm. Average increased increasing diameter due smaller temperature gradient during melts. However, slope...
Recently, wafer-level packaging (WLP) has become one of the promising technologies due to its advantages, such as fewer processing steps, lower cost, and enhanced device performance compared conventional single-chip packaging. Many developments on new WLP design, material, process have been accomplished according reliability requirement devices be packaged [1], [2]. For a higher performance, environmentally green process, anisotropic conductive film (ACF) flip chip assembly widely used, in...
Electron beam melting (EBM) systems have been used to improve the purity of metallurgical grade silicon feedstock for photovoltaic application. Our advanced EBM system is able effectively remove volatile impurities using a heat source with high energy from an electron gun and continuously allow segregate at top ingot solidified in directional solidification (DS) zone vacuum chamber. Heat melt should move toward bottom desired DS. However, flux though changed as becomes longer due low thermal...
In this study, board level drop shock and TC reliabilities in terms of solder materials UBM (under bump metallurgy) structures have been evaluated to suggest optimal WLP (wafer packaging) with the large die, high pin counts for mobile application. Test vehicles designed 5.6×5.6 mm die size, 340 um thickness (including backside protection film), 14×14 ball array, 400 pitch. Firstly, effect composition has investigated through BLR (board reliability) tests using electroplated Cu which...
본 논문에서는 가상현실 기술을 기반으로 정비성 모의 시스템에 대한 개발 기술 및 적용 사례에 대해 기술하였다. 모의를 위해 장비를 한 몰입형 시뮬레이터가 개발되었으며, 상용 소프트웨어인 DELMIA를 활용한 조립 시뮬레이션이 공대지 유도무기를 대상으로 수행되었다. 개발된 시스템은 설계 단계에서 군수지원 요소 개발에 다양하게 활용이 가능하였으며 효용성을 확인할 수 있었다. This paper describes the development and applications of maintainability simulation system based on virtual reality technology. The immersive type simulator using is developed assembly DELMIA software conducted for an air-to-ground munition as example. processes result validate...
In recent years, as the demand for ever-smaller electronic systems grows, Industry trends are seeking ways to increase IC integration levels and reduce size weight of packages. The explosive expansion mobile terminals generates strong high-performance, cost-effective miniaturized RF modules providing desired wireless connectivity. chip scale package (CSP) wafer-level packaging (WLP) resulting from this effort, have been introduced into industry at an unprecedented rate. Especially wafer...
A silicon substrate with the dimensions of 100 × 140 0.3 mm was grown directly from liquid gas pressure. The melt in sealed melting part injected into growth at applied pressure 780–850 Torr. solidified then transferred by pull cooled dummy bar. desirable structure a liquid‐solid interface perpendicular to pulling direction formed when mold temperature solidification zone much higher than that bar, as this technique should be able overcome thermal loss through molds and limited heat flux...
In this paper, Cu/SnAg double-layered bumps structure was proposed and investigated for the fine pitch flip chip applications. Test designed considering recent high speed memory device its pad size 60/spl mu/m 100/spl mu/m, respectively. Cu SnAg were fabricated as a 20/spl thickness on SiO/sub 2//Ti/TiN/Al/TiW/Cu Si wafer using electroplating method. assembled with PCB substrates thermo-compression bonding Because very tight, of double difficult it affected several parameters such pressure,...
This study evaluated the explosive hazardous properties and likelihood of dust explosion in four types waste collected from industrial sites. Waste samples were cement manufacturing industry, aluminum, aluminum alloy ingot copper non-ferrous product industry. We whether contained substances using a standard method. Additionally, factors that may affect explosion, presence combustible substances, average particle size, size distribution, shape, moisture content, calorific value also...