A5037837725- Electronic Packaging and Soldering Technologies
- Advanced Welding Techniques Analysis
- Aluminum Alloys Composites Properties
- 3D IC and TSV technologies
- Metal Forming Simulation Techniques
- Thermal properties of materials
- Silicon Carbide Semiconductor Technologies
Central South University
2021-2023
State Key Laboratory of High Performance Complex Manufacturing
2022-2023
With the continuous development of electronic products toward high density and small size, size interconnecting solder joints also continues to decrease. Under normal service conditions, microsolder will be subjected multiple loads at same time, which in turn cause many reliability problems package structure. This article focuses on growth pattern intermetallic compounds (IMCs) during hot-press bonding analyzes its effect shear strength creep properties copper pillar microbumps. First, with...
Abstract Under the action of electrothermal–mechanical coupling, failure and performance degradation electronic devices are prone to occur, which has become a significant reliability problem in micro-electronic packaging. The improvement flip chip by using thermal interface materials was studied. First, three-dimensional finite element model packaging system simulation electric-thermal-force multifield coupling were conducted. Then, Joule heating, temperature distribution, stress,...
Abstract With the development of packaging devices toward high performance and density, electronic are subjected to thermo-electric stresses under service conditions, which has become a particularly important reliability problem in micro-electronics packaging. The chip is studied this paper. First, coupling experiments were carried out on two solder joint structures Ni/Sn3.5Ag/Cu Ni/Sn3.5Ag/Ni. interface evolution joints different current densities was analyzed. compared After that,...
With the development of electronic products toward high density and reliability, size interconnect solder joints pitch continues to decrease. Under normal service conditions, are subjected thermal–electric–mechanical loads simultaneously, resulting in reliability problems for many package structures. This article investigated effects shape thermal-electro-migration on creep copper-pillar flip chip analyzed corresponding failure modes mechanisms. In this article, with different shapes were...
As the distance between copper pillars and size of solder continues to shrink, joints are subjected extremely high current density thermal energy density. This paper is aiming analyze electromigration reliability joint with different shapes. Both experiment finite element method (FEM) analysis were performed investigate Mean-time-to-failure(MTTF) joints. Firstly, models established. And then, density, temperature, stress distribution in analyzed according model. After that, chip samples made...