A5101915703- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Mechanical and Optical Resonators
- Advanced Sensor and Energy Harvesting Materials
- Metal and Thin Film Mechanics
- Advanced materials and composites
- Metal Forming Simulation Techniques
- Advanced MEMS and NEMS Technologies
- Ultrasound and Hyperthermia Applications
- Landslides and related hazards
- Rock Mechanics and Modeling
- Bioactive Compounds and Antitumor Agents
- Synthesis and biological activity
- Geotechnical Engineering and Underground Structures
- Geotechnical and Geomechanical Engineering
- Additive Manufacturing and 3D Printing Technologies
- Cytokine Signaling Pathways and Interactions
- Soil, Finite Element Methods
- Orthopaedic implants and arthroplasty
- Microstructure and mechanical properties
- Neonatal and fetal brain pathology
- Hydrogen's biological and therapeutic effects
- Perovskite Materials and Applications
- Geological Modeling and Analysis
- Structural Integrity and Reliability Analysis
Guangxi University of Chinese Medicine
2024
China Electronics Technology Group Corporation
2021-2023
Institute of Microelectronics
2021
First Affiliated Hospital of Xi'an Jiaotong University
2021
Central South University
2021
Zhejiang University
2021
Hefei University of Technology
2019
Hefei University
2019
National Yang Ming University Hospital
2018
National Yang Ming Chiao Tung University
2018
MXenes have been demonstrated as a potential candidate in the field of photovoltaics and energy storage owing to their high transmittance, metallic conductivity tunable work function.
A high-temperature pressure sensor chip based on SOI(Silicon-On-Insulator) material is designed in this paper. In paper, the structural design of elastic pressure-sensitive diaphragm carried out, and dimensions are optimized using finite element analysis, according to sensor's Wheatstone bridge principle hydrostatic simulation method, combined with requirements. The optimal at 2.1 MPa were finally determined, an island width w1 600 μm, a membrane length w2 1000 thickness h1 60 height h2 440...
Abstract Hypoxia–ischemia (HI) during crucial periods of brain formation can lead to changes in morphology, propagation neuronal stimuli, and permanent neurodevelopmental impairment, which have profound effects on cognitive function later life. FAM3A, a subgroup family with sequence similarity 3 (FAM3) gene family, is ubiquitously expressed almost all cells. Overexpression FAM3A has been evidenced reduce hyperglycemia via the PI3K/Akt signaling pathway protect mitochondrial HT22 This study...
The failure modes of rockburst in catastrophe theory play an essential role both theoretical analysis and practical applications. tensile cracking sliding is studied by analyzing the stability simplified mechanical model based on fold model. Moreover, system stability, together with engineering example, introduced to verify accuracy. Additionally, results are compared that cusp model, applicability two models discussed. show analytical consistent solutions systems theory. critical loads...
In the flip-chip interconnection technology, Cu–Cu bonding is one of key technologies. Currently, industry commonly uses hot-press to achieve high-density interconnection. However, this method requires high temperature, pressure, and vacuum environment, process conditions are relatively harsh. semiconductor manufacturing industry, electroplating technology widely used, such as preparation copper column bumps, redistribution layers, silicon vias, which often take place in a room temperature...
To avoid the damage of microprobe to wafer, magnetorheological (MR) damping loading was used. The problem low repeated positioning solved by limiting relative rotation between probe and cylinder. experimental results show that performance similar cuboid cylinder damper. repetition accuracy more than circular damper two times. Then, electrical properties with were tested under different currents, velocities, displacements, contact resistances fluctuated in range 0.85–1.4 <inline-formula...
The purpose of this study was to investigate the protective role low-intensity pulsed ultrasound (LIPUS) against lipopolysaccharide (LPS)-induced neuroinflammation and memory impairments in a mouse model. A 1.0 MHz focused transducer exploited sonicate brain noninvasively with 50 ms burst lengths at 5% duty cycle, repetition frequency 1 Hz. Mice subjected LPS administration (250 μg/kg, i.p.) were treated LIPUS daily for 7 days. levels inflammatory markers estimated tissue using western blot....
As the distance between copper pillars and size of solder continues to shrink, joints are subjected extremely high current density thermal energy density. This paper is aiming analyze electromigration reliability joint with different shapes. Both experiment finite element method (FEM) analysis were performed investigate Mean-time-to-failure(MTTF) joints. Firstly, models established. And then, density, temperature, stress distribution in analyzed according model. After that, chip samples made...
With the ever-increasing function of electronics, dramatically increased interconnection density brings challenge to traditional yet cost effective wire bonding packaging. Since pitch wires shrinks down, risk short circuit rises, especially, reliability issue is a key concern when packaging suffers from random vibration. In order understand response behavior looping under vibration loading, this work aiming expore relationship between different parameters, e.g., span, height and conner...
Abstract Glucagon‐like peptide‐1 (GLP‐1) can improve cardiac function and cardiovascular outcomes in diabetic cardiomyopathy; however, the beneficial effect of GLP‐1 on human cardiomyocytes (DCMs) its mechanism have not been fully elucidated. Here, DCMs model by human‐induced pluripotent stem cells‐derived is developed. Two subtypes GLP‐1, 7–36 9‐36 , are evaluated for their efficacy model. Diabetogenic condition sufficient to induce most characteristics cardiomyopathy vitro, such as...
The reliability of electronic packaging is one the most concerned issues, and board-level drop test has become a key qualification for assessing impact components. In literature, lots work focus on PCB vibration patterns under different constraints influence dynamic response solder joint reliability. Several compared package component life with respect to JEDEC standard boards. They found that A-type(100x48mm) board was prone be failure, C-type(77x77mm) had longer life. Thus, this aiming...
Die-attach solder layer plays key effects in realizing the functions of power devices. The defects induced soldering process and accumulated damage during service are main challenges to lifetime modules. Regarding conditions devices, creep fatigue mechanisms can be both activated. This paper focuses on thermomechanical characteristics brought by coupling die attach with different void configurations. influence voids strain thermal cycles were studied finite element analysis. A novel way...