A5078628376- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Advanced Sensor and Energy Harvesting Materials
- Tactile and Sensory Interactions
- Additive Manufacturing and 3D Printing Technologies
- Force Microscopy Techniques and Applications
- Advanced Measurement and Metrology Techniques
- Injection Molding Process and Properties
- Mechanical and Optical Resonators
- Advanced MEMS and NEMS Technologies
Central South University
2021-2024
State Key Laboratory of High Performance Complex Manufacturing
2021-2023
In modern society, electronic equipment continues to develop in the direction of miniaturization and multifunction. order meet this requirement, packaging technology has gradually evolved from “2-D planar packaging” “3-D packaging.” The realization flip-chip bonding process thermal cycle reliability 3-D stacked structure are discussed article. First, stack three substrates a small size chip together, machine was used vertically chips <inline-formula> <tex-math...
Thermocompression ultrasonic flip bonding has been widely used in semiconductor packaging. In order to better understand the mechanism of interface formation thermocompression bonding. A 3-D dynamics finite element model (FEM) chip, gold bumps, and substrate was developed, which considers softening effect bumps during process. The effects pressure application position, magnitude, temperature, power on stress plastic strain were analyzed. results indicated that maximum occurred at edge...
Thermosonic flip chip (TSFC) bonding technology has become a developing area of packaging due to its advantages low temperature and pressure. To explore the appropriate parameters understand relationship between each parameter stress/strain at interface, tests were carried out, then, simulated orthogonal conducted using finite element model (FEM). The test results show that initial position bumps does not affect strength after bonding, but an unreasonable selection pressure ultrasonic can...
To avoid the damage of microprobe to wafer, magnetorheological (MR) damping loading was used. The problem low repeated positioning solved by limiting relative rotation between probe and cylinder. experimental results show that performance similar cuboid cylinder damper. repetition accuracy more than circular damper two times. Then, electrical properties with were tested under different currents, velocities, displacements, contact resistances fluctuated in range 0.85–1.4 <inline-formula...
We adopted a novel method to achieve high-density microbump connection through microsilver paste sintering at low temperature quickly with the help of ultrasonic. Sliver its unique performance has potential as an alternative Pb-free solder and this been generally accepted. However, it not applied in field bump interconnection. The usual problem is time-consuming, porous, wettability. Many experiments were carried out two copper plates, focusing on study mechanism. conduct our research manner...