About
Contact & Profiles
A5060442100
Research Areas
- Advanced Surface Polishing Techniques
- 3D IC and TSV technologies
- Ultrasonics and Acoustic Wave Propagation
- Copper Interconnects and Reliability
- Welding Techniques and Residual Stresses
- Electronic Packaging and Soldering Technologies
Nanjing University of Aeronautics and Astronautics
2023-2025
10.1109/tim.2025.3545535
article
EN
IEEE Transactions on Instrumentation and Measurement
2025-01-01
10.1016/j.vacuum.2023.111905
article
EN
Vacuum
2023-02-10
Coming Soon ...