A5060859716- Silicon and Solar Cell Technologies
- solar cell performance optimization
- Nanowire Synthesis and Applications
- Chalcogenide Semiconductor Thin Films
- Thin-Film Transistor Technologies
- Semiconductor materials and devices
- Plasma Diagnostics and Applications
- Photovoltaic System Optimization Techniques
- Integrated Circuits and Semiconductor Failure Analysis
- Photonic and Optical Devices
- Silicon Nanostructures and Photoluminescence
- Semiconductor Lasers and Optical Devices
- Advanced Condensed Matter Physics
- Advanced Energy Technologies and Civil Engineering Innovations
- Organic and Molecular Conductors Research
- Optical Coatings and Gratings
- Advanced Surface Polishing Techniques
- Magnetism in coordination complexes
- Technology Assessment and Management
- GaN-based semiconductor devices and materials
- Multiferroics and related materials
- Photonic Crystals and Applications
- Magnetic and transport properties of perovskites and related materials
- TiO2 Photocatalysis and Solar Cells
- 3D IC and TSV technologies
Université de Sherbrooke
2015-2024
University of Ottawa
2023-2024
Université Grenoble Alpes
2022-2023
Wilfrid Laurier University
2023
Institut polytechnique de Grenoble
2022-2023
Commissariat à l'Énergie Atomique et aux Énergies Alternatives
2022-2023
CEA Grenoble
2022-2023
Centre National de la Recherche Scientifique
2022-2023
Canadian Nuclear Laboratories
2023
Laboratoire des Technologies de la Microélectronique
2016-2022
Efficient, environmentally friendly magnetic refrigeration at room temperature requires a material with large magnetocaloric effect (MCE) in the desired range. Prototypes already outperform conventional refrigerators, but expanding operating range remains challenge, as often MCE is narrowly limited to vicinity of transition temperature. This study shows that, for insulator two competing phases leading different temperatures, varying thin-film growth parameters can significantly improve by...
An ultrasonic measurement has been performed on the spin-liquid organic candidate $\ensuremath{\kappa}$-(BEDT-TTF)${}_{2}$Cu${}_{2}$(CN)${}_{3}$ at low temperatures. A softening anomaly was observed longitudinal velocity along a direction perpendicular to planes with consistent one attenuation. The appears as frequency dependent peak below 20 K maximum value found near 5--6 K. magnetic field affects predominantly only temperature ${T}_{p}=5.9$ that is associated 6 transition other physical...
The impact of via etching on triple junction solar cell performance has been investigated for through contact architectures. Triple cells with standard top and back contacts have fabricated vias etched the subcells to investigate new geometry proposed. external quantum efficiency, open-circuit voltage (V <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">oc</sub> ), fill factor (FF), ideality measured compared those without vias. In this way, we...
There is a growing need for patterning germanium photonic and photovoltaics applications. In this paper, the authors use time multiplexed plasma etch process (Bosch process) to deep substrate. They show that etching presents strong aspect ratio dependent patterns present scallops mostly on upper part (aspect below 0.8). Passivation layers are formed during passivation step by neutrals' deposition reinforced redeposition of sputtered fluorocarbon species from front. When sidewalls passivated,...
This article presents a complete plasma etching process to etch high aspect ratio patterns on III-V/Ge solar cell heterostructure with low damage for the fabrication of multijunction cells through via contact architecture. A SiCl4/H2 chemistry was studied different hydrogen dilutions within (0%, up 67%) and cathode temperatures (20∘C, 200∘C). choice creates SiClx-based inhibiting layer sidewalls that promotes anisotropic epitaxial heterostructure. The study suggests flow temperature reduce...
Photovoltaic cells are conventionally electrically isolated (isolation) and then separated from the wafer (singulation) by saw dicing at end of fabrication process. However, presents limitations in terms cell shapes causes excessive material losses. We propose isolation singulation plasma etching as an alternative to dicing. The process proposed also allows via hole for through contacts (TCVC) [1]. This technology uses metallized vias carry front-side generated carriers backside. new...
We report an investigation of charge, spin, and lattice effects in the spin-Peierls state organic compound MEM(TCNQ)${}_{2}$. The 16.5-GHz dielectric function along chain axis shows enhancement below transition temperature near 18 K consistent with charge coupling to elastic strain involved transition. velocity two modes perpendicular presents anomalies at transition, which can be explained a Landau free-energy model including linear-quadratic energy term between appropriate $e$ magnetic gap...
Over the past few years, through cell via contacts (TCVC) architecture has been object of a growing interest to replace standard front side and backside contact on concentrated photovoltaic (CPV) cells. The technology is based transferring using insulated metallized vias. This could reduce shading series resistance, thus increasing device efficiency. However, processes involved in TCVC fabrication increases risk creating short-circuit, reducing significantly efficiency solar cell. Therefore,...
In this paper, we investigate the development of a robust handling process for thin (<50 µm) substrates in framework monolithic multi-junction solar cell (MJSC) technology. The process, designed its versatility, is based on temporary front side bonding with polymeric adhesive and then permanent back soldering, allowing classical micro-fabrication steps both sides wafer. We have demonstrated that does not degrade performances MJSC Ge thickness reduced from 170 µm to 25 µm. Then, perspective...
Three-dimensional (3D) interconnects increase chip power density and enable miniaturization. Photonic chips require new processes to transitioning 3D interconnects. We fabricate on a multijunction solar cell, leveraging such as III-V heterostructure plasma etching, gold electrodeposition, chemical-mechanical polishing integrate through substrate vias the heterostructure. Wafer bonding is used handle 20-μm-thin films. The strategy enables us demonstrate photonic devices having areas 3 orders...
We have developed a machine learning empowered computational framework to facilitate design space exploration for optoelectronic devices. In this work, we apply dimensionality reduction and clustering algorithms identify optimal ten-junction C-band photonic power converter (PPC) designs. outline our framework, optimization procedure, calibrated model, experimental calibration report on top performing device designs on-substrate flat back-reflector architectures. comment the sensitivity these...
Photonic chips require new processes to enable transitioning 3D interconnects. We fabricated interconnects on a multijunction solar cell. demonstrate photonic devices having areas 3 orders of magnitude smaller compared standard chips. Full-text article not available; see video presentation
At the end of fabrication process, multijunction solar cells must be electrically isolated from one to another; a step commonly known as mesa isolation. In this paper, three different techniques are assessed perform step: saw-dicing, wet etching and plasma etching. Triple junction were fabricated with each process open-circuit voltages measured in order compare impact technique on device performance. An optional treatment is also proposed clean sidewalls after isolation process. The...
Germanium (Ge) substrates are usually used for epitaxial growth of III- V materials but represent a significant part the cell total cost. The lift-off technique using porosification by bipolar chemical etching is promising approach to detach active layers from Ge substrate and allows reuse. However, this solution raises challenges concerning delamination possible structural deterioration mem-brane during micro-fabrication solar cell. In paper, we successfully apply main steps on membrane...
In this paper, we propose a process to permanently bond multi-junction solar cells (MJSCs) front side transparent superstrate using polydimethylsiloxane (PDMS). This could allow for substrate handling during several fabrication schemes such as thin MJSCs, lift-off /recycling or through cell via contacts (TCVC) cells. The developed is compatible with standard microfabrication processes photolithography, etching metallization. Permanent bonding of III-V/Ge triple junction on quartz has been...
In this paper, we present a complete microfabrication process for III-V/Ge triple junction solar cells with through cell via contacts. This architecture enables the transfer of front side busbars and grid lines contact to back by using insulated metallized vias reduce both shading resistive losses. Functional have been electrically characterized demonstrate proof concept.
We present the various process steps that are required to build a high efficiency solar cell. show then advantage of plasma etching compared saw dicing singulate cells.