Tongmin Wang

ORCID: 0000-0001-9871-1166
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About
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Research Areas
  • Aluminum Alloys Composites Properties
  • Aluminum Alloy Microstructure Properties
  • High Entropy Alloys Studies
  • Microstructure and mechanical properties
  • High-Temperature Coating Behaviors
  • Advanced materials and composites
  • Advanced Thermoelectric Materials and Devices
  • Solidification and crystal growth phenomena
  • Magnesium Alloys: Properties and Applications
  • Electromagnetic wave absorption materials
  • Additive Manufacturing Materials and Processes
  • Advanced ceramic materials synthesis
  • Thermal properties of materials
  • Metallurgical Processes and Thermodynamics
  • Thermal Expansion and Ionic Conductivity
  • Metallurgy and Material Forming
  • Heusler alloys: electronic and magnetic properties
  • Corrosion Behavior and Inhibition
  • Advanced Welding Techniques Analysis
  • Bauxite Residue and Utilization
  • Metallic Glasses and Amorphous Alloys
  • Intermetallics and Advanced Alloy Properties
  • Chalcogenide Semiconductor Thin Films
  • Advanced Antenna and Metasurface Technologies
  • MXene and MAX Phase Materials

Dalian University of Technology
2016-2025

Materials Science & Engineering
2013-2025

Dalian University
2013-2024

Ningbo University of Technology
2020-2023

Zhejiang University
2021

Southern University of Science and Technology
2021

China Spallation Neutron Source
2021

Institute of High Energy Physics
2021

Shanghai Advanced Research Institute
2021

Chinese Academy of Sciences
2021

High-entropy alloys (HEAs) can have either high strength or ductility and a simultaneous achievement of both still constitutes tough challenge. The inferior castability compositional segregation HEAs are also obstacles for their technological applications. To tackle these problems, here we proposed novel strategy to design using the eutectic alloy concept, i.e. achieve microstructure composed alternating soft fcc hard bcc phases. As manifestation this an AlCoCrFeNi2.1 (atomic portion)...

10.1038/srep06200 article EN cc-by-nc-nd Scientific Reports 2014-08-27
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