In this paper, a high-temperature, high-frequency, wire-bond-based multichip phase-leg module was designed, fabricated, and fully tested. Using paralleled Silicon Carbide (SiC) MOSFETs, the rated at 1200 V 60 A, designed for 25-kW three-phase inverter operating switching frequency of 70 kHz, in harsh environment up to 200 °C, aircraft applications. To end, temperature-dependent characteristics SiC MOSFET were first evaluated. The results demonstrated superiority both static performances...

Magnetic core loss is an important concern for power converters. As the switching frequency increases and converter size reduced, will have significant impact to efficiency temperature. Accurate evaluation magnetic design estimation. The classic two-winding method limited low frequencies (usually below 1 MHz) because it sensitive phase discrepancy. In this paper, a new proposed high-frequency measurement that utilizes capacitive cancellation, which suitable HF VHF measurement. greatly...

This paper presents the development of an acoustic energy harvester using electromechanical Helmholtz resonator (EMHR). The EMHR consists orifice, cavity, and a piezoelectric diaphragm. Acoustic is converted to mechanical when sound incident on orifice generates oscillatory pressure in which turns causes vibration conversion electrical achieved via transduction diaphragm EMHR. Moreover, coupled with reclamation circuitry increase efficiency conversion. Lumped element modeling used provide...

Semiconductor encapsulation is crucial to electronic packaging because it provides protection against mechanical stress, electrical breakdown, chemical erosions, α radiations, and so on. Conventional encapsulants are only applicable below 150 °C. However, with increasing demand for high-density high-temperature packaging, that functional at or above 250 °C required. In this paper, five types of encapsulants, including conformal coatings, underfills, molding compounds, potting glob tops,...

The peak currents between two paralleled SiC MOSFETs could differ significantly due to the mismatch in threshold voltages V <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">th</sub> . method described herein employs passive compensation (drive-source resistors and coupled power-source inductors) balance using one gate driver, no sensors, feedback- without increasing total switching loss when equivalent gate-drive resistance (R...

Planar, double-side cooled power modules are emerging in electric-drive inverters because of their low profile, better heat extraction, and lower package parasitic inductances. However, there is still a concern about reliability due to the rigid interconnection between device chips two substrates module. In this article, porous interposer made low-temperature sintered silver introduced reduce thermomechanical stresses A half-bridge module consisting 1200 V, 149 SiC MOSFETs was designed,...

The demand for a high-power and high-density isolated dc–dc converter is driven by the rapid development of energy storage system, data center power supplies, transportation electrification. However, designing high-frequency transformer presents significant challenges due to tradeoff between thermal management, leakage inductance minimization, insulation requirements. In order overcome this rating operation frequency, scalable electronic-embedded (EET) proposed with low-voltage bridge...

A representative switched-capacitor DC-DC converter topology is presented, circuit operation explained, and control strategies are identified. State-space averaging used to analyze steady-state performance develop criteria design equations. The analytical results verified by SPICE simulation.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">&gt;</ETX>

This paper presents the "hybrid pulsewidth modulation" (HPWM) method which requires only two of four switches in a full-bridge inverter to be pulsewidth-modulated at high frequency, thus significantly reducing switching losses other switches. For triangular carriers, HPWM has same frequency spectrum and as conventional unipolar PWM (UPWM). A low-frequency model for fast-switching with high-quality output is described, substantiated by experimental data.< <ETX...

High-temperature (HT) converters have gained importance in industrial applications where the operate a harsh environment, such as hybrid electrical vehicles, aviation, and deep-earth petroleum exploration. These environments require converter to not only HT semiconductor devices (made of SiC or GaN), but also reliable packaging, gate drives, control electronics. This paper describes detailed design process for an three-phase PWM rectifier that can at ambient temperatures above <formula...

<para xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> In order to take full advantage of SiC, a high-temperature wirebond package for multichip phase-leg power module using SiC devices was designed, developed, fabricated, and tested. The details the material comparison selection are described, thus culminating feasible solution operation. A thermal cycling test with large temperature excursion (from <formula formulatype="inline"><tex...

<para xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> This paper presents the design, development, and testing of a phase-leg power module packaged by novel planar packaging technique for high-temperature (250 <formula formulatype="inline"><tex Notation="TeX">${^\circ}$</tex> </formula>C) operation. The nanosilver paste is chosen as die-attach material well playing key functions electrically connecting devices' pads. electrical characteristics...

Since a die-attach layer has significant impact on the thermal performance of power module, its quality can be characterized using performance. In this paper, measurement system for impedance is developed to evaluate three materials. Thanks high temperature sensitivity (10 mV/ <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">°</sup> C), gate-emitter voltage an insulated gate bipolar transistor (IGBT) used as temperature-sensitive parameter. The...

This paper proposes a new topology for pulse width modulation (PWM) rectifier which can achieves both sinusoidal input current on the ac side and ripple power decoupling DC without additional switches. The AC inductor of conventional H-bridge circuit is divided into two parts only an auxiliary capacitor added in proposed circuit. Control scheme also working as unity factor rectifier. Compared with other circuits, this has same advantage such high density. Due to no switches, higher...

Recently, point of load (POL) converter are pushed to higher switching frequency for power density. As the increases, magnetic core loss becomes a significant part total POL converters. Accurate measurement this is important design. And under non-sinusoidal excitation particularly interesting pulse-width modulation (PWM) However, precise difficult with classical four-wire methods, because high and flux waveform (like triangular flux). In paper, new method proposed arbitrary excitation. The...

DC-link decoupling capacitors are generally placed near the power switches in converter to minimize parasitic ringing and voltage overshoot on devices. In this paper, influence of turn-off MOSFETs is studied frequency domain based a small-signal modeling approach. This new angle helps explain effect these simpler more straightforward way compared traditional time-domain analysis, provides deeper insight into problem. A rule thumb about selection effective capacitance value can also be...

A review of some the available technologies for inductor hybrid integration is given in this paper. In accordance with low voltage and high current requirements, low-temperature co-fired ceramics (LTCC) technology identified to be a suitable candidate power electronics passives integration. This paper will discuss various limitations LTCC processing technique introduce fabrication which open new field chip inductors The design an also presented. exhibits inherent dependent inductance,...

Substrate reliability has, for a long time, been concern systems exposed to harsh environments. State-of-the-art direct bond copper (DBC) substrate is susceptible large-temperature cycling range. Due the coefficient of thermal expansion mismatch between and base ceramic (e.g., Al <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> O xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> AlN), delamination from plate caused by thermomechanical...

Reliability of power electronic substrates has been one the main issues high-temperature packaging technologies. Widely used direct bonded copper (DBC) substrates, if subjected to wide temperature swings, suffer from layers peeling off a ceramic because large thermal stresses resulting difference in coefficient expansion (CTE) between and (e.g., Al <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> O...

The quality factor of coils should be high enough to deliver power efficiently during inductive transfer. To achieve a higher factor, are designed either with larger size and thicker wire or special structure, making the bulky complicating fabrication. This paper presents systematic method design in series-series transfer smallest possible value realize requirements transferability efficiency. electrical parameters normalized, decoupled equations, sequentially. It is found that for required...

Pressureless sintering of nanosilver paste has been widely demonstrated for bonding power semiconductor devices on silver- or gold-coated substrates. In this paper, we extended the application to bare copper surface by controlling atmosphere in an effort prevent oxidation during sintering. Three different atmospheres were evaluated: 1) pure nitrogen (N <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> ); 2) with 1 vol% oxygen (1% O /N and...

The peak switching currents of two paralleled MOSFETs turned on/off by one gate driver could differ significantly owing to the mismatch in threshold voltages (Vth). passive balancing method described herein employs inductor and resistor per MOSFET force track with negligible penalty loss. Sensors, feedbacks, knowledge gate-related parameters (such as charge, polarity Vth difference, impedances, etc.) are not required. components designed using an inequality involving Vth, rise time,...

To increase power density and simplify the process of integrating magnetic components to electronics circuits, a commercial multiextruder paste-extrusion three-dimensional (3-D) printer was used both metal pastes into 3-D structures components. A magnetic-filled-benzocyclobutene composite, termed poly-mag paste, formulated as core feedstock for printer, nanosilver paste conductive winding printer. toroid inductor printed by using pastes, it cured at 250 °C half hour without any external...