Yaesuk Jeong

ORCID: 0000-0002-0971-4005
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About
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Research Areas
  • Advanced MEMS and NEMS Technologies
  • Acoustic Wave Resonator Technologies
  • Mechanical and Optical Resonators
  • Microwave Engineering and Waveguides
  • Non-Invasive Vital Sign Monitoring
  • Phonocardiography and Auscultation Techniques
  • ECG Monitoring and Analysis
  • Geophysics and Sensor Technology
  • Advanced Antenna and Metasurface Technologies
  • Vestibular and auditory disorders
  • Ultrasound Imaging and Elastography
  • Antenna Design and Analysis
  • Sensor Technology and Measurement Systems
  • Photonic and Optical Devices
  • Millimeter-Wave Propagation and Modeling
  • Electromagnetic Simulation and Numerical Methods
  • Speech and Audio Processing
  • Analog and Mixed-Signal Circuit Design
  • Tactile and Sensory Interactions
  • Indoor and Outdoor Localization Technologies
  • Radio Wave Propagation Studies

Panasonic (United States)
2017-2022

Georgia Institute of Technology
2010-2020

Yonsei University
2005-2010

Abstract Mechano-acoustic signals emanating from the heart and lungs contain valuable information about cardiopulmonary system. Unobtrusive wearable sensors capable of monitoring these longitudinally can detect early pathological signatures titrate care accordingly. Here, we present a wearable, hermetically-sealed high-precision vibration sensor that combines characteristics an accelerometer contact microphone to acquire wideband mechano-acoustic physiological signals, enable simultaneous...

10.1038/s41746-020-0225-7 article EN cc-by npj Digital Medicine 2020-02-12

This paper presents a novel size reduction technique for designing Butler matrix using new type of coupler. coupler is half the length conventional and has swapped port characteristic wherein locations isolation coupled ports are switched. These features make coupler, called "swapped coupler," effective reducing matrix. The behavior was mathematically analyzed, its design equation derived. Furthermore, proposed employed to miniaturized area this 70 × mm <sup...

10.1109/tmtt.2010.2041571 article EN IEEE Transactions on Microwave Theory and Techniques 2010-03-09

This paper reports on the design and characterization of a low-noise, wide-bandwidth, mode-matched bulk-acoustic wave (BAW) gyroscope operating in rotation-rate closed-loop configuration. The high Q (350,000), second-elliptical degenerate modes (4.84 MHz) vacuum-packaged (100) single-crystal silicon disk are interfaced with integrated electronics force-to-rebalance (FTR) architecture, achieving an angle white noise (AWN) 0.021 ″/√Hz, random walk (ARW) 0.017 °/√h, Allan deviation 0.25 °/h...

10.1109/inertial53425.2022.9787726 article EN 2022-05-08

This paper reports on the design, implementation and characterization of triaxial capacitive accelerometers operating in a low-pressure environment (~1 Torr). Small form-factor devices, with proof-mass area less than 1mm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> , were fabricated 40 μm-thick SOI substrate using HARPSS™ process to attain in-plane out-of-plane nanoscale airgaps (~300 nm). Increased sensitivity stable open-loop...

10.1109/memsys.2013.6474169 article EN 2013-01-01

This paper presents a nano-precision high aspect-ratio poly- and single-crystal silicon DRIE plus wet-etching fabrication platform, also known as HARPSS+, which enables single-chip integration wafer-level-packaging of robust high-frequency timing inertial sensors. The HARPSS+ platform is the first highly developed process providing scalable deep submicron gaps in vertical, horizontal, 54°-slanted orientations for efficient transduction dynamic control high-Q single crystalline resonators....

10.1109/plans.2018.8373389 article EN 2018-04-01

This paper reports on the design, fabrication, and characterization of wafer-level-packaged wide-bandwidth capacitive accelerometers with high aspect-ratio nanometer scale gaps utilizing sloped electrode configuration. Narrow defined by thickness a sacrificial layer provide an increased electromechanical coupling that enables designing sensors operational bandwidth (~15 kHz), while maintaining low-noise performance. Furthermore, sloping sense fingers, one can get larger traveling range for...

10.1109/jmems.2017.2744260 article EN Journal of Microelectromechanical Systems 2017-09-08

This paper presents the design and implementation of a process compensated CMOS temperature sensor that does not require any BJTs. CTAT PTAT sensors are based on temperature-dependent threshold voltage (V <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">TH</sub> ) designed to have same variation outputs subtracted suppress spread. Proposed is fabricated in TSMC 0.18um 2P6M measured results show less than an -1.8°C +0.9°C error over -40°C 85°C...

10.1109/iscas.2012.6271981 article EN 1993 IEEE International Symposium on Circuits and Systems 2012-05-01

This paper presents a single-chip timing and inertial measurement unit (TIMU) with high-frequency modematched gyroscopes, high-bandwidth accelerometers, high-Q bulk acoustic wave (BAW) resonator integrated on 4.5mm×5.5mm platform using the HARPSS+ process, which enables vertical, horizontal, 54°-slanted electrodes scalable nano-gaps. The TIMU is first IMU featuring 3-axis quadrature-compensated resonant (i.e. mode-matched) gyroscopes. gyroscopes have high shock vibration resistance present...

10.1109/memsys.2018.8346494 article EN 2018-01-01

This paper reports on the implementation and characterization of wafer-level-packaged accelerometer contact microphones having wide bandwidth (fres >10 kHz) low-noise (<100 µg√Hz) for use as auscultation devices in body-worn sensor arrays.By using capacitive accelerometers microphones, encapsulated can detect not only internal sounds from organs but also body motions down to DC frequency levels, significantly reducing size fabrication cost wearable technology health monitoring.The...

10.31438/trf.hh2018.9 article EN 1998 Solid-State, Actuators, and Microsystems Workshop Technical Digest 2018-05-21

This paper presents the design, fabrication, and characterization of a novel "hinge-shaped" out-of-plane differential accelerometer utilizing nanometer sensing gap (300 nm) electrodes. The increased electromechanical coupling provided by narrow allows design micro-g accelerometers with high resonant frequency (> 10 kHz), which would extend operational bandwidth as well input acceleration range compared to conventional devices. Furthermore, proposed provides an immunity against stiction...

10.1109/transducers.2017.7994496 article EN 2017-06-01

This paper reports on the design, fabrication and characterization of single proof-mass tri-axial capacitive accelerometers coexisting in a low-pressure environment with high-frequency gyroscopes, for implementation monolithic 6-degree-of-freedom inertial measurement units. The are designed to operate as quasi-static devices (i.e. non-resonant sensors) mid vacuum levels (1-10 Torr) by increasing squeeze-film air damping through use nano-gaps (<; 300 nm). Reduced die area is achieved...

10.1109/memsys.2014.6765565 article EN 2014-01-01

This paper presents a novel sloped electrode scheme to enable the implementation of shock stops in MEMS devices that use sacrificial layer define in-plane capacitive gaps. Since thickness grown or deposited on sidewall microstructure is constant, by sloping interdigitated fingers, one can get larger travelling range for proof-mass than layer. allows realization sensing gap stop without using additional photomasks fabrication steps. Proposed incorporated into accelerometer design with 270 nm...

10.1109/memsys.2017.7863618 article EN 2017-01-01

This paper presents the implementation and characterization of a single proof-mass wide-bandwidth pendulum accelerometer with fully-differential sensitivity in all three axes. The utilization nano-gap electrodes (300 nm) boosts electromechanical coupling significantly so that both increased high resonant frequency (f res > 15 kHz) can be attained, which extends operational bandwidth as well dynamic range device using miniaturized 450 × µm2. Furthermore, air-damping from structure enables...

10.1088/1361-6439/aadc7e article EN Journal of Micromechanics and Microengineering 2018-08-23

An interference-cancellation-based idle period downlink (IC-IPDL) method is proposed to improve hearing in mobile-positioning systems. While the IPDL ceases all transmissions serving base station during short intervals, IC-IPDL maintains common pilot channel (CPICH) an provide better stability wireless communication Instead, CPICH cancelled out a mobile by using interference-cancellation techniques. The performances of and are theoretically analyzed analyses verified through computer simulations.

10.1109/tvt.2004.838884 article EN IEEE Transactions on Vehicular Technology 2005-01-01

This paper presents a high-Q and high dynamic range timing inertial measurement unit chip (TIMU) fabricated in 3D nano-gap DRIE process wafer-level-packaged (WLP) using hermetic TSV interposer. The SOI-based fabrication platform enables integration of high-frequency resonator arrays with very Qs approaching 200,000 that are acoustically decoupled from one another exhibit no cross-talk. In-plane out-of-plane gyroscopic resonators dynamically tuned to form tri-axial Coriolis gyroscopes...

10.1109/cicc.2019.8780183 article EN 2022 IEEE Custom Integrated Circuits Conference (CICC) 2019-04-01

A dual-axis single-proof-mass angular accelerometer has been developed for a vestibular prosthesis. Designed to sense head rotations both in the yaw and pitch planes, output of inertial sensor may be coded as amplitude or rate modulated biphasic current pulses stimulate nerves. Fabricated with high aspect ratio commercial process, small form factor (1.4 mm × 0.8 mm) is achieved scale 95.5 μV/rad/sec2 145.8 respectively. Superior linear acceleration rejection was demonstrated rotating axis,...

10.1109/embc.2016.7591775 article EN 2016-08-01

An antenna array using in-package bondwire to perform beamforming for 60 GHz applications is presented. 1 mil gold designed resonate at was employed as an provide smaller area and a cheaper way manufacture it. The overall size of the on CMOS chip 1×3 mm2 its radiation pattern shows fair agreement with simulation results.

10.1049/el.2010.1133 article EN Electronics Letters 2010-07-21

This letter focuses on addressing the comments made by Park. Additional derivation, as well simulation were performed and presented accordingly to answer claims from Furthermore, proposed swapped port coupler design using a different coupling factor than Park was carefully examined assessed.

10.1109/tmtt.2014.2326840 article EN IEEE Transactions on Microwave Theory and Techniques 2014-06-04
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