A5078840676- Radiation Detection and Scintillator Technologies
- Dark Matter and Cosmic Phenomena
- Atomic and Subatomic Physics Research
- Superconducting and THz Device Technology
- Particle Detector Development and Performance
- 3D IC and TSV technologies
- Advanced MEMS and NEMS Technologies
- Electronic Packaging and Soldering Technologies
- Photocathodes and Microchannel Plates
Institute of Microelectronics
2020-2023
University of Chinese Academy of Sciences
2023
Chinese Academy of Sciences
2020-2022
University of South Dakota
2020
It is of great importance to develop a photodetector system with an ultralow radioactivity background in rare event searches. Silicon photomultipliers (SiPMs) and application-specific integrated circuits (ASICs) are two ideal candidates for low photosensors readout electronics, respectively, because they mainly composed silicon, which can achieve good radio-purity without considerable extra effort. However, interposers, used provide mechanical support signal routes between the photosensor...
Purpose A large-scale detection system with more data in short time bins, small dead space and signal identification is the ideology scientists pursuing. These proposed demands are able to be solved by 2.5 D integration. The substance of a integration called silicon interposer, which consists through via (TSV) redistribution layer. However, state-of-the-art interposer not sustain its own mechanical strength detector/readout array often sitting as standalone large science facilities fails...