Jianbing Xie

ORCID: 0000-0002-2289-2076
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About
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Research Areas
  • Advanced MEMS and NEMS Technologies
  • Mechanical and Optical Resonators
  • Acoustic Wave Resonator Technologies
  • Advanced Fiber Optic Sensors
  • Photonic and Optical Devices
  • Tactile and Sensory Interactions
  • Geophysics and Sensor Technology
  • Advanced Sensor and Energy Harvesting Materials
  • Force Microscopy Techniques and Applications
  • Model Reduction and Neural Networks
  • Electromagnetic Simulation and Numerical Methods
  • Icing and De-icing Technologies
  • Numerical methods for differential equations
  • Conducting polymers and applications
  • Advanced Surface Polishing Techniques
  • Innovative Energy Harvesting Technologies
  • Energy Harvesting in Wireless Networks
  • Smart Materials for Construction
  • Spacecraft Design and Technology
  • Magnetic Bearings and Levitation Dynamics
  • Gas Dynamics and Kinetic Theory
  • Plasma Diagnostics and Applications
  • Microwave Engineering and Waveguides
  • Rocket and propulsion systems research
  • Microwave and Dielectric Measurement Techniques

Northwestern Polytechnical University
2015-2024

University of Central Florida
2019

Multidisciplinary Digital Publishing Institute (Switzerland)
2019

Georgia Institute of Technology
2019

Yonsei University
2019

Henry Ford Health System
2019

Korea Institute of Industrial Technology
2019

Shandong University of Science and Technology
2019

Ministry of Education of the People's Republic of China
2019

Research & Development Institute
2018

This paper reports a three degree-offreedom (3DoF) microelectromechanical systems (MEMS) resonant sensing device consisting of weakly coupled resonators with enhanced sensitivity to stiffness change.If one resonator the system is perturbed by an external stimulus, mode localization occurs, which can be detected change modal amplitude ratio.The perturbation be, for example, in resonator.A detailed theoretical investigation revealed that aliasing effect, along thermal noise floor sensor and...

10.1109/jmems.2015.2490204 article EN Journal of Microelectromechanical Systems 2015-10-28

This paper proposes and verifies a structure for the isolation of packaging stress in silicon-on-insulator-based microelectromechanical systems devices. The packaging-stress resides on handle layer consists circular disk, eight elastic beams, support frame. disk is located center die occupies less than 5% handle-layer area; this can reduce avoid uneven distribution. beams are L-shaped symmetrically distributed to decouple deformation from frame suppress evenly. in-plane out-of-plane induced...

10.1109/jsen.2016.2646723 article EN IEEE Sensors Journal 2016-12-30

This paper systematically investigates the characteristics of different output metrics for a weakly coupled three degree-of-freedom microelectromechanical systems resonant sensor. The key figures-of-merit examined are sensitivity and linear range. four main investigated mode frequency shift, amplitude difference, ratio, eigenstate shift. It is shown from theoretical considerations, equivalent RLC circuit model simulations electrical measurements, that there strong tradeoff between For...

10.1109/jmems.2016.2580529 article EN Journal of Microelectromechanical Systems 2016-06-28

Icing has always been a problem for the aviation industry and UAV sector. Small accurate icing sensors can ensure safety of critical parts aircraft small UAVs in flight. This paper presents an Interdigital-complementary split-ring resonator sensor (ICSRR) that distinguish water ice with high accuracy measure thickness ice. Compared traditional CSRR structure, added Interdigital structure more sensitively. The detects based on change resonant frequency measured scattering parameter S21...

10.1109/jsen.2022.3176932 article EN IEEE Sensors Journal 2022-05-23

A reduced micromachined inertial measurement unit (MIMU) was fabricated by a proposed two-step release silicon-on-insulator (SOI) process to meet the requirements of land vehicle navigation. The consists two steps, that is, dry using notching effect and wet hydrogen fluoride (HF) solution. By applying presented layout design rules, most area device released in dry-etching process, but boundaries proof mass suspension beams were not until etching. Through such configuration, smooth surface...

10.1049/mnl.2011.0120 article EN Micro & Nano Letters 2011-07-31

This paper describes the development and experimental evaluation of a microelectromechanical system vibratory gyroscope using an optimized double closed-loop control strategy. An automatic gain self-oscillation interface is used to resonate in drive mode; sense mode controlled by sixth-order continuous-time force-feedback band-pass sigma-delta modulator. The parameters both loops are genetic algorithm (GA). System level simulations show that settling time 125 ms, root mean square...

10.1109/jsen.2013.2271586 article EN IEEE Sensors Journal 2013-06-27

This paper reports on a novel MEMS resonant sensing device consisting of three weakly coupled resonators that can achieve an order magnitude improvement in sensitivity to stiffness change, compared current state-of-the-art resonator sensors with similar size and frequency. In 3 degree-of-freedom (DoF) system, if external stimulus causes change the spring one resonator, mode localization occurs, leading drastic shape, which be detected by measuring modal amplitude ratio change. A 49 times...

10.1109/memsys.2015.7051100 article EN 2015-01-01

In this paper, a parameterized reduced model of vibratory microelectromechanical systems (MEMS) gyroscope is established using parametric order reduction algorithm. the process, not only input angular velocity, material density, Young's modulus, and Rayleigh damping coefficient but also thermal expansion change in temperature were all preserved. Based on model, integrated behavior simulation MEMS gyroscope, including many environmental factors engineering situations, was performed an...

10.1109/jmems.2009.2038284 article EN Journal of Microelectromechanical Systems 2010-01-22

A simple, low-cost and reliable dicing-free silicon-on-insulator (SOI) process is presented for solving three major challenges in manufacturing the microelectromechanical systems devices, i.e. stiction, notching dicing damage. In this process, cavity used patterned on handle layer to solve stiction problem, exposed oxide removed hydrofluoric acid (HF) solution before deep reactive ion etching (DRIE) structure eliminate effect's impact. The dies are attached temporally a designed frame by...

10.1049/mnl.2016.0342 article EN Micro & Nano Letters 2016-08-19

This paper, for the first time, investigates characteristics of different output metrics a three degree-of-freedom (DoF) coupled resonator sensor. The main aspects examined are sensitivity and linear range. It is shown from theoretical estimations, equivalent RLC circuit model simulations electrical measurements that using vibration amplitude ratio as an signal provides improved linearity range, compared to other methods such shift in eigenstate, mode frequency or difference.

10.1109/transducers.2015.7181396 article EN 2015-06-01

This article reports a MEMS disk resonator gyroscope (DRG) with superior overall performance in terms of bias instability, measurement range, and size. Specifically, fully filled electrodes DRG is proposed to improve sensing capacitance 23.66 pF drive 6.14 pF. The fabricated using wafer-level vacuum-package process controlled sensed by configurable ASIC, enabling small footprint. achieves an angle random walk 0.05°/√h instability 0.42°/h within full scale ±300°/s, making it very promising...

10.1109/tie.2021.3078375 article EN IEEE Transactions on Industrial Electronics 2021-05-13

This paper reports on a 3-DoF mode localization resonant sensor experimentally evaluated under atmospheric conditions. It was demonstrated that using amplitude ratio as an output signal, even when the device is operated in air, yields higher sensitivity compared to frequency variation assuming vacuum

10.1109/transducers.2015.7181140 article EN 2015-06-01

In this paper, a flexible and stretchable energy harvester based on liquid-metal fluorinated ethylene propylene (FEP) electret films is proposed implemented for the application of wearable devices. A gallium alloy with melting point 25.0 °C used to form electrode; therefore, inducted will have excellent flexibility stretchability. The solid-state electrode wrapped in dragon-skin silicone rubber shell then bonded FEP film conductive harvester. Then, open-circuit voltage designed tested...

10.3390/s20020458 article EN cc-by Sensors 2020-01-14

This paper presents a dicing-free process for silicon-on-insulator (SOI) microelectromechanical systems (MEMS). In the process, lag effect in deep reactive ion etching (DRIE) is used to form breaking trenches. backside DRIE, wide cavities are etched down buried oxide layer. The narrow trenches, contrast, not Therefore, trench can be break wafer after entire process; addition, handle layer still act as bracing structure before 'breaking'. Finally, device patterned, and DRIE step MEMS devices....

10.1088/0960-1317/23/12/125033 article EN Journal of Micromechanics and Microengineering 2013-11-14

This paper reports a tri-axis vortex convective gyroscope, in which type of suspended silicon thermistor arch shape is proposed to reduce the thermal-induced stress, heat dissipation substrate. The structure reduced stress up 86% as compared with clamped-clamped our previous work. experimental test results showed that sensitivities sensor for X-axis, Y-axis and Z-axis gyroscope were 0.642mV/°/s, 0.528mV/°/s 0.241mV/°/s, respectively. sensitivity improvement reached 49.65%, 56.21% 51.57% each...

10.1109/icsens.2013.6688239 article EN IEEE Sensors 2013-11-01

Analysing and minimizing energy loss is crucial for high performance disk resonator gyroscopes (DRGs). Generally, the primary mechanism vacuum packaged microelectromechanical system (MEMS) resonators includes thermoelastic damping, anchor loss, electronic damping. In this paper, damping our DRG design are calculated by combining finite element analysis theoretical derivation. Thermoelastic dominant contributes over 90% of total dissipated energy. Benefiting from a symmetrical structure, low...

10.3390/mi10080493 article EN cc-by Micromachines 2019-07-24

Many researchers have studied the miniaturization of hemisphere resonator gyroscope for decades. The (HSR), as core component, has a size that been reduced to submillimeter level. We developed method batch production micro-hemisphere shell resonators based on glass-blowing process obtain larger shells with higher ratio height diameter (H/D), we introduced chemical foaming (CFP) and acquired an optimized shell; contrasted improved H/D are 0.61 0.80, respectively. Finally, increased volume...

10.3390/mi9020042 article EN cc-by Micromachines 2018-01-24

A novel design of a microelectromechanical systems (MEMS) control moment gyroscope (MCMG) was proposed in this paper order to generate torque output with magnitude 10-6 N∙m. The MCMG consists two orthogonal angular vibration systems, i.e., the rotor and gimbal; coupling between which is based on Coriolis effect will cause direction perpendicular vibrations. excited by in-plane electrostatic rotary comb actuators, while gimbal driven an out-of-plane parallel plate actuator. possible process...

10.3390/s100404130 article EN cc-by Sensors 2010-04-26
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