- Force Microscopy Techniques and Applications
- Advanced MEMS and NEMS Technologies
- Mechanical and Optical Resonators
- Photonic and Optical Devices
- Near-Field Optical Microscopy
- Integrated Circuits and Semiconductor Failure Analysis
- Nanofabrication and Lithography Techniques
- Photorefractive and Nonlinear Optics
- Advancements in Photolithography Techniques
- Semiconductor materials and devices
- Advanced Fiber Laser Technologies
- Semiconductor Lasers and Optical Devices
- Electrowetting and Microfluidic Technologies
- 3D IC and TSV technologies
- Nanowire Synthesis and Applications
- Optical Coatings and Gratings
- Microwave Engineering and Waveguides
- Adhesion, Friction, and Surface Interactions
- Terahertz technology and applications
- Acoustic Wave Resonator Technologies
- Electron and X-Ray Spectroscopy Techniques
- Molecular Junctions and Nanostructures
- Advanced Surface Polishing Techniques
- Superconducting and THz Device Technology
- Semiconductor materials and interfaces
Swiss Center for Electronics and Microtechnology (Switzerland)
2014-2025
IBM (United States)
2003-2014
IBM Research - Zurich
2004-2013
University of Patras
2003
University of Basel
1995-1996
University of Neuchâtel
1996
École Polytechnique Fédérale de Lausanne
1993
This paper describes the characterization of a home-made negative photoresist developed by IBM. resist, called SU-8, can be produced with commercially available materials. Three blends were prepared for this article and some its optical mechanical properties are presented. One numerous advantages is broad range thicknesses which obtained in one spin: from 750 nm to conventional spin coater. The resist exposed standard UV aligner has an outstanding aspect ratio near 15 lines 10 trenches....
Present a new scanning-probe-based data-storage concept called the "millipede" that combines ultrahigh density, terabit capacity, small form factor, and high data rate. Ultrahigh storage density has been demonstrated by thermomechanical local-probe technique to store, read back, erase in very thin polymer films. With this technique, nanometer-sized bit indentations pitch sizes have made single cantilever/tip into layers, resulting densities of up 1 Tb/in/sup 2/. High rates are achieved...
We report on a new atomic force microscope (AFM)-based data storage concept called the “Millipede” that has potentially ultrahigh density, terabit capacity, small form factor, and high rate. Its potential for density been demonstrated by thermomechanical local-probe technique to store read back in very thin polymer films. With this technique, 30–40-nm-sized bit indentations of similar pitch size have made single cantilever/tip (50-nm) polymethylmethacrylate (PMMA) layer, resulting 400–500...
For patterning organic resists, optical and electron beam lithography are the most established methods; however, at resolutions below 30 nanometers, inherent problems result from unwanted exposure of resist in nearby areas. We present a scanning probe method based on local desorption glassy by heatable probe. demonstrate half pitch down to 15 nanometers without proximity corrections with throughputs approaching those Gaussian similar resolution. These patterns can be transferred other...
We report a simple atomic force microscopy-based concept for hard disk-like data storage technology. Thermomechanical writing by heating Si cantilever in contact with spinning polycarbonate disk has already been reported. Here the medium replaced thin polymer layer on substrate, resulting significant improvements density. With this new medium, we achieve bit sizes of 10–50 nm, leading to densities 500 Gbit/in.2. also demonstrate novel high-speed and high-resolution thermal readback method,...
Ultrahigh storage densities of up to 1 Tb/in./sup 2/ or more can be achieved by using local-probe techniques write, read back, and erase data in very thin polymer films. The thermomechanical scanning-probe-based data-storage concept called Millipede combines ultrahigh density, small form factor, high rate. After illustrating the principles operation Millipede, a channel model for analysis readback process is introduced, analytical results are compared with experimental data. Furthermore,...
Heat conduction governs the ultimate writing and reading capabilities of a thermomechanical data storage device. This work investigates transient heat in resistively heated atomic force microscope cantilever through measurement simulation thermal electrical behavior. The time required to single bit-writing temperature is near 1 μs sensitivity ΔR/R 1×10−4 per vertical nm. Finite-difference results compare well with measurements during reading, indicating design tradeoffs power requirements,...
Sequential position readout from a microfabricated array of eight cantilever-type sensors (silicon technology) is demonstrated. In comparison with single we find that mechanical disturbances noise, such as vibrations, turbulent gas flow, or abrupt pressure changes, can be effectively removed in by recording difference signals respect to reference cantilevers. We demonstrate chemically specific responses extracted noisy environment using sensor detect chemical interactions and an uncoated...
Ultrahigh storage densities can be achieved by using a thermomechanical scanning-probe-based data-storage approach to write, read back, and erase data in very thin polymer films. High rates are parallel operation of large two-dimensional arrays cantilevers that batch fabricated silicon-surface micromachining techniques. The high precision required navigate the medium relative array probes is microelectromechanical system (MEMS)-based x y actuators. ultrahigh offered probe-storage devices...
We evaluated the potential and limitations of resonating nanomechanical microcantilevers for detection mass adsorption. As a test system we used addition gold layers varying thickness. Our main findings are: (1) A linear increase in sensitivity with square mode number—a two orders magnitude is obtained from 1 to 7 minimum 8.6 ag Hz−1 µm−2 resolution 0.43 pg at µm thick cantilever. (2) The quality factor increases number, thus helping achieve higher sensitivity. (3) effective spring constant...
In thermomechanical data writing, a resistively-heated atomic force microscope (AFM) cantilever tip forms indentations in thin polymer film. The same operates as thermal proximity sensor to detect the presence of previously written bits. This paper uses recent progress analysis writing and reading modes develop new designs for increased speed, sensitivity, reduced power consumption both operation. Measurements electrical resistance during heating reveals physical limits reading, verifies...
Detailed investigations of the limits a new negative-tone near-UV resist (IBM SU-8) have been performed. SU-8 is an epoxy-based designed specifically for ultrathick, high-aspect-ratio MEMS-type applications. We demonstrated that with single-layer coatings, thicknesses more than 500 /spl mu/m can be achieved reproducibly. Thicker layers made by multiple and we exposures in 1200-/spl mu/m-thick, double coated layers. found aspect ratio (400 nm) exposed developed structures greater 18 remains...
Structural variability and flexibility are crucial factors for biomolecular function. Here we have reduced the invasiness enhanced spatial resolution of atomic force microscopy (AFM) to visualize, first time, different structural conformations two polynucleotide strands in DNA double helix, single molecules under near-physiological conditions. This is achieved by identifying tracking anomalous resonance behavior nanoscale AFM cantilevers immediate vicinity sample.
Thermal scanning probe lithography is used for creating lithographic patterns with 27.5 nm half-pitch line density in a 50 thick high carbon content organic resist on Si substrate. The as-written the poly phthaladehyde thermal layer have depth of 8 nm, and they are transformed into high-aspect ratio binary using SiO2 hard-mask thickness merely 4 sequence selective reactive ion etching steps. Using this process, line-edge roughness after transfer 2.7 (3σ) has been achieved. also transferred...
A new probe made entirely of plastic material has been developed for scanning microscopy. Using a polymer the cantilever facilitates realization mechanical properties that are difficult to achieve with classical silicon technology. The and tip presented here an epoxy-based photoplastic. fabrication process is simple batch in which integrated lever defined one photolithography step. simplicity step, use as material, ability reuse mold lead soft low-cost force Imaging condensed matter...
A novel micromachined silicon displacement sensor based on the conduction of heat between two surfaces through ambient air is described. resolution less than 1 nm and a dynamic range more 100 µm was achieved in 10 kHz bandwidth. To minimize drift, sensors are operated pairs, using differential measurement configuration. The power consumption these devices order mW per sensor, measured time response described by simple exponential with constant approximately µs.
We describe a planar microelectromechanical systems (MEMS)-based x/y nanopositioner designed for parallel-probe storage applications. The is actuated electromagnetically and has motion capabilities of plusmn60 mum. mechanical components are fabricated from single-crystal silicon wafer using deep-trench-etching process. To render the system robust against vibration, we utilize mass-balancing concept that makes stiff linear shock, but still compliant actuation, therefore results in low power...
Scanning probe nanolithography (SPL) has demonstrated its potential in a variety of applications like 3D nanopatterning, 'direct development' lithography, dip-pen deposition or patterning self-assembled monolayers. One the main issues holding back SPL been limited throughput for and imaging. Here we present complete lithography metrology system based on thermomechanical writing into organic resists. Metrology is carried out using thermoelectric topography sensing method. More specifically,...